Solution-processed Metal Oxide Thin-film Transistors Research Articles

In Situ Radiation Hardness Study of Amorphous Zn-In-Sn-O Thin-Film Transistors with Structural Plasticity and Defect Tolerance.

Solution-processed metal-oxide thin-film transistors (TFTs) with different metal compositions are investigated for ex situ and in situ radiation hardness experiments against ionizing radiation exposure. The synergetic combination of structural plasticity of Zn, defect tolerance of Sn, and high electron mobility of In identifies amorphous zinc-indium-tin oxide (Zn-In-Sn-O or ZITO) as an optimal radiation-resistant channel layer of TFTs. The ZITO with an elemental blending ratio of 4:1:1 for Zn/In/Sn exhibits superior ex situ radiation resistance compared to In-Ga-Zn-O, Ga-Sn-O, Ga-In-Sn-O, and Ga-Sn-Zn-O. Based on the in situ irradiation results, where a negative threshold voltage shifts and a mobility increase as well as both off current and leakage current increase are observed, three factors are proposed for the degradation mechanisms: (i) increase of channel conductivity, (ii) interface-trapped and dielectric-trapped charge buildup, and (iii) trap-assisted tunneling in the dielectric. Finally, in situ radiation-hard oxide-based TFTs are demonstrated by employing a radiation-resistant ZITO channel, a thin dielectric (50 nm SiO2), and a passivation layer (PCBM for ambient exposure), which exhibit excellent stability with an electron mobility of ∼10 cm2/V s and aΔVth of <3 V under real-time (15 kGy/h) gamma-ray irradiation in an ambient atmosphere.

Detection of acetone vapours using solution-processed tin oxide thin-film transistors

Abnormal concentrations of volatile organic compounds (VOCs) in human breathe can be used as disease-specific biomarkers for the non-invasive diagnosis of medical conditions, such as acetone for diabetes. Solution-processed bottom gate top contact metal oxide thin-film transistors (TFTs) are used to detect acetone vapours, as part of a proof-of-concept study. The effect of increasing annealing temperature (T) and channel length (L) on electrical and sensing performance are explored. Drain current (Ids) increases following exposure as acetone undergoes a redox reaction with the adsorbed oxygen species on the semiconductor surface, which results in free electrons being released back into the conduction band. Responsivity (R) is maximized at negative bias (Vgs < 0). For L = 50 μm, the peak R of the TFT annealed at 450 °C is three times greater than that of the TFT annealed at 350 °C, with Vgs = − 37.5 V and − 33 V, respectively.Graphical abstract

Readily Accessible Metallic Micro-Island Arrays for High-Performance Metal Oxide Thin-Film Transistors.

Thin-film transistors using metal oxide semiconductors are essential in many unconventional electronic devices. Nevertheless, further advances will be necessary to broaden their technological appeal. Here, a new strategy is reported to achieve high-performance solution-processed metal oxide thin-film transistors (MOTFTs) by introducing a metallic micro-island array (M-MIA) on top of the MO back channel, where the MO is a-IGZO (amorphous indium-gallium-zinc-oxide). Here Al-MIAs are fabricated using honeycomb cinnamate cellulose films, created by a scalable breath-figure method, as a shadow mask. For IGZO TFTs, the electron mobility (µe ) increases from ≈3.6 cm2 V-1 s-1 to near 15.6 cm2 V-1 s-1 for optimal Al-MIA dimension/coverage of 1.25 µm/51%. The Al-MIA IGZO TFT performance is superior to that of controls using compact/planar Al layers (Al-PL TFTs) and Au-MIAs with the same channel coverage. Kelvin probe force microscopy and technology computer-aided design simulations reveal that charge transfer occurs between the Al and the IGZO channel which is optimized for specific Al-MIA dimensions/surface channel coverages. Furthermore, such Al-MIA IGZO TFTs with a high-k fluoride-doped alumina dielectric exhibit a maximum µe of >50.2 cm2 V-1 s-1 . This is the first demonstration of a micro-structured MO semiconductor heterojunction with submicrometer resolution metallic arrays for enhanced transistor performance and broad applicability to other devices.

Optimization of Dual-Fuel Combustion Synthesis for Rapid Formation of Solution-Processed Metal-Oxide Thin-Film Transistors

Solution processing of metal-oxide semiconductors has received significant attention in various fields of electronics owing to its advantages such as simple fabrication process, large-area scalability, and facile stoichiometric tunability. However, the conventional sol–gel route requires a relatively long annealing time to obtain a low-defect film with high density and sufficient amount of metal–oxygen–metal bonding state, which prevents implementation in cost-effective continuous manufacturing. Here, we report rapid formation of solution-processed oxide semiconductors by employing a dual-fuel-based solution combustion synthesis route. In particular, by optimizing the ratio of dual fuels of acetylacetone and 1,1,1-trifluoro-acetylacetone (molar ratio of 7:3), high-performance indium–gallium–zinc oxide (IGZO) thin-film transistors (TFTs) could be fabricated at 350 °C with the annealing time as short as 5 min (In:Ga:Zn = 0.68:0.1:0.22). Based on spectroscopic analysis, it was found that the dual fuels enabled rapid formation of the metal–oxygen–metal lattice structure with low defective oxygen bonding states. The IGZO TFTs fabricated with an optimized fuel ratio exhibited average field-effect mobilities of 1.11 and 3.69 cm2 V–1 s–1 with annealing times of 5 and 20 min, respectively (averaged in 9∼12 devices). Also, in the case of the 5 min annealed device, the threshold voltage was −0.48 ± 1.96 V, showing enhancement-mode operation. Furthermore, the device showed good stability against both positive gate bias stress and negative gate bias stress conditions with small threshold voltage shifts of −1.28 and – 1.28 V in 5760 s, respectively.

ZrHfO2-PMMA hybrid dielectric layers for high-performance all solution-processed In2O3-based TFTs

Recently inorganic-organic hybrid materials have been quickly arisen as promising dielectric candidates for their applications in the fabrication of solution-processed metal oxide thin-film transistors (TFTs). Based on this, we demonstrate a novel mixed metal oxide hybrid dielectric layer of zirconium hafnium oxide-poly(methylmethacrylate) (ZrHfO2-PMMA) thin films were effectively delivered by simple solution-process by using a low-cost spin coating process at a low temperature of 200 °C. To distinguish the chemical bonding states between inorganic and organic phases FTIR and XPS techniques were performed. The AFM analysis showed the hybrid thin films highly dense with low RMS roughness of around 1-nm. To investigate the dielectric properties of hybrid thin films, MIM capacitor devices were fabricated by using 90-nm thick hybrid dielectric layers exhibiting remarkably low leakage current density of 4.5 × 10−9 A/cm2, capacitance density of 84.5 nF/cm2 with high dielectric constant (k) of 8.4 at 1 kHz. Further, the hybrid dielectric layer was applied as a gate dielectric for fabrication of TFTs with solution processed In2O3 as the channel layer. All solution processed In2O3 TFTs showed an excellent electrical response with electron mobility of 11.2 cm2/V. s, threshold voltage of 1.7 V, Ion/off ratio of 106, and subthreshold swing of 0.58 V/dec. Therefore, our results illustrate the high potential of low-temperature solution processed ZrHfO2-PMMA hybrid thin films for future low-cost TFT applications as gate dielectric candidate.

Engineering Bilayer AlOx /YAlOx Dielectric Stacks for Hysteresis-Free Switching in Solution-Processed Metal-Oxide Thin-Film Transistors

Solution processing and low-temperature annealing (T &amp;lt; 300°C) of the precursor compounds promise low-cost manufacturing for future applications of flexible oxide electronics. However, thermal budget reduction comes at the expense of increased charge trapping residuals in the dielectric layers, which result in hysteretic switching of transistors. This work reports on a novel bilayer dielectric scheme combining aluminum oxide (AlOx) as a positive charge trapping insulator and yttrium aluminum oxide (YAlOx) as a negative charge trapping dielectric to obtain hysteresis free switching in the solution-processed metal-oxide thin-film transistors. Devices were processed at a thermal budget of 250°C, without an encapsulation layer. The presence of H+ and OH− in the AlOx were found responsible for the hysteresis in the switching, which was suppressed successfully with the thickness optimization of the YAlOx in the dielectric stack. Fabricated devices yield ON/OFF ratios of 106, sub-pA level gate leakage currents, a subthreshold swing of 150 mV/decade, and field-effect mobility of 1.5 cm2/V-sec.

Reverse-Offset Printing of Polymer Resist Ink for Micrometer-Level Patterning of Metal and Metal-Oxide Layers.

Printed electronics has advanced during the recent decades in applications such as organic photovoltaic cells and biosensors. However, the main limiting factors preventing the more widespread use of printing in flexible electronics manufacturing are (i) the poor attainable linewidths via conventional printing methods (≫10 μm), (ii) the limited availability of printable materials (e.g., low work function metals), and (iii) the inferior performance of many printed materials when compared to vacuum-processed materials (e.g., printed vs sputtered ITO). Here, we report a printing-based, low-temperature, low-cost, and scalable patterning method that can be used to fabricate high-resolution, high-performance patterned layers with linewidths down to ∼1 μm from various materials. The method is based on sequential steps of reverse-offset printing (ROP) of a sacrificial polymer resist, vacuum deposition, and lift-off. The sharp vertical sidewalls of the ROP resist layer allow the patterning of evaporated metals (Al) and dielectrics (SiO) as well as sputtered conductive oxides (ITO), where the list is expandable also to other vacuum-deposited materials. The resulting patterned layers have sharp sidewalls, low line-edge roughness, and uniform thickness and are free from imperfections such as edge ears occurring with other printed lift-off methods. The applicability of the method is demonstrated with highly conductive Al (∼5 × 10–8 Ωm resistivity) utilized as transparent metal mesh conductors with ∼35 Ω□ at 85% transparent area percentage and source/drain electrodes for solution-processed metal-oxide (In2O3) thin-film transistors with ∼1 cm2/(Vs) mobility. Moreover, the method is expected to be compatible with other printing methods and applicable in other flexible electronics applications, such as biosensors, resistive random access memories, touch screens, displays, photonics, and metamaterials, where the selection of current printable materials falls short.

Conductive Polymer-Assisted Metal Oxide Hybrid Semiconductors for High-Performance Thin-Film Transistors.

Metal oxide semiconductors doped with additional inorganic cations have insufficient electron mobility for next-generation electronic devices so strategies to realize the semiconductors exhibiting stability and high performance are required. To overcome the limitations of conventional inorganic cation doping to improve the electrical characteristics and stability of metal oxide semiconductors, we propose solution-processed high-performance metal oxide thin-film transistors (TFTs) by incorporating polyaniline (PANI), a conductive polymer, in a metal oxide matrix. The chemical interaction between the metal oxide and PANI demonstrated that the defect sites and crystallinity of the semiconductor layer are controllable. In addition, the change in oxygen-related chemical bonding of PANI-doped indium oxide (InOx) TFTs induces superior electrical characteristics compared to pristine InOx TFTs, even though trace amounts of PANI are doped in the semiconductor. In particular, the average field-effect mobility remarkably enhanced from 15.02 to 26.58 cm2 V-1 s-1, the on/off current ratio improved from 108 to 109, and the threshold voltage became close to 0 V actually from -7.9 to -1.4 V.

Lanthanum Doping in Zinc Oxide for Highly Reliable Thin-Film Transistors on Flexible Substrates by Spray Pyrolysis.

Solution-processed metal-oxide thin-film transistors (TFTs) are considered as one of the most favorable devices for next-generation, large-area flexible electronics. In this paper, we demonstrate the excellent material properties of lanthanum-zinc oxide (LaZnO) thin films deposited by spray pyrolysis and their application to TFTs. The threshold voltage of the LaZnO TFTs shifts toward positive gate voltage, and the mobility decreases with increasing lanthanum ratio in ZnO from 0 to 20%. The purification of the LaZnO precursor (P-LaZnO) further improves the device performance. The P-LaZnO TFT exhibits a field-effect mobility of 22.43 cm2 V-1 s-1, zero hysteresis voltage, and negligible threshold voltage VTH shift under positive bias temperature stress. The enhancement in the electrical properties is due to a decrease in grain size, smooth surface roughness, and reduction in the trap density in the LaZnO film. X-ray photoelectron spectroscopy (XPS) results confirm the presence of La in the TFT channel and at/near the interface of the LaZnO and ZrOx gate insulator, leading to fewer interfacial traps. The flexible P-LaZnO TFT fabricated on the polyimide substrate exhibits a mobility of 17.64 cm2 V-1 s-1 and a negligible VTH shift under bias stress. Also, the inverter made of LZO TFTs is working well with a voltage gain of 17.74 (V/V) at 4 V. Therefore, the LaZnO TFT is a promising device for next-generation flexible displays.

Controllable doping and passivation of ZnO thin films by surface chemistry modification to design low-cost and high-performance thin film transistors

Solution-processed metal oxide thin-film transistors have become more popular as they can be used to fabricate transparent and flexible electronics at low cost. However, additional and complex processes for trap-site passivation and doping hinder the potential of the low-cost solution process. This study introduces a surface passivation process involving treatment with 3-aminopropyltriethoxysilane (APTES) that can enhance the electrical properties of ZnO sol–gel thin films. Optical, chemical, and structural analyses of ZnO sol–gel thin films revealed that their trap sites were passivated successfully through APTES treatment under basic conditions. Taking advantage of this process, high-mobility and negligible-hysteresis ZnO thin-film transistors were successfully fabricated, showing an Ion/Ioff of 105, hysteresis as low as 1.13 V, and mobility of up to 0.117 cm2/Vs. Furthermore, a characteristic transition of ZnO sol–gel thin films from semiconductive to semimetallic was observed during investigations with various APTES concentrations.

Suppression of Interfacial Disorders in Solution-Processed Metal Oxide Thin-Film Transistors by Mg Doping.

The fabrication of high-performance metal oxide thin-film transistors (TFTs) using a low-temperature solution process may facilitate the realization of ultraflexible and wearable electronic devices. However, the development of highly stable oxide gate dielectrics at a low temperature has been a challenging issue since a considerable amount of residual impurities and defective bonding states is present in low-temperature-processed gate dielectrics causing a large counterclockwise hysteresis and a significant instability. Here, we report a new approach to effectively remove the residual impurities and suppress the relevant dipole disorder in a low-temperature-processed (180 °C) AlOx gate dielectric layer by magnesium (Mg) doping. Mg is well known as a promising material for suppression of oxygen vacancy defects and improvement of operational stability due to a high oxygen vacancy formation energy (Evo = 9.8 eV) and a low standard reduction potential (E0 = -2.38 V). Therefore, with an adequate control of Mg concentration in metal oxide (MO) films, oxygen-related defects could be easily suppressed without additional treatments and then stable metal-oxygen-metal (M-O-M) network formation could be achieved, causing excellent operational stability. By optimal Mg doping (10%) in the InOx channel layer, Mg:InOx TFTs exhibited negligible clockwise hysteresis and a field-effect mobility of >4 cm2 V-1 s-1. Furthermore, the electric characteristics of the low-temperature-processed AlOx gate dielectric with high impurities were improved by Mg diffusion originating in Mg doping, resulting in stable threshold voltage shift in the bias stability test.

Impact of NH3 plasma treatment for solution-processed indium oxide thin-film transistors with low thermal budget

The challenges associated with low-temperature solution-processed metal oxide thin-film transistors (TFTs) have hindered the realization of flexible oxide electronics at temperatures lower than 200 °C. NH3 plasma treatment is embarked upon as a route to effectively transform the chemical precursors to semiconducting metal oxides with high electrical quality. NH3 plasma-activated indium oxide (InOx) TFTs with saturated mobility 2.48 cm2V−1s−1 have been obtained at temperature as low as 150 °C. The low-temperature activation mechanism of NH3 plasma treatment for InOx films and the role of post-annealing in the fabrication process of InOx TFTs have been explored. Research shows that NH3 plasma treatment activates InOx films based on plasma bombardment, radicals doping and radical reactions; then, unreacted radicals and interstitial radicals were effectively removed by extra thermal energy from post-annealing. In comparison to thermal annealing, NH3 plasma treatment with moderate post-annealing is capable of achieving high degrees of condensation and densification reactions for InOx film and modulating the carrier concentration in a manner suitable for high-performance semiconducting behavior with low thermal budget. However, The InOx film after NH3 plasma treatment exhibited a non-uniform geometry due to the effect of plasma-induced damage in the local regions of InOx film, which restricts its commercial application. Some strategies were reported to eliminate the effect of plasma-induced damage by changing plasma conditions or pre-annealing temperature. The results demonstrated that changing plasma conditions by decreasing the plasma chamber temperature or the plasma power can eliminate plasma-induced damage, but attenuate the electrical performance of InOx TFT; nevertheless, changing pre-annealing temperature to 30 °C not only effectively eliminate plasma-induced damage, but also further improve the electrical performances of InOx TFT. These results provide a way for fabricating low-temperature oxide circuitry and supply an effective idea for avoiding plasma-induced damage.

High-Speed and Low-Temperature Atmospheric Photo-Annealing of Large-Area Solution-Processed IGZO Thin-Film Transistors by Using Programmable Pulsed Operation of Xenon Flash Lamp

An efficient photo-annealing approach for high-performance solution-processed metal-oxide thin film transistors (TFTs) was demonstrated by using programmable pulse operation of xenon flash lamp. The flash lamp annealing (FLA) process could offer not only low-temperature (≈100° C) processing but also ultra-fast annealing speed of the order of seconds under air ambient conditions. Solution-processed amorphous indium-gallium-zinc-oxide (α-IGZO) TFTs implemented by the FLA process typically exhibited much improved electrical performance such as saturation mobility of >10.8 cm2V−11s−1, ION/IOPP of >108, and subthreshold slope of as steep as 0.24 V/dec. X-ray photoelectron spectroscopy analysis of a-IGZO films indicates that the FLA can provide sufficient activation energy for rapid formation of solid a-IGZO bonds within 30 s. The high-quality metal-oxide films achieved by an atmospheric and low temperature FLA method may represent a significant advance for scalable fabrication of flexible and printed metal-oxide electronics.

Solution-Grown Homojunction Oxide Thin-Film Transistors

Growing attention has been given to low temperature, solution-processed metal oxide thin-film transistors because they can be applied in the emerging sector of flexible and large-scale electronics. However, major obstacles of solution-grown devices, such as their relatively low field-effect mobility and the difficulty of controlling carrier concentration, limit the further advancement of the electronics. Here, we overcome these constraints through a newly renovated structure, called a "homojunction", consisting of double-stacked semiconductors with same material. The homojunction oxide thin-film transistor has remarkable electrical performance with controllability, for example, tunable turn-on voltage (-80 V to -8 V) and high average field-effect mobility (∼50 cm2/V·s) are obtained via a low annealing temperature process (250 °C). Furthermore, notable achievements associated with stability, reliability, and uniformity are verified. These results are attributed to the unique phenomena of solution-grown thin films: the change of both chemical and physical properties of thin films. Our findings highlight that the thin films of high quality can be yielded through the solution process at low annealing temperatures, and thus solution-grown transistors hold great promise for widespread industrial applications.

Polymer Doping Enables a Two-Dimensional Electron Gas for High-Performance Homojunction Oxide Thin-Film Transistors.

High-performance solution-processed metal oxide (MO) thin-film transistors (TFTs) are realized by fabricating a homojunction of indium oxide (In2 O3 ) and polyethylenimine (PEI)-doped In2 O3 (In2 O3 :x% PEI, x = 0.5-4.0 wt%) as the channel layer. A two-dimensional electron gas (2DEG) is thereby achieved by creating a band offset between the In2 O3 and PEI-In2 O3 via work function tuning of the In2 O3 :x% PEI, from 4.00 to 3.62 eV as the PEI content is increased from 0.0 (pristine In2 O3 ) to 4.0 wt%, respectively. The resulting devices achieve electron mobilities greater than 10 cm2 V-1 s-1 on a 300 nm SiO2 gate dielectric. Importantly, these metrics exceed those of the devices composed of the pristine In2 O3 materials, which achieve a maximum mobility of ≈4 cm2 V-1 s-1 . Furthermore, a mobility as high as 30 cm2 V-1 s-1 is achieved on a high-k ZrO2 dielectric in the homojunction devices. This is the first demonstration of 2DEG-based homojunction oxide TFTs via band offset achieved by simple polymer doping of the same MO material.

Recent Advances of Solution-Processed Metal Oxide Thin-Film Transistors.

Solution-processed metal oxide thin-film transistors (TFTs) are considered as one of the most promising transistor technologies for future large-area flexible electronics. This work surveys the recent advances in solution-processed metal oxide TFTs, including n-type oxide semiconductors, oxide dielectrics, and p-type oxide semiconductors. We first deliver a review on the history and present status of metal oxide TFTs. Then, we present the recent progress in solution-processed n-type oxide semiconductors, with a special focus on low-temperature and large-area solution-based approaches as well as emerging nondisplay applications. Next, we give a detailed analysis of the state-of-the-art solution-processed oxide dielectrics for low-power electronics. We further discuss the recent advances in solution-based p-type oxide semiconductors, which will enable the highly desirable future low-cost large-area complementary circuits. Finally, we draw conclusions and outline the perspectives over the research field.

Frequency-Stable Ionic-Type Hybrid Gate Dielectrics for High Mobility Solution-Processed Metal-Oxide Thin-Film Transistors.

In this paper, we demonstrate high mobility solution-processed metal-oxide thin-film transistors (TFTs) by using a high-frequency-stable ionic-type hybrid gate dielectric (HGD). The HGD gate dielectric, a blend of sol-gel aluminum oxide (AlOx) and poly(4-vinylphenol) (PVP), exhibited high dielectric constant (ε~8.15) and high-frequency-stable characteristics (1 MHz). Using the ionic-type HGD as a gate dielectric layer, an minimal electron-double-layer (EDL) can be formed at the gate dielectric/InOx interface, enhancing the field-effect mobility of the TFTs. Particularly, using the ionic-type HGD gate dielectrics annealed at 350 °C, InOx TFTs having an average field-effect mobility of 16.1 cm2/Vs were achieved (maximum mobility of 24 cm2/Vs). Furthermore, the ionic-type HGD gate dielectrics can be processed at a low temperature of 150 °C, which may enable their applications in low-thermal-budget plastic and elastomeric substrates. In addition, we systematically studied the operational stability of the InOx TFTs using the HGD gate dielectric, and it was observed that the HGD gate dielectric effectively suppressed the negative threshold voltage shift during the negative-illumination-bias stress possibly owing to the recombination of hole carriers injected in the gate dielectric with the negatively charged ionic species in the HGD gate dielectric.

Accurate Defect Density-of-State Extraction Based on Back-Channel Surface Potential Measurement for Solution-Processed Metal-Oxide Thin-Film Transistors

We report more accurate extraction method of the defect density of states for solution-processed indium-gallium-zinc-oxide (IGZO) thin-film transistors (TFTs). Since the solution-processed IGZO TFTs have a very thin (~8 nm) active semiconductor layer, their back-channel surface potential should be considered in the field-effect method. If the back-channel surface potential is ignored, deviation between theoretically derived and experimentally measured activation energy data becomes more significant as the thickness of the semiconductor layer decreases in comparison with its Debye length. Dependence of the back-channel surface potential on the applied gate voltages was verified by scanning Kelvin probe microscopy and found to be proportional to the gate voltages. The modified field-effect method provided a more accurate model of the activation energy over the subthreshold region and correspondingly more accurate defect density of states of the IGZO TFTs.

Fully solution-processed metal oxide thin-film transistors via a low-temperature aqueous route

We report a facile and low-temperature aqueous route for the fabrication of various oxide thin films (Al2O3, In2O3 and InZnO). A detail study is carried out to reveal the formation and properties of these sol-gel-derived thin films. The results show that the water-based oxide thin films undergo the decomposition of nitrate group as well as conversion of metal hydroxides to form metal oxide framework. High quality oxide thin film could be achieved at low temperature by this aqueous route. Furthermore, these oxide thin films are integrated to form thin-film transistors (TFTs) and the electrical performance is systematically studied. In particular, we successfully demonstrate In2O3/Al2O3 TFTs with high mobility of 30.88cm2V−1 s−1 and low operation voltage of 4V at a maximum processing temperature of 250°C.

(Invited) Low-Temperature Sol-Gel Derived Ultra-Flexible Metal-Oxide Thin-Film-Transistors and Their Applications

Solution-processed metal-oxide thin-film transistors (TFTs) were fabricated for flexible integrated circuits. As gate dielectric layer, a transparent insulating oxide, ZAO (Zirconium incorporated aluminum oxide) has been employed instead of using pristine AlOx (Aluminum oxide). Using the ZAO gate dielectric, field-effect mobility of 6.21 cm2/Vs and hysteresis-free property have achieved by improving the interface between the gate dielectric and the IGZO (Indium gallium zinc oxide) semiconductor layer. For the surface modification, a heterogeneous ZAO gate dielectric has been used. With the IGZO TFTs employing ZAO gate dielectric, an ultra-flexible 7-stage ring-oscillator array was fabricated.