Reliability Of Flexible Electronics Research Articles

Low hysteresis zwitterionic supramolecular polymer ion-conductive elastomers with anti-freezing properties, high stretchability, and self-adhesion for flexible electronic devices.

The fabrication of stretchable ionic conductors with low hysteresis and anti-freezing properties to enhance the durability and reliability of flexible electronics even at low temperatures remains an unmet challenge. Here, we report a facile strategy to fabricate low hysteresis, high stretchability, self-adhesion and anti-freezing zwitterionic supramolecular polymer ion-conductive elastomers (ICEs) by photoinitiated polymerization of aqueous precursor solutions containing a newly designed zwitterionic monomer carboxybetaine ureido acrylate (CBUIA) followed by solvent evaporation. The resultant poly(carboxybetaine ureido acrylate) (PCBUIA) ICEs are highly stretchable and self-adhesive owing to the presence of strong hydrogen bonds between ureido groups and dipole-dipole interactions of zwitterions. The zwitterion groups on the polymer side chains and loaded-lithium chloride endow PCBUIA ICEs with excellent anti-freezing properties, demonstrating mechanical flexibility and ionic transport properties even at a low temperature (-20 °C). Remarkably, the PCBUIA ICEs demonstrate a low hysteresis (≈10%) during cyclic mechanical loading-unloading (≤500%), and are successfully applied as wearable strain sensors and triboelectric nanogenerators (TENGs) for energy harvesting and human motion monitoring. In addition, the PCBUIA ICE-based TENG was used as a wireless sensing terminal for Internet of Things smart devices to enable wireless sensing of finger motion state detection.

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Abstract Although the reliability of flexible electronics during bending deformation is of great interest nowadays, the mechanical reliability that has mainly been investigated is of single electronic components or simple devices, such as metal interconnect, transparent conductive electrode, or thin-film devices, rather than that of the real package sample having complex structure and various materials. This study systematically investigated the mechanical reliability of flexible Si package sample consisting of Si die, polymer bump, and polymer substrate, by using individual resistance monitoring of the metal line, bump array, and total interconnect. For the bending test, the sample consisting of only Si die and polymer substrate shows abrupt electrical resistance increase below a bending radius of 3 mm, due to cracking of the Si die. For the bending fatigue test, the electrical resistance increases after 2000 cycles in 5 mm bending radius, due to fatigue failure of the metal line and bump array. Both the maximum bendability and fatigue lifetime can be significantly improved by covering with the molding layer. Finite element method simulation is conducted to analyze the mechanical stress distribution of the flexible package with and without molding layer during bending deformation. This study based on experimental results and simulation analysis can provide helpful guidelines for the design of highly reliable flexible packages.

Liquid metal-based electrical interconnects and interfaces with excellent stability and reliability for flexible electronics.

Stable and reliable electrical properties of interconnects and interfaces between flexible/stretchable and rigid materials/components are essential for the practical applications of flexible electronic devices and systems; traditional metal thin films and hard solder interconnects and interfaces can no longer meet these requirements. As an emerging soft conductive material, liquid metal has the advantages of high stretchability, flexibility, etc. over other soldering materials, and it has been used in interconnects and interfaces for some flexible electronics. In this study, we report a detailed investigation on the reliability and stability of liquid metal-based interconnects/interfaces under various mechanical deformations, including extension, bending, torsion, high frequency vibration and high temperature operation; we also compared the results with those of interconnects and interfaces using silver paste, the most commonly used solder for flexible electronics. The results show that liquid metal interconnects and interfaces maintain high conductivity under severe elongation up to 95% and 130%, upon bending with a curvature radius as low as ∼1.5 mm, and upon twisting up to 360°; meanwhile, interconnects and interfaces with silver paste filler lose electrical conductivity at elongations of 0.6% and 60%, respectively. Liquid metal interconnects and interfaces show superior performance to silver paste interconnects and interfaces because liquid metal can be re-shaped to make good contact with objects, while the silver paste becomes solid and rigid once dried and thus loses contact with other objects under deformation.

유연전자소자를 위한 차세대 유연 투명전극의 개발 동향

Flexible transparent conductive electrodes (TCEs) have recently attracted a great deal of attention owing to rapid advances in flexible electronic devices, such as flexible displays, flexible photovoltanics, and e-papers. As the performance and reliability of flexible electronics are critically affected by the quality of TCE films, it is imperative to develop TCE films with low resistivity and high transparency as well as high flexibility. Indium tin oxide (ITO) has been the most dominant transparent conducting material due to its high optical transparency and electrical conductivity. However, ITO is susceptible to cracking and delamination when it is bent or deformed. Therefore, various types of flexible TCEs, such as carbon nanotube, conducting polymers, graphene, metal mesh, Ag nanowires (NWs), and metal mesh have been extensively investigated. Among several options to replace ITO film, Ag NWs and metal mesh have been suggested as the promising candidate for flexible TCEs. In this paper, we focused on Ag NWs and metal mesh, and summarized the current development status of Ag NWs and metal mesh. The several critical issues such as high contact resistance and haze are discussed, and newly developed technologies to resolve these issues are also presented. In particular, the flexibility and durability of Ag NWs and metal mesh was compared with ITO electrode.