This study investigated the mechanical properties of fibre reinforced Printed circuit board using epoxy resin. The macroscopic interfacing of recognizable size with combination of more than unity of distinct materials which makes the composites utilized for their basic properties, In addition to the basic properties these composite structures are best used for their upgraded electrical, thermal and environmental properties. Present day composite materials are generally upgraded to improve the necessary properties of diverse applications. So, composite materials is a combination of different materials that binds together in the form continuous matrix constituent which makes it stringer and stiffer. Thus the composite material obtained is having superior properties than the single constituent. The load is shared between the different materials of the composite. The properties of the composite are optimized for their functional properties. It could be created from various blends of constituent that fits the necessary basic application. The composites created for auxiliary applications are further enhanced by materials which increase the required properties. Glass fibers are produced from blending of quarry products at 1600 C (Gl) fibre filaments diameter are ranging from 5-24μm. The idea of hybrid frameworks is utilized for its notable basic properties in engineering design. It is the motivation for reusing the E-waste in hybrid composite materials. Studies on E-waste reusing protects the environment. In this study PCB is the material uses along with woven glass fibre is fabricated and tested for its mechanical properties.
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