Thick film resistors consist basically of a conductor phase, a glass phase and an organic vehicle, which burns out during high temperature processing. In most contemporary resistor compositions the conductive phase is either RuO2 or ruthenates. In addition, some other oxides are added either as temperature coefficient of resistivity (TCR) modifiers or modifiers of the temperature coefficient of expansion (TEC) of glass phase [1–3]. Most thick film resistor materials are designed for printing and firing on alumina substrates. The main requirements for their characteristics are stability, relatively narrow tolerances of sheet resistivities, and a low temperature coefficient of resistivity (TCR). During firing the resistors are at the highest temperature (typically 850◦C) a relatively short time (typically 10 min). All the constituents of the resistor material react with each other, with the conductor termination and also with the substrate [4–6]. Due to the short time at firing temperature the reactions do not reach equilibrium so that the characteristics of fired materials are, to an extent, a compromise as the consequence of this frozen unequilibrium. If thick film resistors, intended for firing on alumina substrates, interact with other materials, for example with multilayer dielectrics or NTC materials (thick film resistors with high negative and nonlinear TCRs) this could influence the resistors’ characteristics, in most cases for the worse. This is probably due to the interaction between different materials although some authors ascribe this to a different TEC [6–9]. As already mentioned the TCR of thick film resistors is aimed to be as low as possible. However, some combinations of thick film materials have been reported to result in characteristics, which allow them to be used for some temperature sensor applications (7, 10, 11). To make a useful sensor the dependence of resistivity vs. temperature ought to be high enough (high TCR) and reasonably linear. Some combinations of resistor materials and multilayer dielectrics or NTC resistors resulted in these desired characteristics. This indicates a possible use of standard thick film pastes for making fairly useful and inexpensive temperature sensors. Note, however, that data reported in this letter are not the result of a systematic search for such combinations and that the mechanisms responsible for such “behavior” were not investigated. The thick film materials, which were used in different combinations, are listed in Table I. The nominal sheet resistivities of the resistors and NTC thermistors are 1 and 10 kohm/sq. For comparison, the PTC resistor (high positive linear dependence of resistivity vs. temperature) and the platinum based conductor are also included, but note that these two materials were not fired in combination with other materials. Thick film resistors (sheet resistivities 1 kohm/sq. and 10 kohm/sq.) are part of the Du Pont HS-80 resistor series. However, the materials denoted 80× 1 and 80× 9 (for example, 1 kohm/sq. resistors 8031 and 8029) differ in the conductive phase used as well as in the fired resistor microstructure. In order to observe the microstructure the fired resistors were mounted in epoxy in a cross-sectional orientation and then polished using standard metallographic techniques. Prior to analysis in the scanning electron microscope (SEM), the sample was coated with carbon to provide electrical conductivity and to avoid charging effects. A JEOL JSM 5800 SEM equipped with an energy dispersive X-ray analyser (EDS) was used for overall microstructural and compositional analysis.
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