Package Inspection Research Articles

Focus on materials

Focus on materials

Adherence of community caretakers of children to pre-packaged antimalarial medicines (HOMAPAK®) among internally displaced people in Gulu district, Uganda

BackgroundIn 2002, home-based management of fever (HBMF) was introduced in Uganda, to improve access to prompt, effective antimalarial treatment of all fevers in children under 5 years. Implementation is through community drug distributors (CDDs) who distribute pre-packaged chloroquine plus sulfadoxine-pyrimethamine (HOMAPAK®) free of charge to caretakers of febrile children. Adherence of caretakers to this regimen has not been studied.MethodsA questionnaire-based survey combined with inspection of blister packaging was conducted to investigate caretakers' adherence to HOMAPAK®. The population surveyed consisted of internally displaced people (IDPs) from eight camps.ResultsA total of 241 caretakers were interviewed. 95.0% (CI: 93.3% – 98.4%) of their children had received the correct dose for their age and 52.3% of caretakers had retained the blister pack. Assuming correct self-reporting, the overall adherence was 96.3% (CI: 93.9% – 98.7%). The nine caretakers who had not adhered had done so because the child had improved, had vomited, did not like the taste of the tablets, or because they forgot to administer the treatment. For 85.5% of cases treatment had been sought within 24 hours. Blister packaging was considered useful by virtually all respondents, mainly because it kept the drugs clean and dry. Information provided on, and inside, the package was of limited use, because most respondents were illiterate. However, CDDs had often told caretakers how to administer the treatment. For 39.4% of respondents consultation with the CDD was their reported first action when their child has fever and 52.7% stated that they consult her/him if the child does not get better.ConclusionIn IDP camps, the HBMF strategy forms an important component of medical care for young children. In case of febrile illness, most caretakers obtain prompt and adequate antimalarial treatment, and adhere to it. A large proportion of malaria episodes are thus likely to be treated before complications can arise. Implementation in the IDP camps now needs to focus on improving monitoring, supervision and general support to CDDs, as well as on targeting them and caretakers with educational messages. The national treatment policy for uncomplicated malaria has recently been changed to artemether-lumefantrine. Discussions on a suitable replacement combination for HBMF are well advanced, and have raised new questions about adherence.

Improving Farmers Attitude Towards Natural Resources Management in a Democratic and Deregulated Economy: Honey Production Experience in Oyo State of Nigeria

The study identified the production and management practices involved in honey production; investigated farmers' level of knowledge of honey production; and determined the attitude of farmers towards honey production. Eighty members of the Beekeepers' Association of Nigeria (BAN), Oyo State Chapter, were interviewed through the use of questionnaire in December 2003. The study identified site selection, housing of bees, routine inspection and prevention of swarming, harvesting, processing, packaging, marketing and record keeping as management practices among others. The result showed that the farmers possessed high level of knowledge of honey production (mean knowledge score = 32.5). The result of the hypothesis tested showed significant relationship between attitude of farmers and some selected attributes of knowledge such as source of knowledge (T=3.100); knowledge of ripe honey (T= -2.058); period of harvesting (T=3.497) and method of honey extraction from comb (T=3.008). Farmers in the study area had positive attitude towards honey production and management practice hence, measures should be taken to sustain the favourable attitude of farmers towards honey production.

거친 표면 형상측정을 위한 점광원 절대간섭계의 오차해석과 시스템 변수의 보

An absolute interferometer system with multiple point-sources is devised for tile 3-D measurement of rough surface profiles. The positions of the point sources are determined to be the system parameters that influence the measurement accuracy, so they are calibrated precisely prior to performing actual measurements. For the calibration, a CCD camera composed of a two-dimensional array of photo-detectors was used. Performing optimization of the cost function constructed with phase values measured at each pixel on the CCD camera, the position coordinates of each point source is precisely determined. Measurement results after calibration performed for the warpage inspection of chip scale packages (CSPs) demonstrate that the maximum discrepancy is 9.8 mm with a standard deviation o( 1.5 mm in comparison with the test results obtained by using a Form Taly Surf instrument.

LED Lighting Configurations for Visual Inspection of IC Packages

This article discusses configurations of light-emitting diode (LED) light sources for visual inspection of integrated circuit (IC) packages. A package visual inspection (PVI) system with multiple LED light sources used for inspection of IC packages was designed. The image contrast changes of the sample IC packages are explained using the Torrance-Sparrow (TS) model. A few conclusions on appropriate lighting configurations for inspection of various IC packages are achieved. The TS model can be used to represent the specular lobe component. The contrast between two surfaces with different surface roughness values increases with increasing θ i (incident light angle). Lighting C (θ i = 75°) is recommended for packages with high surface roughness heights and resin materials. Lighting B (θ i = 60°) is recommended for packages with moderate surface roughness heights and metal materials. If the background is white, the use of light sources A (θ i = 15°) and B simultaneously is recommended. Light sources A and C are recommended to be chosen for packages with low surface roughness values and transparent materials. The experimental results with the actual gray-level values of the images are compared to support the conclusions. The PVI system is part of an inspection machine. All images of the sample IC packages reported in this article were obtained from an actual production line. Therefore, the results are close to those of the actual inspection situation in the manufacturing industry.

Inspection of electronics packages using the efficient perception technique

When engineers choose and arrange proper lighting sources for an inspection system, many of them rely on their own experience or guesswork without any guidance of theories. This paper discusses the efficient perception technique, i.e. the Torrance‐Sparrow model and its application to the selection and configuration of light emitting diode (LED) lighting sources for a package visual inspection system. Inspection of several typical package samples has been evaluated. The image changes of the sample packages are explained using the Torrance‐Sparrow model. The experimental results with the actual gray level values of the images are compared.

エラストマー膜を介した電子パッケージの繰返しドライコンタクト超音波イメージング(J01-2 微細接続信頼性,J01 エレクトロニクス実装における熱制御および信頼性評価)

Dry-contact ultrasonic technique, which realizes the ultrasonic imaging without getting a sample wet, is a useful method for the inspection of electronic packages. In this study, we transmit high frequency ultrasound into the acrylic resin targets via four kinds of elastomer membranes with stability, and high durability, and select a membrane for cyclic ultrasonic imaging under a dry-contact condition. For recording high quality acoustic images, the membrane must satisfy the low ultrasonic attenuation and high acoustic coupling at the membrane/sample interface. Finally, we perform the cyclic ultrasonic imaging of an electronic package via the selected membrane, and repeatedly visualize the delamination in the package.

광산란 거친표면의 고정밀 삼차원 형상 측정을 위한 점회절 간섭계

최근 전자산업계에 새롭게 널리 생산되는 마이크로 전자부품들은 왜곡이 최소화된 정밀한 외관 형상을 갖도록 제조되고 관리되지만, 측정 대상의 표면이 가시광 영역에서 광산란되는 특징을 가짐으로 인해, 기존의 피죠나 마이켈슨 형태의 비교간섭법으로는 고정밀의 삼차원 형상측정이 용이하지 아니하였다. 본 논문에서는 광섬유를 이용한 새로운 개념의 점회절 간섭계를 제안하고, 이를 광산란 거친표면의 대표적인 제품인 칩패키지와 실리콘 웨이퍼의 삼차원 형상 측정에 적용하였다. 측정결과 66 mm 측정영역에서 측정 형상오차 PV(peak-to-valley value) 5.6 <TEX>$\mu\textrm{m}$</TEX>, 분산값(<TEX>$\sigma$</TEX>) 1.5 <TEX>$\mu\textrm{m}$</TEX>를 획득함으로써 기존의 비교 간섭 측정법에 비해 더욱 향상된 측정 정밀도를 획득하였다. We present a new point-diffraction interferometer, which has been devised for the three-dimensional profile measurement of light scattering rough surfaces. The interferometer system has multiple sources of two-point-diffraction and a CCD camera composed of an array of two-dimensional photodetectors. Each diffraction source is an independent two-point-diffraction interferometer made of a pair of single-mode optical fibers, which are housed in a ceramic ferrule to emit two spherical wave fronts by means of diffraction at their free ends. The two spherical wave fronts then interfere with each other and subsequently generate a unique fringe pattern on the test surface. A He-Ne source provides coherent light to the two fibers through a 2<TEX>${\times}$</TEX>l optical coupler, and one of the fibers is elongated by use of a piezoelectric tube to produce phase shifting. The xyz coordinates of the target surface are determined by fitting the measured phase data into a global model of multilateration. Measurement has been performed for the warpage inspection of chip scale packages (CSPs) that are tape-mounted on ball grid arrays (BGAs) and backside profile of a silicon wafer in the middle of integrated-circuit fabrication process. When a diagonal profile is measured across the wafer, the maximum discrepancy turns out to be 5.6 <TEX>${\mu}{\textrm}{m}$</TEX> with a standard deviation of 1.5 <TEX>${\mu}{\textrm}{m}$</TEX>.

516 エラストマー層を介した高分解能ドライコンタクトパッケージ検査

516 エラストマー層を介した高分解能ドライコンタクトパッケージ検査

Package inspection software applications for in-sight vision sensors

Package inspection software applications for in-sight vision sensors

Terahertz imaging comes into view

Imaging technology is becoming increasingly prevalent in our society. X-ray scanners are routinely used to examine luggage at airports, for example, and most hospitals are equipped with ultrasound scanners and magnetic resonance imaging machines. There is also a wealth of other less well known applications throughout industry. For instance, X-rays are used for package inspection, while the defects or voids in materials on production lines are often probed using microwaves or ultrasound.

Printing and packaging inspection seminar proceedings available

Printing and packaging inspection seminar proceedings available

Evaluation of defects in the seal region of food packages using the ultrasonic contrast descriptor, ΔBAI

A rapid, dependable method of on-line package inspection will allow wider implementation of energy- and material-efficient retortable pouches and trays, by reducing inspection costs. To evaluate high-frequency ultrasonic imaging as a sensing method, the 17·3 MHz ultrasonic pulse-echo Backscattered Amplitude Integral (BAI) method was used to visualize and evaluate major defects (channels and product inclusions, which compromise the seal integrity and must be reliably inspected) in the seal area of flexible food packages. The focus of this study was to evaluate the image contrast, denoted ΔBAI, for various packaging materials, defect types and sizes. Channel (6–100 µm in diameter) and inclusion defects (strands of mouse tail tendons, 20–150 µm) were created in the seal area of all-plastic and foil-containing packaging films. It has been shown that there is a direct relationship between the defect size and ΔBAI value, and that different defect types and packaging materials have a significant impact on the ΔBAI value. The utility of ΔBAI for detecting defects makes it a useful and reliable sensing method for package inspection. Copyright © 1999 John Wiley & Sons, Ltd.

Evaluation of defects in the seal region of food packages using the ultrasonic contrast descriptor, ΔBAI

A rapid, dependable method of on-line package inspection will allow wider implementation of energy- and material-efficient retortable pouches and trays, by reducing inspection costs. To evaluate high-frequency ultrasonic imaging as a sensing method, the 17·3 MHz ultrasonic pulse-echo Backscattered Amplitude Integral (BAI) method was used to visualize and evaluate major defects (channels and product inclusions, which compromise the seal integrity and must be reliably inspected) in the seal area of flexible food packages. The focus of this study was to evaluate the image contrast, denoted ΔBAI, for various packaging materials, defect types and sizes. Channel (6–100 µm in diameter) and inclusion defects (strands of mouse tail tendons, 20–150 µm) were created in the seal area of all-plastic and foil-containing packaging films. It has been shown that there is a direct relationship between the defect size and ΔBAI value, and that different defect types and packaging materials have a significant impact on the ΔBAI value. The utility of ΔBAI for detecting defects makes it a useful and reliable sensing method for package inspection. Copyright © 1999 John Wiley & Sons, Ltd.

High-speed surface measurement using a nonscanning multiple-beam confocal microscope

This paper describes a high-speed surface measurement system for in-line semiconductor package inspections. The system features the following three points in construction. One is an optics for con- focal imaging. We call the optics a nonscanning multiple-beam confocal microscope. The microscope can get a confocal image in a short time because XY-scanning, which is required in conventional confocal microscopes, is not needed. Two is the algorithm that performs accurate reconstruction of the object surfaces from a few confocal images. The last is a mechanism that performs shifts of the focused plane of the microscope quickly. The experimental system can cover the measurement area of 9.6x9.6x0.64 mm and can measure that area in less than 0.4 s with an accuracy of about 1 µm.

The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies

We propose complementary solutions to improve the evaluation of PCB under specific stresses using electrical and physical indicators adapted to a given part of the board. For ceramic capacitors, the residual piezoelectricity provides an impedance signature at resonance allowing detection of local physical defects. Solder joint fatigue criticity under a thermal cycle can be predicted using combined analytical and FEM simulations, while the lead phases coarsening provides a good early degradation indicator. Finally, the ball inspection of BGA packages using shear waves in scanning acoustic microscope lead to an interesting improvement of resolution.

Ultrasonic Imaging of Micro‐Leaks and Seal Contamination in Flexible Food Packages by the Pulse‐Echo Technique

ABSTRACTReliable inspection of flexible food packages for micro‐leaks and product contamination in the seal area is needed to prevent spoilage and safety hazard. Nondestructive testing by the ultrasonic imaging method, Backscattered Amplitude Integral (BAI), was evaluated for use in defect detection. Channel defects (6–15 μm in diameter) and simulated food strands (20–60 μm dia) perpendicular to the sealing direction were fabricated within the seal region of both all‐plastic and foil‐containing retortable pouches. Results showed that 17.3‐MHz pulse‐echo BAI‐imaging detected channel defects (9.5–15 μm) and all strand‐inclusion defects in both types of package materials.

Development of axial laminographic system for electronic packaging inspection

X‐ray laminographic image can provide more useful information about the internal state of electronic packaging than x‐ray radiographic image does. Many kinds of laminographic system have been developed for obtaining the cross‐sectional image. Proposes an axial laminographic system, which can be constructed by usual automatic radiographic system without any rotating x‐ray head and detector system. Explains that this method can be implemented to make the usual radiographic x‐ray inspection system equal to the power of a laminographic system.

Pinhole inspection machine for sealed packages: for detection of pinholes of 0.5 μm or below

One of the most important processes in the food and pharmaceutical industries is the leakage detection of sealed packages to prevent pollution by bacteria. A high frequency, high voltage method is used as a highly reputed method for high accuracy inspection of ampoules and sealed food packages for pinholes. This paper outlines a pinhole inspection machine. © 1997 John Wiley & Sons, Ltd.

High-speed automated inspection of IC packages for hidden internal defects

Failures of plastic packaged ICs can result from either one of two causes: chip-level defects or internal packaging defects. Chip-level defects are readily identified by electrical tests, but packaging defects (delaminations, disbonds, cracks, voids, and the (like) often cause no immediate electrical disruption and therefore cannot be detected by electrical tests. A die face delamination, for example, may be both undetected and harmless until it expands as a result of thermal cycling and causes a field failure.