In this article, we research the performance degradation of a MEMS flow sensor with accelerated degradation testing (ADT). The degradation of temperature stress (Ts) on sensor is studied. Based on the performance in the aging test, resistance degradation ∆R is selected as a more suitable degradation characteristic parameter. Furthermore, the degradation process of the characteristic parameter results from resistivity decreases, in which Ts leads to stress relief within the bulk of the resistor. By implementing the Constant-stress accelerated degradation test (CSADT), we estimate the lifetime of this MEMS flow sensor based on the Arrhenius model. The calculated lifetime is 6.833 years for the 120°C group, 3.942 years for the150°C group, and 2.492 years for the180°C group. In addition, using statistics analysis, the Weibull distribution (WD) is proved to be the better mode for the MEMS flow sensor acceleration life with the Anderson-Darling (AD) being 235.910. The scale and shape of WD was evaluation. On the other hand, to verify the rationality of the distribution, the Standard residual error method and the Cox-Snell residual error method have been used separately, to perform the Goodness-of-fit tests. The AD value of Standard residual error and Cox-Snell residual error is 3.476. It proves that the selected life distribution model of this MEMS flow sensor is befitting. Finally, in this research the CSADT results are original and novelty. The lifetime distribution results reveal that considering the Goodness-of-fit tests can significantly improve the accuracy of reliability analysis of this MEMS flow sensor. Based on those results, a reliability method for this MEMS flow sensor is established.
Read full abstract