Joint Reliability Research Articles

The influences of microstructural length scale on the tensile properties and deformation mechanisms of Sn-3.0Ag-0.5Cu solder alloys

Optimizing microstructures remains critical for improving the reliability of Pb-free solder joints, especially in applications with high failure risks. The mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder alloys is intricately linked to the length scale of the initial microstructure. This paper investigates the effects of microstructure refinement on uniaxial tensile properties, nanomechanical response, plastic deformation, and fracture using directional solidification techniques. The findings demonstrate that controlling the microstructure can effectively enhance mechanical properties, dynamic recrystallization, and intragranular deformation in SAC305 alloys. Furthermore, the study explores heterogeneous plastic deformation and the interaction between eutectic intermetallics and β-Sn. These results offer valuable insights for optimizing microstructures to achieve superior solder joint performance.

Thick-wire GMAW for fusion welding of high-strength steels

The paper describes a high-current Gas Metal Arc Welding (GMAW) process using wire electrodes with diameters up to 4.0 mm for single-pass full penetration butt joint welding of 20 mm thick steel plates. Fundamental research aims to develop thick-wire GMAW into a high-efficiency method by identifying the limits of welding performance and achievable deposition rates. Current gaps in understanding include equipment requirements, process properties, application fields, and weld quality. The research project addresses these gaps through systematic investigations of basic technological analyses, application sample welding, and quality evaluations. The objective was to create a robust, cost-efficient gas-shielded high-performance welding technology with deposition rates comparable to Submerged Arc Welding. The fully mechanized, automatic welding setup included two parallel-connected welding power sources, one wire feeder and one high-power welding torch. Welding parameters and conditions were evaluated with the aim of achieving a high-quality weld. Optimal parameters were identified for one-sided single-pass welding on 20 mm thick plates. Validation of thick-wire GMAW for 20 mm thick high-strength steels was conducted via two-sided single-pass welding on S690Q grade plates. Testing of the weld joint included static tensile strength test (3x tensile specimen), a Charpy impact test at −40 °C (6x Charpy V-notch specimens respectively with notch position in weld metal, base material and heat-affected zone (HAZ)), microstructure examination and a hardness test. The lowest recorded impact energy was observed to be 50 J within the weld metal, in combination with hardness peaks in the HAZ reaching 415 HV1, and all tensile specimens failing outside the HAZ within the base material. The process achieved reliable, reproducible, and economical joint welding, meeting necessary mechanical-technological quality standards. The paper enhances the understanding of selected welding techniques tor thick plate joining and offers valuable industrial insights, demonstrating the technique's applicability and feasibility for high-strength applications.

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.

In this work, epoxy was added into commercial Sn-3.0Ag-0.5Cu (SAC305) solder paste to enhance the thermal cycling reliability of the joint. The microstructure and fracture surface were observed using a scanning electron microscope/energy dispersive spectrometer (SEM/EDS), and a shear test was performed on the thermally cycled joint samples. The results indicated that during the thermal cycling test, the epoxy protective layer on the surface of the epoxy-enhanced SAC305 solder joint could significantly alleviate the thermal stress caused by coefficients of thermal expansion (CTE) mismatch, resulting in fewer structural defects. The interfacial compound of the original SAC305 solder joints gradually coarsened due to the accelerated atomic diffusion, but epoxy-enhanced SAC305 solder joints demonstrated a thinner interfacial layer and a smaller IMC grain size. Due to the reduced stress concentration and the additional mechanical support provided by the cured epoxy layer, epoxy-enhanced SAC305 solder joints displayed superior shear performance compared to the original joint during the thermal cycling test. After 1000 thermal cycles, Cu-Sn IMC regions were observed on the fracture surfaces of the original SAC305 solder joint, exhibiting brittle fracture characteristics. However, the fracture of the SAC305 solder joint with 8 wt.% epoxy remained within the solder bulk and exhibited a ductile fracture mode. This work indicates that epoxy-enhanced SAC305 solder pastes display high thermal cycling reliability and could meet the design needs of advanced packaging technology for high-performance electronic packaging materials.

An efficient synergistic double-sided friction stir spot welding method: A case study on process optimization, interfacial characteristics and mechanical properties of 2198-T8 aluminum‑lithium alloy joints

Friction stir spot welding has important applications in the joining of thin metallic plates. However, the asymmetric thermomechanical action inherent in the single-sided friction stir spot welding inevitably generates the hook defect at the joint interface, and the defect deteriorates with the improvement of the interfacial metallurgical bonding, which causes the irreconcilable contradiction and significantly restricts the breakthrough of the process stability and welding efficiency. The synergistic double-sided probeless friction stir spot welding (SDP-FSSW) technology proposed in this study adopts a dual-axis synergistic control system, which introduces intense plastic deformation from both sides of the interface to form a wavy hook by accurate axial motion during the welding process. This innovative process solves the problem of hook warpage while realizing rapid metallurgical bonding and mechanical interlocking at the interface, thus obtaining AA2198-T8 aluminum‑lithium alloy spot joints with a tensile/shear strength exceeding 9kN in a short dwell time (0–3 s). Through response surface methodology, the optimal process parameters are identified, i.e. rotation speed of 603 rpm, dwell time of 3 s, and plunge depth of 0.26 mm, at which condition the average joint strength is 13.0 ± 0.5kN, a 47 % increase compared to an optimized joint of single-sided probeless friction stir spot welding (8.9kN). The optical microscope examination shows that the wavy hook can be adjusted by the rotation speed and the higher rotation speeds will make the wave disappear and produce an approximately straight interface. The fractographic analysis shows that the wavy hook can inhibit crack propagation and has good mechanical interlocking effect, but the flat hook at high rotation speeds leads to crack propagation directly along the interface, and the failure mode is changed from plug-pull fracture to interfacial fracture. Therefore, the joint strength at 1000 rpm is only 7.0kN, which decreases by about 47 % compared with the optimal strength. The electron backscattering diffraction analysis shows that continuous dynamic recrystallization occurs in the hook region and good metallurgical bonding is formed, and there are also some discontinuous dynamic recrystallized grains distributed between the large grains due to the larger strain rates and lower temperature at the interface during the SDP-FSSW process. It has been found that the wavy hook with good metallurgical bonding and mechanical interlocking can be introduced in spot welded joints by controlling the interface forming, which is a viable method to create high quality, efficient and reliable spot joints.

Validity of Valor Inertial Measurement Unit for Upper and Lower Extremity Joint Angles.

Inertial measurement units (IMU) are increasingly utilized to capture biomechanical measures such as joint kinematics outside traditional biomechanics laboratories. These wearable sensors have been proven to help clinicians and engineers monitor rehabilitation progress, improve prosthesis development, and record human performance in a variety of settings. The Valor IMU aims to offer a portable motion capture alternative to provide reliable and accurate joint kinematics when compared to industry gold standard optical motion capture cameras. However, IMUs can have disturbances in their measurements caused by magnetic fields, drift, and inappropriate calibration routines. Therefore, the purpose of this investigation is to validate the joint angles captured by the Valor IMU in comparison to an optical motion capture system across a variety of movements. Our findings showed mean absolute differences between Valor IMU and Vicon motion capture across all subjects' joint angles. The tasks ranged from 1.81 degrees to 17.46 degrees, the root mean squared errors ranged from 1.89 degrees to 16.62 degrees, and interclass correlation coefficient agreements ranged from 0.57 to 0.99. The results in the current paper further promote the usage of the IMU system outside traditional biomechanical laboratories. Future examinations of this IMU should include smaller, modular IMUs with non-slip Velcro bands and further validation regarding transverse plane joint kinematics such as joint internal/external rotations.

Finite element analysis of bolted joints under torsional loads

The presence of service torque, which is generated after tightening, directly affects the mechanical properties of bolted joint. In this work, the mechanical behavior of bolted joints under torsional loads is investigated using finite element analysis (FEA). Models with two plates and multiple plates are established separately to investigate the mechanical properties of different kinds of bolted joints. Three analysis steps involving the entire process from tightening to torsional loading are adopted, namely tightening step, initial loss step and loading step. Torsional loads in two directions along the thread axis are considered and defined as loosening torsional load and tightening torsional load. The clamping force, as well as the friction torques of various contact surfaces, of the bolted joint are extracted in all the analysis steps. Different scenarios of friction torque combinations for bolted joints are obtained by means of adjusting the friction coefficient of the corresponding contact surfaces. On this basis, the mechanical properties of bolted joints and the corresponding torque thresholds are extracted on various scenarios. FEA results showed that how the service torque makes the directional characteristic of the mechanical properties of bolted joints under torsional loads. Moreover, the service reliability of bolted joint can be further improved based on the directional characteristics and the extracted torque thresholds.

Improving the Reliability of Pipe End Joints Using Shape Memory

Improving the Reliability of Pipe End Joints Using Shape Memory

Impact Resistance Performance and Damage Characteristics of Mortise-and-Tenon Joint Prefabricated Bridge Piers

The mortise-and-tenon joint prefabricated connection combines the assembly form of mortise-and-tenon joints and cast-in-place wet joints. It achieves reliable joint connections through small joint depths and lap-spliced reinforcement lengths. To study the impact resistance and damage characteristics of the assembled pier, a nonlinear finite element analysis was performed on the assembled and monolithic pier model piers to study the effects of mortise-and-tenon joint depths, lap reinforcement, and grout on the response of the piers to vehicle impact. The results showed that, after impact, the damage to the prefabricated pier was similar to that of the monolithic one. The failure mode involved opening of the seam at the impact face-pier bottom junction and localized concrete compression at the back-impact face pier bottom, and damage accumulated from the column base towards the column centerline. The mortise-and-tenon joint provided substantial horizontal constraint for the pier, imparting excellent resistance to lateral stiffness. Consequently, both piers showed nearly identical peak impact forces, yet the prefabricated pier exhibited a lesser degree of bending deformation compared to the monolithic one. The depth of the mortise-and-tenon joints was a critical factor affecting the impact response of the prefabricated bridge pier. When the depth reached 0.4D or more, it ensured good impact resistance and joint connection, enhancing energy absorption capability and reducing pier damage. The length of lap-spliced reinforcement significantly affected the overall integrity of prefabricated component connections. Lap lengths of 10d or more greatly reduced the probability of failure in the connection between pier columns and cap beams, lowering damage to the pier columns, joints, and pier cap beams, thus ensuring good impact resistance. The diameter of the lap-spliced reinforcement and the elastic modulus of the grouting material affected the local stiffness near the joints. Increasing the diameter of the lap-spliced reinforcement appropriately prevented excessive local damage, while altering the elastic modulus had minimal impact on improving pier damage.

A bidirectional-modification strategy for enhancing the reliability of thermoplastic-metal hybrid joint from atomic-scale

In this study, a strategy towards thermoplastic-metal hybrid joint via bidirectional modification for high reliability was designed. The chemical bond behavior and conditions at the interface were explored from atomic scale using density functional theory (DFT) calculation. Based on the bonding mechanism, the AZ31B alloy was oxidized and the carboxyl groups (COOH) were introduced in the resin chain to improve the strength of chemical bond. The mechanical property of the designed joint was significantly improved and the tensile-shear strength achieved 22.7 MPa after bidirectional modification, reaching 4.5 times that of untreated joints. It was mainly attributed to the generation of metal-carboxylate bridging complex—a typical strong coordination bond formed between two O atoms in COOH and two diagonal magnesium atoms in MgO. Experimental evidence also suggested the generation of new chemical bond at the CFRTP/AZ31B interface. Finally, the bidirectional modification was proved to be an efficient and reliable method with high industrial adaptability. The current work opened up a novel direction for reliability promotion of thermoplastic-metal hybrid structures.

Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability

Hybrid solder joints incorporating the Sn-3.0Ag-0.5Cu/Sn–58Bi structure have been studied to tackle challenges such as warpage, thermal degradation, and excessive intermetallic compound (IMC) growth in heterogeneous integrated packages. However, the presence of Bi diminishes drop impact reliability, and conventional reflow processes aimed at increasing the Bi mixing ratio exacerbate IMC growth. This study investigates the feasibility of intense pulsed light (IPL) soldering for hybrid solder joints on electroless nickel immersion gold (ENIG) and (electroless nickel electroless palladium immersion gold (ENEPIG) PCB substrates, with the goal of advancing reliable and sustainable electronic packaging technology. Microstructural evolution and drop impact reliability of IPL-soldered joints were compared with those of conventionally reflow-soldered joints. Specifically, IPL soldering exhibited approximately sixfold higher drop impact reliability in ENIG and threefold in ENEPIG compared to reflow soldering under the lowest temperature conditions. This underscores IPL's effectiveness in suppressing interfacial reactions, thereby promoting crack propagation in the SnBi phases. Furthermore, under optimized IPL conditions on the ENEPIG substrate, drop reliability was approximately threefold higher than that achieved under the lowest temperature conditions, despite lower power consumption of 13.36 kWh. These findings demonstrate the potential feasibility of IPL soldering as a reliable and sustainable technology for electronic packages.

Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate

PurposeThe reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.Design/methodology/approachIn this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.FindingsWhen the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu3Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu3Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.Originality/valueThe addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu3Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.

Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly

PurposeThe study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By comparing Sn58Bi and SAC305 particles and varying substrate widths, the research sought to provide insights into the stability and performance of solder joints under different scenarios, particularly in high-power applications.Design/methodology/approachThe study used a comprehensive design/methodology, encompassing the investigation of solder conductive particle types (Sn58Bi and SAC305) and substrate widths on the current carrying capability of FOB assembly. Stable solder joints were obtained by manipulating the curing speed of anisotropic conductive films for both particle types. Various tests were conducted, including current carrying capability assessments under differing conditions.FindingsThe study revealed that larger substrate widths yielded higher current carrying capability due to increased contact area and reduced contact resistance. Notably, solder joints remained stable beyond the solder melting temperature due to encapsulation by cured epoxy resin. SAC305 solder joints exhibited superior current carrying capability over Sn58Bi in continuous high-voltage conditions. The results emphasized the stability of SAC305 solder joints and their suitability for robust interconnections in high-power FOB assemblies.Originality/valueThis study contributes by offering a comprehensive assessment of the impact of solder particle types and substrate widths on solder joint performance in FOB assemblies. The finding that SAC305 joints outperform Sn58Bi under continuous high-voltage conditions adds significant value. Moreover, the observation of stable solder joints beyond solder melting temperature due to resin encapsulation introduces a novel aspect to solder joint reliability. These insights provide valuable guidance for designing robust and high-performance interconnections in demanding applications.

Achieving a High‐Strength Bonding between Aluminum Alloys and Polymer Composites via Self‐Riveting Welding

Great challenges exist in producing reliable welding between metals and polymer composites. In this study, self‐riveting welding (SRW) is employed to obtain metal–polymer hybrid joints with high load‐bearing capability. In this investigation, it is shown that the SRW joints with a prefabricated hole of 5.8 mm in diameter are characterized by fewer void defects with sufficient polymer filling, a tightly bonded joint interface, and a relatively uniform stress distribution along the joint interface during the tensile test, leading to the high load‐bearing capability of the SRW joints. The maximum average tensile force is 1.5 kN. The fracture occurs across the polymer composite rather than along the joint interface. In the results, it is shown that SRW has the potential to be developed into a method for fabricating reliable hybrid joints for the aerospace and automotive industries.

Microstructure, joining mechanism, mechanical properties and optimization of inactive solder (Sn9Zn) in low temperature ultrasonic soldering of AlN ceramics and 2024Al

With the development of the electronic packaging industry, there is an increased demand for enhanced strength in DBA substrates. Ultrasonic soldering technology allows low-temperature joining of ceramic-metal materials under ambient air conditions. In this paper, we successfully achieved the joining between AlN ceramics and 2024Al using Sn9Zn solder and ultrasonic soldering technique, while also analyzing the joining mechanism through Comsol software simulations. It was observed that under the appropriate ultrasonic amplitude and frequency, the Sn9Zn solder exhibited complete wetting with both base materials, resulting in reliable joints. Building upon this finding, the conventional Sn9Zn solder was further optimized by adding Sb element. The addition of Sb element led to the formation of Zn4Sb3 phase and β-Sn(Sb) phase with Sb acting as solute. Among them, the generation of β-Sn(Sb) solid solution phase effectively improved the joint strength. The maximum joint strength was achieved at an average value of 75.066 MPa when the Sb content reached 1 wt. %. At this point, the failure occurred within the AlN ceramic base material.

Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing

Cu pillar bump (CPB) technology as the representative advanced packaging technology possesses the characteristics of miniaturization and high density, thus playing an important role in the reliability of electronic devices. However, the brittle intermetallic compound (IMC) layer in the joints evidently affects the service performance and reliability of CPB joints. Thus, the influence of IMC layer thickness and microstructure needs to be carefully evaluated. In this study, the reliability of CPB joints with different IMC layer thickness under the condition of isothermal storage and room-temperature electromigration was tested, and the effect of initial IMC thickness of joints on the reliability was revealed. The full-IMC joints have the best isothermal storage reliability while the half-IMC joints perform the worst. Meanwhile, the thin-IMC joints own the best electromigration reliability but the full-IMC joints show the worst because that the initial voids in full-IMC joints accelerate the failure caused by electromigration.

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.

In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques. Commercial SAC305 solder balls were used to ensure consistency. LAB increases void fractions and coarsens the primary β-Sn phase with higher laser power, resulting in a larger eutectic network area fraction. In contrast, MR produces solder joints with minimal voids and a thicker intermetallic compound (IMC) layer. LAB-formed joints exhibit higher high-speed shear strength and lower brittle fracture rates compared to MR. The key factor in the reduced brittle fracture in LAB joints is the thinner IMC layer at the joint interface. This study highlights the potential of LAB in enhancing the mechanical reliability of solder joints in advanced electronic packaging applications.

Intermetallic Compounds in Solder Alloys: Common Misconceptions

Intermetallic compounds (IMC) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in the substrate. IMCs also can form within the bulk solder as the joint solidifies. IMCs have critical roles in the solder joint quality and reliability. Unlike most metal alloys, an intermetallic compound typically has a fixed stoichiometry and is in variance with the conventional phases or constituents in the metal system (e.g., alpha and beta). IMCs have a different crystal structure than any of its constituents and some but never all the characteristics and properties of its constituents. Ductility is an important solder joint property, and the low intrinsic ductility of IMCs is associated with brittle behavior and reliability risk in service. However, a review of published solder field failures shows little evidence that IMC properties or IMC evolution under service conditions reduce solder joint reliability. Most IMC-induced solder joint failures are found to result from incorrect material specification or uncontrolled soldering processes. This paper describes the IMCs that occur typically in eutectic, Sn63Pb37 solder and near-eutectic SAC305 or other tin-based Pb-free solder alloys, including how they impact solder joint reliability. The paper also describes the potential impact of IMCs on the solder joint reliability for the newest generation of Pb-free high-performance solder alloys.

Durability of anticorrosive-coated steel–carbon fiber reinforced polymer structural adhesive joint at high temperature and humidity

Limited information on the long-term reliability of structural adhesive joints hinders their practical application. Moreover, performance improvement in transportation equipment and the solution of concrete problems, such as high strengthening, vibration reduction, and weight saving, are expected by increasing the availability of materials in the shipbuilding industry using highly functional materials that are not welded. This study evaluated the durability of second-generation acrylic (SGA) structural adhesives. The strength of SGA was higher than that of epoxy-based adhesives in the case of thick adhesive layers, and few fluctuations were observed in the strength owing to variations in the adhesive-layer thickness. The static strength following environmental degradation was evaluated using a tensile lap shear structural adhesive joint coated with an anticorrosive coating, assuming application to the exposed part. The acceptable design adhesive strength in shipbuilding was evaluated using the strength retention rate ηd (mean strength after deterioration/initial mean strength) and coefficient of variation CV (standard deviation/mean strength) after deterioration. ηd for each test was greater than 72 %. The CV value for each test was <0.16; this is equivalent to a coefficient of dispersion of deterioration Dy ≥ 0.41 on percent defects allowed = 1/10,000 (upper limit of the defect rate assumed at the design stage). This result indicates that the adhesive joint is available even for the exposure section, if the adhesive joint is protected similar to adherend steel with anticorrosive paint, which is common in the field of shipbuilding.

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Abstract This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile. Applying the Darveaux solder joint reliability assessment, simulations consider lead-based (63Sn37Pb and 62Sn36Pb2Ag) and lead-free (SAC105, SAC305, and SAC405) solder alloys under temperature profiles: 0°C (Tmin) to 100°C (Tmax), −40°C to 85 °C, −40 °C to 125 °C, and −40 °C to 150 °C. Results indicate that SAC305 exhibited the highest equivalent stress, while 63Sn37Pb demonstrated the highest plastic strain and creep strain energy density. SAC105 displayed the lowest stress and strain parameters. Moreover, increasing the thermal cycling temperature range intensifies stress, strain, and damage parameters, with −40 °C to 150 °C showing the highest magnitudes. SAC405 exhibited superior thermal fatigue life compared to other alloys, with its cycles to failure outperforming 63Sn37Pb, SAC105, 63Sn36Pb2Ag, and SAC305 by 16832, 11992, 6218, and 3601 cycles, respectively. Lower temperature ranges enhance thermal fatigue life, with 0 °C to 100 °C recording 8%, 33%, and 53% higher life than −40 °C to 85 °C, −40 °C to 125 °C, and −40 °C to 150 °C, respectively. Notably, higher silver content and lower temperature ranges were associated with increased thermal fatigue life, providing valuable insights for BGA solder joint reliability enhancement.

Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging

Today’s 3D electronic packaging is characterized by smaller size and higher functional density, which generally require multiple reflow cycles. However, due to the Ostwald ripening process of the interfacial intermetallic compound (IMC), the solder joint’s strength would decrease as the number of reflow cycles increases. To address this, we developed a novel composite solder by incorporating nickel-coated carbon fiber (Ni@CF) into the Sn–3.0Ag–0.5Cu (SAC305) solder connection. The study showed that Ni@CF effectively enhanced the stability and reliability of solder joints during multiple reflow processes. Compared with Ni@CF-free equivalents, Ni@CFs promoted the nucleation of interfacial IMC during the solid–liquid reaction and inhibited Ostwald ripening, leading to a refinement of the interfacial IMC grains. As a result, the interface was strengthened, and the shift of shear fracture to the brittle interface seen in the SAC305 solder joint with multiple reflows did not occur in the composite solder joint. Furthermore, carbon fiber strengthened the solder matrix through the load transfer and shear-off mechanisms, depending on its inclination angle with the shear plane. Consequently, the Ni@CFs-reinforced solder joints maintained a shear strength of over 42 MPa throughout ten reflow cycles, while the pristine SAC305 solder joint exhibited decreased shear strength to 33 MPa. This study provides new insights into composite solder joints’ stability and reinforcement characteristics when subjected to multiple reflows.