Microelectromechanical Systems Inertial Sensors Research Articles

Out with the old in with the new

Abstract The materials issues facing the microelectromechanical systems (MEMS) community can be understood best in terms of the historical context. The field began almost as an afterthought among those engaged in integrated circuit production. These researchers recognized early on that the same processes used in the production of circuits could be re-ordered to make very small mechanical devices. The huge investment made by the electronics community in silicon technologies — and the relative ease with which these techniques could be adapted to device production — made them an obvious resource for early MEMS designers. It is no accident that polycrystalline silicon is the most commonly used structural material. But with the continued expansion of MEMS devices into new areas of application, the limitations of silicon (Si) usefulness became clear. The need to combine electronics and MEMS on the same chip ( iMEMS ), improve the wear characteristics of moving parts, and achieve a greater mass of moving parts in MEMS inertial sensors have led researchers away from a ‘one-material-fits-all’ approach. Instead the search is on for materials that more directly serve specific ends. The need for biocompatibility in the emerging field of bio-MEMS has added urgency to the quest for new materials, since Si-based materials cannot meet every bio-MEMS need.

Tailoring of Stress Development in MEMS Packaging Systems

ABSTRACTA better understanding of the origin and evolution of the stresses is a crucial step in improving reliability of packaging systems for microelectromechanical systems (MEMS). Given its importance, we examine the stresses developed in hermetically packaged MEMS inertial sensors. For this purpose, an optical surface profilometer is employed to assess the stresses by measuring the curvature of dummy silicon dies (3.5×3.5 mm2) assembled in different types of packages and die attach adhesives. We also explore a temporal evolution of stresses during thermal exposure of the test packages in an effort to emulate actual packaging processes and device operation conditions. The result shows different levels of stresses generated from various adhesives and package types, and also a stress evolution during packaging processes. The mechanical stress data also show a good agreement with MEMS performance data obtained from actual accelerometers. Therefore, the stress data will not only be useful in better understanding performance of MEMS packages, but the testing protocol can also provide a diagnostic tool for very small packaging systems.