Sn Zn Research Articles

Soft nanocomposites of lead bromide perovskite and polyurethane prepared via coordination chemistry for highly flexible, stable, and quaternary metal alloy-printed light emitting diodes

Highly flexible and luminescent MAPbBr3/PU nanocomposites are synthesized via metal-amide coordination. In–Ga–Zn–Sn alloy cathode-printed PeLEDs incorporating the nanocomposites exhibit an impressive maximum luminance of 1458.6 Cd m−2 at r = 7 mm.

Cooperative effects due to Zn–Sn replacement by Co-ions on the optical and magnetic properties of (ZnSn)1- xCoxO nanocomposites

In the present study, the structural, optical, and magnetic properties of (ZnSn)1-xCoxO nanocomposites (NCs) were reported. The transmission electron microscope (TEM) images of ZnSnO NCs showed mixed nanorods and nanosheets morphologies that completely transformed to mostly nanocubes with Co-ions incorporation. The optical band gap (Eg) of nanostructured ZnO, SnO, and ZnSnO NCs was 3.2, 4.5, and 3.9 eV, respectively. The estimated Eg value of all (ZnSn)1-xCoxO NCs was lower than the undoped ZnSnO NCs. The nanostructured ZnO revealed poor room-temperature ferromagnetic (RTFM) behavior whereas nanostructured SnO exhibited paramagnetic behavior at low magnetic field strength followed by diamagnetic behavior at high magnetic field strength. The (ZnSn)1-xCoxO NCs exhibited strong improvement in the RTFM, where the hybrid (ZnSn)60Co40O NCs exhibited the highest saturation magnetization (Ms) of 2 emu·g−1. This value was 5-times higher than the undoped ZnSnO NCs and 2-orders of magnitude higher than the pure ZnO phase. However, with increasing Co-content up to 50 %, the Ms was reduced to 1.16 emu·g−1 demonstrating the corruption of RTFM. The present study indicated the importance of composition utilization for tuning physical properties of (ZnSn)1-xCoxO NCs and improving the performance of these NCs in optoelectronic and spintronics applications.

From kesterite 2D nanosheets to wurtzite 1D nanorods: controllable synthesis of Cu−Zn−Sn−S and their application in electrocatalytic hydrogen evolution

As typical quarternary copper-based chalcogenides, Cu–Zn–Sn–S nanocrystals (CZTS NCs) have emerged as a new-fashioned electrocatalyst in hydrogen evolution reactions (HERs). Oleylamine (OM), a reducing surfactant and solvent, plays a significant role in the assisting synthesis of CZTS NCs due to the ligand effect. Herein, we adopted a facile one-pot colloidal method for achieving the structure evolution of CZTS NCs from 2D nanosheets to 1D nanorods assisted through the continuous addition of OM. During the process, the mechanism of OM-induced morphology evolution was further discussed. When merely adding pure 1-dodecanethiol (DDT) as the solvent, the CZTS nanosheets were obtained. As OM was gradually added to the reaction, the CZTS NCs began to grow along the sides of the nanosheets and gradually shrink at the top, followed by the formation of stable nanorods. In acidic electrolytic conditions, the CZTS NCs with 1.0 OM addition display the optimal HER activity with a low overpotential of 561 mV at 10 mA/cm2 and a small Tafel slope of 157.6 mV/dec compared with other CZTS samples. The enhancement of HER activity could be attributed to the contribution of the synergistic effect of the diverse crystal facets to the reaction.

Synergetic Sn Incorporation-Zn Substitution in Copper-Based Sulfides Enabling Superior Na-Ion Storage.

Transition-metal sulfides have been regarded as perspective anode candidates for high-energy Na-ion batteries. Their application, however, is precluded severely by either low charge storage or huge volumetric change along with sluggish reaction kinetics. Herein, an effective synergetic Sn incorporation-Zn substitution strategy is proposed based on copper-based sulfides. First, Na-ion storage capability of copper sulfide is significantly improved via incorporating an alloy-based Sn element. However, this process is accompanied by sacrifice of structural stability due to the high Na-ion uptake. Subsequently, to maintain the high Na-ion storage capacity, and concurrently improve cycling and rate capabilities, a Zn substitution strategy (taking partial Sn sites) is carried out, which could significantly promote Na-ion diffusion/reaction kinetics and relieve mechanical strain-stress within the crystal framework. The synergetic Sn incorporation and Zn substitution endow copper-based sulfides with high specific capacity (≈560 mAh g-1 at 0.5 A g-1 ), ultrastable cyclability (80 k cycles with ≈100% capacity retention), superior rate capability up to 200 A g-1 , and ultrafast charging feature (≈4 s per charging with ≈190 mAh g-1 input). This work provides in-depth insights for developing superior anode materials via synergetic multi-cation incorporation/substitution, aiming at solving their intrinsic issues of either low specific capacity or poor cyclability.

Experimental determination and high-throughput calculation of the interdiffusion coefficient matrix and atomic mobility in Ag-rich fcc Ag–Sn–Zn alloys

In this paper, 10 groups of ternary Ag–Sn–Zn diffusion couples were prepared under 873, 973 and 1073 K within the fcc single-phase region. The element distribution across the diffusional interface was measured by EPMA, and a high-throughput determination of atomic mobilities in Ag-rich fcc Ag–Sn–Zn alloys was performed by using HitDIC (High-Throughput Determination of Interdiffusion Coefficients, https://hitdic.com/) software in the framework of the numerical inverse method. A self-consistent set of atomic mobility parameters was obtained. Reliability of the evaluated atomic mobility parameters were further verified by reasonably reproducing the experimental composition profiles. Insight into the composition- and temperature-dependence of various diffusion properties in fcc Ag–Sn–Zn alloy were subsequently retrieved and discussed. Furthermore, through the related Arrhenius information, the diffusion frequency factors and diffusion activity energies within the corresponding temperature and the composition range were obtained.

Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder

The effects of Ag addition on the microstructure of Sn–9Zn alloy and its corrosion behaviour in neutral and static 3.5 wt% NaCl solutions were investigated using surface characterization techniques and electrochemical techniques. The results show that in Sn–9Zn-xAg alloys, Ag reacts with Zn to form AgZn3 intermetallic compounds (IMCs), which refined the microstructure of the alloys and changed the corrosion mode of the alloy surfaces from pitting corrosion to surface corrosion. The addition of Ag effectively improved the corrosion passivation film structure and electron transfer characteristics of the alloy, increased the self-corrosion potential (Ecorr) and reduced the self-corrosion current (Icorr), thus improving the corrosion resistance of the alloy. The study explained and verified the corrosion mechanism of the alloy from both experimental and theoretical perspectives. It is concluded that Sn–9Zn-0.4Ag alloy shows relatively the best corrosion resistance.

Microstructure Evolution and Shear Strength Study of Sn–9Zn and Sn–8Zn–3Bi on Cu Substrate

Microstructure Evolution and Shear Strength Study of Sn–9Zn and Sn–8Zn–3Bi on Cu Substrate

Vacuum distillation: A sustainable separation and purification approach for extracting valuable metals from In–Zn, In–Sn, and In–Sn–Zn waste alloys

The vacuum distillation (VD) method was studied for extraction of valuable metals from In–Zn, In–Sn, and In–Sn–Zn waste alloys. The VD studies were carried out between 773 K and 1073 K, at 5 Pa, and for 60 min for the In–Zn alloys. The In content in the residues was greater than 99.999 wt%, and the Zn content in the volatiles was the highest at 99.8962 wt%. For the In-Sn alloys, the VD experiments were carried out from 1323 K to 1573 K at 5 Pa for 540 min for the In–Sn alloys. The Sn content in the residues exceeded 99.9963 wt%, whereas the In content in the volatiles was 99.86 wt%. Further, the In–Sn–Zn VD was carried out between 773 K and 1073 K at 5 Pa for 90 min. The Zn content of the residues decreased from 6.0 wt% to 0.0009 wt%, while the Zn content of the volatiles was 99.79 wt%. Using the M-MIVM and vapor–liquid equilibrium (VLE) theories, the VLE data was predicted and the related phase diagrams for the binary and ternary alloys were displayed. The remarkable similarity between theoretical and experimental VLE phase diagrams demonstrates the reliability of the M-MIVM for In-based alloys.

Effect of B on the microstructure and mechanical properties of Cu–Cu joints with in-situ Ag–Cu–Zn–Sn filler metal

With the development of advanced manufacturing, traditional Ag-based filler metals cannot reconcile the contradiction between high performance and complex processing. It also unable to meet the requirements of new materials, new structures and new processes for brazing connection performance. In this paper, based on the Ag–Cu–Zn–Sn flux-cored filler metal, the effect of the addition of B on the microstructure and mechanical properties of Cu–Cu brazing joints was investigated using FESEM‒EDS, EPMA, EBSD, TEM, microindenter and universal tensile testing machine. The results indicated that the microstructure in the brazing seam was mainly composed of Ag (s.s), Cu(s.s) and (Ag + Cu) eutectic. With increasing B content, the grain size and texture strength of Ag(s) and Cu(s) gradually decreased. The refinement of Ag-rich dendrites was mainly due to the enrichment of B atoms around the dendrite, which limited the diffusion of solute atoms in the melt and the release of solidification latent heat in front of the liquid‒solid interface, further inhibiting the growth of Ag-rich dendrites. The refinement behavior of Cu-rich dendrites was mainly attributed to the increase in B content, which reduced the tip radius of Cu-rich dendrites. The mass transfer path of B → B2O3 and B → liquid CuSn alloy → mixed melt of CuSn alloy + solder skin alloy → liquid filler metal in the brazed joint → Cu rich phase and grain boundary in the brazed joint → Ag rich phase and grain boundary in the brazing seam was clarified. The addition of B can improve the microhardness of the brazing seam. The shear strength reached a maximum value of 237.2 MPa when B was added at 2%. The fracture models mainly included intergranular fracture, dimple fracture and cleavage fracture. The strength of brazed joints can be improved by solid solution strengthening, process hardening strengthening and fine grain strengthening. The tangle and jog of dislocations within the crystal, the presence of a large number of grain boundaries and B-rich areas can prevent crack tip extension and enhance the toughness of brazing joints.

High-strength joining of 6063Al alloys by an Zn–Sn hypereutectic interlayer in air based on liquid and solid phase diffusion

A high strength joint obtained at relatively low temperature and pressure by diffusion bonding has always been a challenge for manufacturing of aluminum alloy heat sinks. In this work, joining of 6063Al alloys was performed by a novel liquid and solid phase diffusion bonding method with an Zn–30Sn hypereutectic interlayer. It was achieved at a heating temperature of 360 °C and a pressure of 1 MPa. A 6063Al joint bonded was composed mainly of Zn–Al eutectoid phases and had a higher strength than the base metal. During the diffusion bonding process, the joint was constituted of Sn–Zn eutectic phases and η-Zn phases at initial diffusion stage. The proportion of Sn–Zn eutectic phases gradually decreased and Zn–Al eutectoid phases increased in a joint through inter-diffusion between base metal and interlayer with increasing of holding time. The η-Zn phases finally transformed into Zn–Al eutectoid phases with depleting of Sn–Zn eutectic phases, in which only 0.02 wt% Sn element was remained in the joint. The liquid and solid phase diffusion mechanisms were revealed. The penetration of Sn to the grain boundary of Al alloy happened under an assistance of the Zn diffusion. The Al originated from base metal interdiffused with η-Zn phases, forming Zn–Al eutectoid phases.

Research Progress in Corrosion Protection Technology for Electronic Components

As a necessary part of all electronic devices, equipment and systems, electronic components play a vital role in the global economy. Since the corrosion of a single electronic component may directly affect the normal operation of the entire electronic system, the failure of electronic components has now become the most important cause of electrical system failure and has become a major obstacle to China’s transformation into a scientific and technological power. Therefore, it is urgent to study the corrosion failure process of electronic components and the means of effective protection. In this paper, starting from the corrosion types and influencing factors of electronic components, especially chips, we introduce the influence of humidity, temperature, salt spray, and environmental particles, as well as the device’s own surface roughness, material adhesion, semiconductor materials, metal coupling system, and lead-free solder system on corrosion performance in the environment. Subsequently, this paper summarizes how to protect electronic components during processing, and sums up the types of electronic component protections, and the specific corrosion protection process for the three commonly used types of chips, namely, the indium antimonide InSb chip, the IC chip, and the Sn–Zn solder chip, for reference. Finally, future development trends in the corrosion protection of electronic components are anticipated and summarized.

Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al

Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al

DC sputtered ZrO2/Zn(1−x)Sn(x)O thin-film transistors and their property evaluation

A bottom gate staggered 30 nm Zn(1−x)Sn(x)O (x = 0.14) (TZO)-based thin-film transistors (TFTs) were fabricated using DC magnetron reactive sputtering method. Highly transparent 120 nm dc sputtered ZrO2 was used as a gate dielectric. The oxygen flow rate was varied from 20 to 24% during channel layer (TZO) coating and its effect on structural, morphological, optical, chemical, and electrical parameters were systematically studied. A nano scale roughness was noticed by atomic force microscopy (AFM), and ultra-smooth nature in root mean square roughness (RMS) was observed with an increment in the oxygen flow ratio. The increase in the oxygen-related defects with increase in the oxygen flow ratio in channel layer was evident from X-ray photoelectron spectroscopy (XPS). The electrical characterization of gate dielectric was carried out for Al–ZrO2–Al structure. The high capacitance density ~ 121.9 nF/cm2 for 120 nm ZrO2 was obtained from the capacitance–voltage (C–V) measurement. The fabricated TFTs operated in n-channel depletion mode and indicated pinch-off region at lower source–drain voltages. In addition, the transfer characteristics of TFTs confirmed Ion/Ioff ratio of 105, with a field effect mobility of 23 cm2/V.s. This low temperature processed TFT unlocks the possibility of use in the next generation foldable display technology.

Dielectric and gyromagnetic structure modulations of Zn–Sn codoped yttrium–iron–garnet based on the density‐generalized functional theory and P–V–L bond theory

AbstractHerein, the crystal structure, dielectric properties, and gyromagnetic characteristics of Zn–Sn codoped Y3ZnxSnxFe5−2xO12 (x = 0.0–0.5) prepared using a conventional ceramic process were investigated. According to the first‐principles’ calculations and complex crystal bonding theory, Zn2+–Sn4+ codoping can increase the relative dielectric constant (εr) by enhancing the average ionicity. The x‐ray photoelectron spectroscopy (XPS) and Raman analysis results indicate that an appropriate amount of Zn2+–Sn4+ codoping can help improve the microscopic morphology, maintain the appropriate ratio of divalent iron ions, and reduce the microwave magnetic and electrical losses of YIG ferrites. The optimized microwave properties are as follows. Y3Zn0.3Sn0.3Fe4.4O12 after sintering at 1400°C; εr = 15.6; dielectric loss, that is, tanδε = 4.3 × 10−4; saturation magnetization, that is, 4πMS = 2244 G; ferromagnetic resonance linewidth, that is, ΔH = 37 Oe. These properties can help improve the performance of high‐frequency microwave components by enhancing the properties of ferrite.

Effects of Ca addition on the microstructure and mechanical properties of Mg–Zn–Sn–Mn alloys

The effects of Ca addition on the microstructure and mechanical properties of Mg–Zn–Sn–Mn alloys were investigated in this study. The Mg–6Zn–4Sn–1Mn–xCa (x = 0, 0.2, 0.5, 1 and 2 wt%) alloys consist of the α-Mg, Mg2Sn, Mg7Zn3, MgZn, α-Mn, CaMgSn, MgZn2, Mg2Ca and Ca2Mg6Zn3 phases. With increasing Ca content, the eutectic phase and grains were refined, and the morphologies of the CaMgSn phases changed from point-like to needle-like, rod-like and lath-like. At room temperature, small amounts of Ca can improve properties owing to refinement strengthening. The two-stage aged Mg–6Zn–4Sn–1Mn–0.2Ca alloy has the best comprehensive properties at room temperature, with an ultimate tensile strength (UTS), yield strength (YS) and elongation of 407 MPa, 392 MPa and 6.2%, respectively. When the Ca content increased, the number of CaMgSn phases increased, and the morphologies coarsened. Further, it was a brittle phase, resulting in the deterioration of alloy properties. At high temperatures, a small amount of Ca can improve the high-temperature plasticity. The elongations of the as-extruded Mg–6Zn–4Sn–1Mn–0.2Ca alloy were 76.9% (150 °C) and 133.8% (200 °C). A high Ca concentration can significantly improve the high-temperature strengths because of the good thermal stability of the CaMgSn phases, the best UTS and YS are 160 MPa and 136 MPa, respectively, in as-extruded Mg–6Zn–4Sn–1Mn–2Ca alloy at 150 °C.

Corrosion Behaviors of Outdoor Bronze Sculptures in an Urban–Industrial Environment: Corrosion Experiment on Artificial Sulfide Patina

Copper alloys interact with air pollutants to form corrosion products and, consequently, a patina on outdoor bronze sculptures. In this study, corrosion experiments were conducted to clarify the corrosion behaviors of artificial sulfide patina in an urban–industrial environment on a quaternary bronze alloy (Cu–Zn–Sn–Pb) with a composition and metallurgical properties similar to those of outdoor bronze sculptures. The correlation between the chromaticity and reflectance of the patina revealed increasing brochantite with the corrosion of the patina and an association between the chromaticity a* and patina growth. Cuprite and brochantite were distinguished, and the point at which brochantite covered the patina surface was determined. The quantitative changes in brochantite were mainly influenced by physical causes such as the crystal size and patina layer thickness as well as by Cu2+ ions working as color formation ions moving to the outermost layer. Atmospheric corrosion of the alloy resulted in reduced Cu and Zn contents and increased Sn and Pb contents. The patina consisted of brochantite in the outermost layer and cuprite and cassiterite in the inner layers. These findings should clarify corrosion characteristics such as the surface color, composition, and changes in corrosion products of outdoor bronze sculptures and contribute toward their preservation.

Indium mineralization and genesis of the Bainiuchang Ag–Sn–polymetallic deposit in southeast Yunnan, China: Evidence from mineral chemistry and U–Pb geochronology

The Bainiuchang Ag–Sn–polymetallic deposit is located in the world-calss Southeast Yunnan Indium Metallogenic Belt (SYIMB). The deposit contains approximately 1000 tons of In, but the mechanisms of mineralization and hosts of In in this deposit remain unclear. To clarify these ambiguities, we carried out fieldwork, major- and trace-element analyses of In-bearing minerals, and cassiterite and zircon U–Pb geochronology. Five ore zones were identified, which, from contact of the granitic intrusion upwards, are the In-poor magnetite–cassiterite ore zone, the In-poor Cu ore zone, the In-rich Zn–Sn ore zone, the In-rich Sn–Pb–Zn ore zone, and the In-poor Pb–Zn ore zone. Cassiterite and zircon U–Pb geochronology demonstrate that mineralization at Bainiuchang occurred at ca. 85.80±0.45 Ma (MSWD = 1.5), which is similar to the 85.34±0.42 Ma (MSWD = 1.7) age of the granitic intrusion. This temporal relationship suggests that there is a genetic link between In mineralization and granitic magmatism in this deposit. Ore petrography and mineral chemical analyses indicate that sphalerite, chalcopyrite, and stannite are main In-bearing minerals. From a mass balance perspective, sphalerite is the most important In-bearing mineral, accounting for ∼85% of the In budget at Bainiuchang. Indium is incorporated into sphalerite via the coupled substitution 2Zn2+ ↔ Cu+ + In3+ and/or 3Zn2+ ↔ Ag+ + Sn2+(+In3+). Two generations of sphalerite occur in the deposit, SpI and SpII, which formed during the cassiterite–sulfide and carbonate–sulfide stages, respectively. Based on textural relationships, SpI is further subdivided into SpIa, SpIb, and SpIc. These temporally and texturally distinct sphalerite have variable In contents, with SpIa having the highest In content (0.08–0.44 wt%), followed by SpIb (0.02–0.39 wt%), SpIc (187–236 ppm), and SpII (0.64–7.14 ppm). It is suggested here that the variations in In contents of the sphalerite reflect the evolution of the magmatic–hydrothermal fluids from which the sphalerite precipitated under different fS2 and temperature. By comparing the Bainiuchang deposit to other In-bearing deposits in the southwestern Yangtze Block, it is evident that that the nature and source of the associated granites, and the degree of fractionation of the granitic magmas are likely important controls on In mineralization in the SYIMB and other regions.

Hot tear cracks on the suppression of Sn–Bi alloy for low-temperature assembly

PurposeIn the electronic assembly industry, low-temperature soldering holds great potential to be used in surface mounting technology. Tin–bismuth (Sn–Bi) eutectic alloys are lead-free solders applied in consumer electronics because of their low melting point, high strength and low cost. This paper aims to investigate how to address the problem of hot tear crack formation during Sn–Bi low-temperature solder (LTS) in the mass production of consumer electronics.Design/methodology/approachThis paper explored the development of hot tear cracks during Sn–Bi soldering in the fabrication of flip chip ball grid arrays. Experiments were designed to simulate various conditions encountered in Sn–Bi soldering. Quantitative analysis was conducted on the number of hot tear cracks observed in different alloy compositions and solder volumes to explore the primary cause of hot tear cracks and possible methods to suppress crack formation.FindingsHot tear cracks existed in Sn–Bi solders with different bismuth (Bi) contents, but increasing the solder volume reduced the number of hot tear cracks. Experiments were designed to test the degree of chip transient thermal warpage with temperature change, and, according to the results, glue was dispensed in specific areas to reduce chip warpage deformation. Finally, the results of combined process experiments pointed to an effective method of low-temperature soldering to suppress hot tear cracks.Research limitations/implicationsThe study focuses on Sn–Bi solders only without other solder pastes such as SAC305 or Sn–Zn series.Practical implicationsWith the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles electronics, solar photovoltaic and other field, there will be more and more demand for low- temperature, energy-saving, lead-free solders. Therefore, this study will help the industry to roll out LTS (Sn–Bi) solutions rapidly.Social implicationsIn the long term, lean and green manufacturing is expected to be essential for maintaining an advanced manufacturing industry across the world. Developing new LTSs and soldering processes is the most effective, direct solution for energy conservation and emission mitigation. With the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles and solar photovoltaics, there would be an increased demand for low-temperature, energy-saving, lead-free techniques.Originality/valueAlthough there are many methods that can be used to suppress hot tear cracks, there is little research on how to control the hot tear cracks caused by the low-temperature soldering of Sn–Bi in laptop applications. The authors studied the hot tear cracks that developed during the world’s first mass production of 50 million personal laptops based on low-temperature Sn–Bi alloy solder pastes. By controlling the Bi content, redesigning the solder paste printing process (e.g. through a printer’s stencil) and adding dispensing processes, the authors obtained reliable and stable experimental data and conclusions.

Exploring Zn–Sn–O (ZTO) composition spreads with combinatorial sputtering

Exploring Zn–Sn–O (ZTO) composition spreads with combinatorial sputtering

Enroute to sub-300 °C operating Sn–Zn||Pb–Bi liquid metal battery by compositional engineering

Liquid metal battery (LMB) is considered a potential contender for grid-scale energy storage systems. However, high operating temperatures (>400 °C) leading to higher operational costs limit its commercial application. Therefore, the current work focuses on reducing the melting temperature of electrodes and electrolytes below 300 °C by compositional engineering. Moreover, this study utilizes earth-abundant elements like Zn (with less reliance on Li), in Zn–Sn||Bi–Pb LMB system. The composition of LiCl in the electrolyte is varied to optimize the battery performance, especially the energy efficiency and overpotential while maintaining an operating temperature of <275 °C. It is found that as the LiCl content in the electrolyte salt increases (5–30 Mol%), the overpotential of the battery decreases (0.9–0.3 V), and the energy efficiency of the charge-discharge process improves (14.5%–80.9%) owing to the better ionic conductivity of LiCl. For the optimized LiCl concentration of 30 Mol% LiCl in the electrolyte, the fabricated LMB exhibit good cyclability (no degradation till 100 cycles), a high discharging voltage plateau of 0.92 V, 24.6 mAh charge storage capacity, and a low operating temperature of 275 °C, which is the lowest operating temperature reported so far in a Zn-based LMB system.