Copper is a valuable catalyst that is widely used in electrochemical devices, particularly in the generation of clean, renewable energy and the CO2 reduction reaction (CO2RR). Gaining insight into the fundamentals of corrosion/deposition of Cu in an electrochemical cell can aid in the design of more durable and efficient devices. To take advantage of the capabilities of Cu and comprehend the broader impacts, it is crucial to understand the kinetics of nucleation and adsorption mechanisms and conduct a thorough investigation of the underlying principles. Here, we utilize a model system with Cu underpotential deposition (UPD) on an Au(111) electrode surface in sulfuric acid electrolyte and investigate the impact of temperature change on the kinetics of Cu corrosion/deposition. The Transient technique, chronoamperometry, is employed to differentiate and illustrate the effects of the nucleation process and adsorption of ions. At temperatures below 20°C, peaks indicate the nucleation and adsorption processes can be identified individually. At temperatures 20°C and above, more adsorption characteristics are seen which may be due to the interactions between less-ordered monolayers at the interface, further demonstrated by the loss of nucleation characteristics. Electrochemical devices operate across a wider temperature range in practical uses. The aim of this study is to examine and quantify the influence of temperature on the nucleation and adsorption mechanisms for the kinetics of Cu in order to optimize the durability of Cu-containing electrochemical devices.
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