Special Section Guest Editorial Research Articles

Special Section Guest Editorial: Satellite Remote Sensing for Disaster Monitoring and Risk Assessment, Management, and Mitigation

The <i>Journal of Applied Remote Sensing</i> (JARS) is an online journal that optimizes the communication of concepts, information, and progress within the remote sensing community to improve the societal benefit for monitoring and management of natural disasters, weather forecasting, agricultural and urban land-use planning, environmental quality monitoring, ecological restoration, and numerous other commercial and scientific applications.

Guest Editorial Special Section on the 2020 International Symposium on Semiconductor Manufacturing

Since its beginning in 1992 in Japan, International Symposium on Semiconductor Manufacturing (ISSM) has provided unique opportunities to share the best practices of semiconductor manufacturing technologies for professionals. At the symposiums, semiconductor manufacturing professionals discussed the technologies developed to meet the worldwide requirements for advanced manufacturing. It is becoming crucial to re-examine semiconductor manufacturing in terms of fundamental principles to improve the performance of semiconductor devices. Moreover, utilizing artificial intelligence and machine learning technologies to improve semiconductor manufacturing have become a new challenge. These manufacturing technology challenges are showing the need for drastic revolutionary concept and stronger collaborative efforts to find solutions to the precompetitive challenges.

Guest Editorial Special Section on the IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)

This special section of IEEE Transactions on Semiconductor Manufacturing presents extended versions of papers originally presented as part of the IEEE 33 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rd</sup> International Conference on Microelectronic Test Structures (ICMTS) which was hosted at the University of Edinburgh, Scotland. Originally planned to take place at the University’s South Hall Complex in April 2020, the impact of the global pandemic led to the difficult decision to move to a fully virtual conference held between 4 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sup> – 18 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sup> May 2020. The guest editors for this special section, who were honoured to act as the General Chair and Technical Chair of the conference, would like to thank all of those involved in making the virtual conference a success, not least the digital events team from the IEEE who made it possible.

Guest Editorial Special Section on BioRob 2020

The 8 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sup> IEEE International Conference on Biomedical Robotics and Biomechatronics (BioRob) was held virtually in New York City, organized by Columbia University, from November 29 – December 1, 2020 due to the pandemic. A total of 200 scientific papers were presented at the conference by authors from over 24 countries. Based on the reviewer scores of each submitted paper, 12 papers were selected by the conference editorial board to compete for the Best Paper awards in three different categories. The authors of each of these 12 papers were invited to submit an extended version of their papers for possible publication in a BioRob2020 Special Section of the Journal IEEE Transactions on Medical Robotics and Bionics (T-MRB). A total of 8 papers were submitted by the authors to the journal which went through the full peer review process involving two guest editors. The BioRob 2020 Special Section of T-MRB includes 4 papers accepted for publication by the journal.

Special Section Guest Editorial: Image and Video Compression Using Deep Neural Networks

The <i>Journal of Electronic Imaging</i> (JEI), copublished bimonthly with the Society for Imaging Science and Technology, publishes peer-reviewed papers that cover research and applications in all areas of electronic imaging science and technology.

Special Section Guest Editorial: Radiogenomics in Prognosis and Treatment.

.The editorial introduces the Special Section on Radiogenomics in Prognosis and Treatment for Volume 8 Issue 3 of the Journal of Medical Imaging.

Special Section Guest Editorial: Introducing the Special Series on Radiative Cooling

Guest editors Aaswath Raman, Xiaobo Yin, and Peter Bermel introduce the Special Series on Radiative Cooling.

Special Section Guest Editorial: Recent Advances in Lens Design and Optical Engineering

The guest editors introduce the Special Section on Recent Advances in Lens Design and Optical Engineering.

Special Section Guest Editorial: Advances in Terahertz and Infrared Optoelectronics

The guest editors summarize the Special Section on Advances in Terahertz and Infrared Optoelectronics.

Special Section Guest Editorial: Advances in Urban Imaging and Applications

The <i>Journal of Electronic Imaging</i> (JEI), copublished bimonthly with the Society for Imaging Science and Technology, publishes peer-reviewed papers that cover research and applications in all areas of electronic imaging science and technology.

Special Section Guest Editorial: Perceptually Optimized Imaging

The <i>Journal of Electronic Imaging</i> (JEI), copublished bimonthly with the Society for Imaging Science and Technology, publishes peer-reviewed papers that cover research and applications in all areas of electronic imaging science and technology.

Guest Editorial Special Section on IEEE ICECS 2020

This special Section contains extended versions of papers presented at the IEEE International Conference on Electronics, Circuits and Systems (ICECS) in November 2020. The IEEE ICECS 2020 was the first edition to be held in fully virtual form. The authors of the focus papers presented at the conference were invited to submit extended versions of their works to this OJCAS Special Section and after a rigorous review process, four of these submissions were selected to be included in this Special Section. All submissions were evaluated by experts in each respective field, with at least three revisions. The selected works cover an ample spectrum of state-of-the-art research in the Circuits and Systems area, including Analog and Mixed Circuits, Micro Electromechanical Systems, Quantum Computers, and Video Coding. These four published works are authored by researchers from Brazil, France, Ireland, Italy, and Spain and represent the plurality of high-quality works annually presented at IEEE ICECS. These four papers perfectly fit with the OJCAS scope and are of interest for many researchers in the CAS community. The first two papers are review papers on two cutting-edge technologies of information processing: quantum information and video signal processing. The two other papers address selected topics in the field of embedded sensors in MEMS technologies.

Guest Editorial Special Section on 2019 IEEE International Conference on Automation Science and Engineering

The 15th annual IEEE International Conference on Automation Science and Engineering (CASE 2019) was held on August 22–26, 2019, at The University of British Columbia, Vancouver, BC, Canada. IEEE CASE represents the flagship automation conference of the IEEE Robotics and Automation Society and constitutes the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.

Guest Editorial Special Section on Hybrid Human-Artificial Intelligence for Multimedia Computing

The papers in this special section focus on hybrid human-artificial intelligene (AI) for multimedia computing. Multimedia computing has experienced a tremendous growth in the last decades, with applications ranging from multimedia information retrieval and analysis to multimedia compression and communication. However, the increasing volume and complexity of multimedia data driven by the large-scale spread of various new devices and sensors is posing a serious challenge to traditional multimedia computing algorithms. Artificial intelligence (AI), in particular deep learning techniques, has improved the performance of multimedia computing algorithms for many tasks, including computer vision and natural language processing. But unlike humans, AI is poor at solving tasks across multiple domains or in dealing with an uncontrolled dynamic environment. Hybrid Human-Artificial Intelligence (HH-AI) is an emerging field that aims at combining the benefits of human intelligence, such as semantic association, inference, and generalization with the computing power of AI.

Guest Editorial Special Section From the Selected Extended Papers Presented at the CAD-TFT 2020

This Special Section follows from a selection of highly-rated, high impact technical papers presented at the 11th International Conference on Computer-Aided Design for Thin Film Transistor Technologies (CAD-TFT) 2020. The CAD-TFT 2020 was held as a virtual conference on November 10th and 11th, 2020 from the operations center at Tianjin, China. The pre-conference virtual presentations on November 9th, 2020 included six tutorials from internationally recognized experts in their technical fields as well as six posters from China, India, and Canada.

Guest Editorial Special Section on IEEE ICME 2020

This special section contains extended versions of papers presented at the IEEE International Conference on Multimedia & Expo (ICME) in London, July 2020. The invitations to contribute to the special section were based on the quality of the conference paper and its relevance to the aims and scope of the journal. Each submitted manuscript was reviewed by at least three anonymous reviewers. After a rigorous review process, three papers were accepted. Two of them present new developments in immersive media, while the third deals with the problem of efficiently encoding a deep neural network.

Guest Editorial Special Section for ICSMD2020

Guest Editorial Special Section for ICSMD2020

Special Section Guest Editorial: Get WIRED!

Guest editors Zakya Kafafi and Monica Lira-Cantu introduce the Special Section Celebrating Women in Renewable Energy (WiRE).

Guest Editorial Special Section on the 2020 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH)

It is a special pleasure to be able to present IEEE T ransactions on S emiconductor M anufacturing readers with a selection of papers from the 2020 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH). This has been an extraordinarily challenging year by almost any measure, with personal and business disruptions on a dramatic scale worldwide. However, progress in advancing the manufacturing of compound semiconductor devices continues unabated, and through this Special Section I hope to provide a window into some recent areas of progress. Under more normal circumstances, the CS-MANTECH conference is an annual event that provides a technical forum for presenting advancements in compound semiconductor devices. CS-MANTECH is unique in its strong emphasis on manufacturing technologies related to compound semiconductor device production. This year, however, the global COVID-19 pandemic made holding an international conference impossible. While we could not hold the conference as originally planned, authors still prepared high-quality papers reporting their advances in compound semiconductor devices and associated manufacturing technologies. The full conference program proceedings for the 2020 conference are available online at https://csmantech.org/digests .

Guest Editorial Special Section—Papers From the 2019 MASM/WSC Conference

The 2019 International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2019) was part of the 2019 Winter Simulation Conference (WSC) that was held December 8–11 in National Harbor, MD, USA. The MASM conferences provide a forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modeling and analysis of complex high-tech manufacturing systems. While the papers from MASM conferences are of high quality and are often cited in journal papers, they are limited in size. As a premier journal for topics covered in the MASM conferences, IEEE T ransactions on S emiconductor M anufacturing , agreed to consider extended article submissions based on the 21 papers accepted and presented at the MASM 2019 conference for a Special Section of an upcoming issue of the journal. were sessions on Scheduling and Dispatching, Fab Scheduling, Maintenance and Engineering, Capacity and Production Planning, Qualification and Wafer-to-Order Allocation, Semiconductor Manufacturing Models, and Semiconductor Modeling Representations. Dr. Sabine Herlitschka, Chief Executive Officer and Chief Technology Officer of Infineon Technologies Austria AG, gave an excellent keynote talk titled “A European View on Future Semiconductor Industry Needs for MASM.” An archive of the MASM 2019 papers can be found at https://informs-sim.org/wsc19papers/by_area.html .