Due to the poor machinability of SiCf/SiC parts in machining, many problems are caused, such as low machining efficiency, poor machining quality and high processing cost, which seriously limit its manufacturing and application. A novel process ultrasonic vibration assisted milling with laser ablation pretreatment (UVAMLAP) was proposed to optimize the fatigue performance and machining efficiency of SiCf/SiC parts. This process was used to fabricate specimens, which were then tested for tensile strength and fatigue performance. The results show that UVAMLAP could enhance surface quality, and increase the tensile strength and residual tensile strength of the sample by 9.4% and 13.5%. This process can avoid damage aggravation in the initial stage of failure, weaken matrix fracture and interface debonding velocity, and reduce fatigue performance degradation caused by machining damage. In addition, comprehensive evaluation based on multi-dimensional indicators such as milling quality, machining efficiency and tool cost for machining strategy was carried out by taking tensile sample machining as an example. The UVAMLAP process can not only improve the machined surface quality, but also reduce the machining time by 31.3% and the tool cost by 75%. Therefore, UVAMLAP provides a feasible process scheme for high-efficiency and low-damage machining of SiCf/SiC parts.
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