Replacement Of Gold Research Articles

Kritik Pemikiran Taqiyyudin Al-Nabhani Tentang Zakat Uang Kertas

Money is usability standard contained in the goods and labor. Money can be classified into two types, namely coins and paper money. Coin money is made ​​of minerals such as gold, silver, copper, tin and nickel. Paper money is money which is made ​​of paper, as a replacement of gold or silver or made ​​of a mixture of gold or silver or a mixture of both is secured wholly or partly by gold and silver. Paper money as a kind of currency that existed at this time has dominated the economy and replaced the gold and silver as a means of exchange. By the money, the actors of economic can conduct transactions anytime, anywhere, and with anyone easily and efficiently. This will certainly lead to the rapid development of the real sector, because it is considered an asset that can be used as a means of exchange and received by the general public, the Al-Nabhani charity requires it. In the excavation of law relating to zakat of paper money, al-Nabhani used the literal approach and used the method of qiyas. The lawyer-as the basis of qiyas are passages that describe the zakat of gold and silver as well as the Hadith that shows about currency and valuables, such as word riqqah, wariq, dinars and dirhams, hadith about diyat, and prohibition ihtikar. The essence of Allah forbade the hoarding of gold and silver, and ordered to remove the charity from both. The money is legal equated with gold and silver because there are 'illat that on the day of the gold and silver that paragraph applies as currency, in addition to his position as a mineral that has essential value. 'Illat is justifiable because history proves that gold and silver are the currency used to trade through out the life of the Prophet and the caliphs afterwards.

Staining Traditional Colloidal Gold Test Strips with Pt Nanoshell Enables Quantitative Point-of-Care Testing with Simple and Portable Pressure Meter Readout.

Traditional immunochromatographic test strips based on colloidal gold are effective devices for portable and low-cost point-of-care (POC) testing. Nevertheless, they still suffer from the limitation of qualitative or semiquantitative tests via naked-eye detection. Replacement of gold with other signal entities, such as magnetic particles or fluorescent particles, requires professional instrumentation to obtain quantitative results. A pressure-based assay with platinum nanoparticles (PtNPs) can provide quantitative results using a portable pressure meter but is also hampered by the long-term instability of PtNPs. Consequently, we developed a Pt-staining method based on test strips to create platinum nanoshells on the surface of colloidal gold. This method not only preserves the original advantages of colloidal gold with easy synthesis and decoration but also introduces PtNPs with excellent catalytic activity as signal labels to achieve sensitive quantitative detection. Myoglobin was tested as a model target, and the limit of detection was 5.47 ng/mL in 20% diluted serum samples, which satisfies the requirements for clinical monitoring of acute myocardial infarction. In addition, the two most common colloidal gold strips available in the marketplace were applied to demonstrate the compatibility of Pt-staining. Taking advantage of low cost, user-friendliness, compatibility, simplicity, and stability, colloidal gold test strips with Pt-staining are expected to satisfy the need for quantitative POC testing of biomarkers, especially in resource-limited regions.

Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds

Abstract Copper (Cu) wire bonding is now widely accepted as a replacement for gold (Au), however, its use in high reliability applications is limited due to early failures in high temperature and humid conditions. The Au to Cu wire transition is mainly driven by cost savings though there are other advantages to Cu such as better electrical and thermal conductivity, slower intermetallic compound (IMC) formation and reduced wire sweep during transfer molding. Some automotive, industrial and aerospace industries are still reluctant to adopt Cu wire bonded products due to perceived risks of wire and bond pad cracks, the potential for corrosion, and some lack of understanding about its reliability in harsh conditions. A wire bond is considered good if destructive sampling qualification tests and periodic monitors pass for the batch. Tests include wire pull strength, wire bond shear, IMC coverage, and thickness of bond pad aluminum (Al) remaining beneath the bond. Nondestructive inspections also verify acceptable ball diameter and Al “splash”. This paper focuses on the bond shear test and its contribution to Cu ball bond reliability assessment, especially when changing Al bond pad thickness. A new revision of the JEDEC Wire Bond Shear Test Method, JESD22-B116B, has just been released, to include Cu wirebonds for the first time. It helps to clarify shear test failure modes for Cu ball bonds. However, there are still questions to be answered through research and experimentation, especially to learn the extent to which one may predict Cu ball bond reliability based on shear test results. Pad Al thickness is not considered in the current industry standards for shear test. Yet bond pad Al thickness varies widely among semiconductor products. This research is intended to contribute toward improved industry standards. In this study, power and time bonding parameters along with bond pad thickness are studied for bond strength. Several wire bonds are created at different conditions, evaluated by optical microscope and SEM, IMC% coverage and bond shear strength. Similar bonding conditions are repeated for bond pads of 4um, 1um and 0.5um thickness.

Rearrangement of a Transient Gold Vinylidene into Gold Carbenes.

The gold acetylide complex 20 endowed with a biaryl backbone provides opportunities for a study on the formation and fate of gold vinylidenes. Although the formyl group in 20 is not sufficiently electrophilic to get attacked by the acetylide in proximity, its activation with TBSOTf (TBSOTf=tert-butyldimethylsilyl trifluoromethanesulfonate) at low temperature triggered instantaneous formation of a gold vinylidene (21). This metastable species evolved into the cationic gold carbene complex 22 bearing a phenanthrene unit and a hydroxyl group at the aurated center; the recorded data suggest that this product might be better viewed as an acylgold species protonated by triflic acid. The use of [Me3 O⋅BF4 ] as the activating agent led to formation of the analogous Fischer-type carbene 24, whereas replacement of gold by the [CpRu(PPh3 )2 ]+ fragment allowed the ruthenium vinylidene 27 to be isolated, which closely resembles the proposed gold intermediate 21. The starting gold complex 20, the derived products 22 and 24, as well as vinylidene 27 were characterized by X-ray diffraction.

Composition dependent selectivity in the coadsorption of H2O and CO on pure and binary silver–gold clusters

Small cationic gold clusters exhibit a strong affinity toward carbon monoxide. This prevents the coadsorption of water which would be the first step of a catalytic water gas shift chemistry on these clusters. In a gas phase ion trap experiment with mass selected AgnAum+ it was however possible to demonstrate that the replacement of gold by silver atoms in triatomic cluster ions liberates sites for H2O adsorption. The resulting observed coadsorption effect occurs at a cross-over in the molecular binding energies of carbon monoxide and water to these clusters determined by reaction kinetics measurements and first principles calculations.

Patterned Graphene Electrodes from Solution‐Processed Graphite Oxide Films for Organic Field‐Effect Transistors

A replacement for gold as the hole-injecting metal in organic electronic devices is presented: patterned graphene electrodes prepared from graphite oxide sheets by oxygen plasma etching. Solution-processed organic FETs with poly(3-hexylthiophene) as the semiconductor and these graphene electrodes are shown to perform as well as or even better than devices with gold contacts. Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.

Computer simulation of the vertical growth of subsurface cobalt nanoclusters in gold

The vertical growth of nanodimensional cobalt clusters buried under the surface of a gold substrate has been studied using computer simulation methods with allowance for the interdiffusion of Au and Co atoms and the fields of elastic stresses generated by cobalt clusters in the gold matrix. The temporal variation of the concentrations of Co and Au atoms in the near-surface layers is described and the characteristic times of gold replacement by cobalt in layers above the buried clusters are determined. The results of simulations are compared to the available experimental data.

The replacement of gold by palladium-nickel on connectors

La presence de nickel dans le depot diminue la quantite d'hydrogene produit, ce qui accroit la ductilite. L'absence de formation d'hydrure de palladium de phase β elimine un important probleme que l'on rencontre avec Pd pur

A Comparative Study of Electroplated Palladium as a Contact Finish

In this study a lower cost replacement for gold as an electrical contact material has been investigated. In the initial phase of the study, the performance of hard gold, palladium, and palladium-nickel alloy both with and without a Soft go1d overlay were compared. ACtual connector hardware using these contact finishes were subjected to two tests: wear at elevated temperature and humidity and exposure tO a humid chlorine and hydrogen sulfide environment. The results of these tests were compared on the basis of resistance measurements of the connector contacts. As interest foCused on the use of a proprietary Bell System palladium with a gold overlay as a substitute finish, other connectors were evaluated including round and square pin contacts, bifurcated and trifurcated socket contacts, button type contacts, printed wiring board fingers, and card edge connectors. For all the cases studied a finish of 25-µ in pa!ladium With 1-µ in gold overlay has been found to be a suitable replacement for the gold contacts used on these devices and is now in use in several contact applications.

How Effective Is Palladium-Nickel as a Replacement for Gold?

SummaryEqual thicknesses of electrodeposited acid hard gold and palladium-nickel were compared under identical conditions to determine whether palladium-nickel is suitable as a replacement for gold on electrical connectors. The deposit properties and solution characteristics of the two processes were evaluated. The results showed that palladium-nickel has considerable promise as a replacement for gold and further work ought to be carried out to evaluate palladium-nickel with a thin gold flash top coat.

Alternatives to Gold Plating in the Electronics and Decorative Industries

SummaryThe paper reviews the characteristics and properties of the various precious metals which could be considered as alternatives to gold in both the industrial and decorative markets. Various electrolyte formulations are discussed with particular reference to their application. Particular reference is made to palladium-nickel, as this has proved to be a very attractive replacement for gold in recent months.

Gold plating in the electronics industry

Predictably enough at a meeting devoted to plating in the electronics industry, gold plating figured prominently at the Fourth Symposium on this theme held by the American Electroplaters' Society in Indianapolis, no less than 11 out of a total of 24 papers dealing with various aspects of this subject. Of these, four were concerned with applications in the semiconductor and microelectronics field, two with the requirements of gold plating for use on sealed reed relay contacts, three with processes and coating properties in the more general context of electrical contact applications, and two with analytical methods for the determination of metallic impurities or organic contaminants in plating baths. A common factor was the preoccupation with coating properties in relation to particular applications as affected by operational parameters, compositional variations and plating solution contaminants, reflecting the increasing specificity and control of coating characteristics demanded by today's electronics industry. The concern felt over the recent rise in the price of gold was also evident; of the various approaches to the problem of off-setting the resulting cost increases, selective plating which limits the gold coating to operational areas only, and the general improvement in deposit characteristics such as porosity, hardness and wear resistance to permit the use of thinner gold deposits, were accorded little more than passing general reference. Two papers were, however, concerned with a third possibility, namely the replacement of pure gold by alloy gold deposits of relatively low gold content. Such coatings have been used for many years in the plating of watch cases, where the requirements in terms of wear resistance and corrosion protection over long periods are not dissimilar to those of engineering applications, but though successful use in the electrical and electronics field has been documented in a number of cases in Europe, this type of coating has been more generally viewed with some suspicion on the general grounds of anticipated difficulty in compositional control and the possible effect of the presence of significant amounts of base metals on oxidation and corrosion resistance, particularly at elevated temperature. The fourth approach to the problem, the replacement of gold by an alternative metal which could match its unique combination of properties in terms of corrosion and oxidation resistance, low and stable electrical contact resistance, high conductivity, good solderability and weldability, seems very distant of realisation. Indeed, E. F. Duffek, of Chemline Industries, Santa Clara, in a general review of the semiconductor and microelectronics field, reported increased usage of gold, notwithstanding the price rise, and attributed this to a market trend toward consumer products as opposed to military and strategic items, again emphasising the need for low cost production.