Ar + sputtering of Si wafers surrounded by Mo plates induced the formation of uniform cones over a large area on the Si surface. Scanning electron microscopic study showed that the cones were formed on the entire surface of the Si wafer. The uniform cones were 0.4–0.7 μm in diameter and 5–6 μm high. They were further characterized by means of cross-sectional transmission electron microscopy, and micro-diffraction. It was found that the cone contained a pure Si regime and a Mo-rich regime. In the binary Mo–Si zone, we identified three distinct areas vertically: (1) domains of Mo-induced Si ordered structures; (2) a small volume of a new Mo 3Si 2 structural variant, intergrown with the Si ordered structure; and (3) a small amount of pure Mo nanoparticles covering the surface of the cones. The formation of the large and uniform cones may provide a new surface configuration for potential applications in surface science and technology.
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