The conversion of industrial lignin into wood adhesives offers a solution to issues related to formaldehyde pollution and the reliance on petrochemical resources of traditional formaldehyde-based resins, while promoting environmental and energy sustainability. However, conventional methods for preparing lignin-based adhesives generally involve the use of materials like formaldehyde, organic solvents, and costly epoxy, hindering their industrial application. This study introduces a novel approach for producing eco-friendly lignin-based wood adhesives using aminated lignin-Cu nanoparticles. The lignin-Cu nanoparticles were synthesized in water as a single solvent through a sedimentation method. Amination modification was achieved by grafting amino-terminated hyperbranched polyamide onto the nanoparticles via a Schiff base reaction. The prepared adhesive demonstrated a remarkable bonding strength of 1.51 MPa and debonding work of 0.272 J, which were 2.75 and 6.33 times higher than those of the pure lignin adhesive, respectively. Moreover, the adhesive exhibited improved water resistance with a wet shear strength of 1.15 MPa and sustained mildew resistance for approximately 100 days. Notably, this adhesive was synthesized without the use of formaldehyde, phenol, acids, or organic solvents, minimizing reliance on fossil resources and lowering costs compared to many formaldehyde-based and biomass adhesives. This research opens up new avenues for the efficient utilization of industrial lignin and the production of formaldehyde-free, environmentally friendly adhesives, which holds significant promise for energy conservation, emission reduction, and sustainable development within the wood-based panel industry.
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