Rugged Applications Research Articles

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An efficient and adaptable multimedia system for converting PAL to VGA in real-time video processing

Real-time video processing has found its range of applications from defense to consumer electronics for surveillance, video conferencing, etc. With the advent of Field Programmable Gate Arrays (FPGAs), flexible real-time video processing systems which can meet hard real-time constraints are easily realized with short development time. Most of the existing solutions have high utilization of system resources and are not quite flexible with many applications. Here we propose a hardware–software co-design for an FPGA-based real-time video processing system to convert video in standard Phase Alternating Line (PAL) 576i format to standard video of Video Graphics Array (VGA)/Super Video Graphics Array (SVGA) format with little utilization of resources. Switching between multiple video streams, character/text overlaying, and skin color detection are also incorporated with the system. The system is also adaptable for rugged applications. VHSIC Hardware Description Language (VHDL) codes for the architecture were synthesized using Altera Quartus II and targeted for Altera Stratix I FPGA. Results achieved confirm that the proposed system performs efficient conversion with very less resource utilization compared to the existing solutions. Since the proposed system is also flexible, many other applications can be incorporated in the future.

Evidencing Excellent Thermal‐ and Photostability for Single‐Component Organic Solar Cells with Inherently Built‐In Microstructure

AbstractSolution‐processed organic solar cells (OSCs) are promising low‐cost, flexible, portable renewable sources for future energy supply. The state‐of‐the‐art OSCs are typically fabricated from a bulk‐heterojunction (BHJ) active layer containing well‐mixed donor and acceptor molecules in the nanometer regime. However, BHJ solar cells suffer from stability problems caused by the severe morphological changes upon thermal or illumination stress. In comparison, single‐component organic solar cells (SCOSCs) based on a double‐cable conjugated polymer with a covalently stabilized microstructure is suggested to be a key strategy for superior long‐term stability. Here, the thermal‐ and photostability of SCOSCs based on a model double‐cable polymer is systematically investigated. It is encouraging to find that under 90 °C & 1 sun illumination, the performance of SCOSCs remains substantially stable. Transport measurements show that charge generation and recombination (lifetime and recombination order) hardly change during the aging process. Particularly, the SCOSCs exhibit ultrahigh long‐term thermal stability with 100% PCE remaining after heating at temperature up to 160 °C for over 400 h, indicating an excellent candidate for extremely rugged applications.

Expanded Beam Fiber Optic Connectors Increase Optical Link Margin

Present fiber optic connections need to align two or more optical fibers to accuracies of microns (multimode fiber) and tenths of a micron (single more fiber). For connections in rugged applications, consisting of wide temperature ranges, substantial vibration, or in the presence of contaminants, the alignment of normal physical contact connections becomes even more difficult. New expanded beam connectors make fiber optic connections more durable, and help stabilize the transmission of high speed optical signals between systems, boxes, boards, and devices in these harsh environments.

Wearable 4‐in. QVGA full‐color‐video flexible AMOLEDs for rugged applications

Abstract— Work on the world's first wrist‐worn communications device built on a flexible, low‐power‐consumption full‐color AMOLED using phosphorescent OLEDs is presented. The device offers the wearer the ability to see high‐information‐content video‐rate information in a thin‐and‐rugged‐form‐factor 4‐in. QVGA display, conformed around a human wrist.

Critique of EIA SSB-1: guidelines for using plastic encapsulated microcircuits and semiconductors in military, aerospace, and other rugged applications

Economics and availability concerns, together with internal directives, have provided a strong impetus for the military and aerospace electronics industries to use commercial plastic encapsulated microcircuits (PEMs) in their applications. To address concerns related to the reliability of commercial devices in these harsh environment applications, the G-12 Solid State Device Committee of the Government Electronics & Information Technology Association (GEIA) has developed guidelines for assessing the suitability of plastic encapsulated microcircuits and semiconductors for use in military, aerospace and other rugged applications. These guidelines were recently published in the Electronic Industries Alliance Engineering Bulletin. The concept of these guidelines is a step in the right direction, as they provide direction to industry on how to incorporate PEMs reliably. They provide an approach to assess the use of PEMs that correctly separates manufacturer quality and part reliability issues. Furthermore, the guidelines recognize that failure can occur by multiple failure mechanisms that are excited by many different environmental factors, not just temperature. However, the guidelines omit several critical elements from their evaluation plan that are present in other approaches, the reliability assessment does not directly account for component architecture in its calculations, and the approach uses constant failure rate statistics and parts count methodologies to evaluate system reliability. This last characteristic has caused some to indicate that the guidelines bear strong similarities to MIL-HDBK-217, which has been precluded from military use. This paper provides a critique of the SSB-1 Guidelines.

Paper roughness measurement using airborne ultrasound

Abstract Paper roughness has been studied using high-frequency airborne ultrasound. The measurement principle is based on the attenuation that occurs when ultrasound is reflected from a rough surface. Paper samples have been tested and results compared with data from conventional air-leak measurements. The proposed method is non-contacting and it allows the possibility of developing fast and rugged applications for the laboratory or for on-location product testing.