Infrared Detection Modules Research Articles

Design of High-Precision Infrared Photoelectric Sensor and Its Adoption in Soft Package Counting Management in Workshop

As an imperative part of information technology, photoelectric information technology is widely applied in smart phones, mobile computers, portable electronic products, medical care, and industrial technology. In this research, a high-precision infrared photoelectric sensor is designed, which utilizes XDU3093 chip as a built-in photoelectric sensor. The chip has the characteristics of high-power supply rejection ratio and temperature compensation. Then, the focus is on the design of infrared driving module and infrared detection module. Among them, the pulse current of the infrared drive module is more than 100 mA, and the output current is in the form of square wave. To control noise, an isolation circuit between the infrared drive and other modules is set. Infrared detection involves photoelectric sensor. The nwell diode in CMOS process is utilized as photosensitive diode, and at the same time, the surface of the diode is coated to ensure that only infrared light can generate photocurrent through coating. In the experiment, the infrared driver is simulated, and the results show that the driver module can effectively amplify the collected infrared signals, and the detection accuracy reaches 0.2 V. The simulation of infrared detection suggests that there is a linear relationship between photocurrent and background infrared illumination, and the photocurrent decreases with the increase of distance. The designed infrared photoelectric sensor is applied in the soft package counting link of workshop management. The infrared photoelectric acquisition signal is converted into an analog voltage signal, which is processed by the voltage conversion circuit and then transferred to the single chip microcomputer and software module. After the data is uploaded to the upper computer through the serial port, it shows that the number of soft packages can be accurately identified in the workshop soft package counting link based on the designed infrared photoelectric sensor.

The Design of Intelligent Wastebin Based on AT89S52

Mainly introduces intelligent classification trash can be dedicated to solving indoor household garbage classification. The trash can is based on AT89S52 single-chip microcomputer as the main control chip. The single-chip microcomputer realizes the intelligent classification of garbage by controlling the voice module, mechanical drive module, and infrared detection module. The use of voice control technology and infrared detection technology makes the trash can have voice control and overflow alarm functions. The design has the advantages of simple and intelligent operation, simple structure, stable performance, low investment, etc., which can further effectively isolate people and garbage, reduce human infection with bacteria, and is a feasible solution for classification at the source of garbage.

Thermoelectrically-Cooled InAs/GaSb Type-II Superlattice Detectors as an Alternative to HgCdTe in a Real-Time Mid-Infrared Backscattering Spectroscopy System.

We report on the development of thermoelectrically cooled (TE-cooled) InAs/GaSb type-II superlattice (T2SL) single element infrared (IR) photodetectors and exemplify their applicability for real-time IR spectroscopy in the mid-infrared in a possible application. As the European Union’s Restriction of Hazardous Substances (RoHS) threatens the usage of the state-of-the-art detector material mercury cadmium telluride (MCT), RoHS-compatible alternatives to MCT have to be established for IR detection. We use bandgap engineered InAs/GaSb T2SLs to tailor the temperature-dependent bandgap energy for detection throughout the required spectral range. Molecular beam epitaxy of superlattice samples is performed on GaAs substrates with a metamorphic GaAsSb buffer layer. Photolithographic processing yields laterally-operated T2SL photodetectors. Integrated in a TE-cooled IR detector module, such T2SL photodetectors can be an alternative to MCT photodetectors for spectroscopy applications. Here, we exemplify this by exchanging a commercially available MCT-based IR detector module with our T2SL-based IR detector module in a real-time mid-infrared backscattering spectroscopy system for substance identification. The key detector requirements imposed by the spectroscopy system are a MHz-bandwidth, a broad spectral response, and a high signal-to-noise ratio, all of which are covered by the reported T2SL-based IR detector module. Hence, in this paper, we demonstrate the versatility of TE-cooled InAs/GaSb T2SL photodetectors and their applicability in an IR spectroscopy system.

Designing a Supermarket Service Robot Based on Deep Convolutional Neural Networks

In order to save people’s shopping time and reduce labor cost of supermarket operations, this paper proposes to design a supermarket service robot based on deep convolutional neural networks (DCNNs). Firstly, according to the shopping environment and needs of supermarket, the hardware and software structure of supermarket service robot is designed. The robot uses a robot operating system (ROS) middleware on Raspberry PI as a control kernel to implement wireless communication with customers and staff. So as to move flexibly, the omnidirectional wheels symmetrically installed under the robot chassis are adopted for tracking. The robot uses an infrared detection module to detect whether there are commodities in the warehouse or shelves or not, thereby grasping and placing commodities accurately. Secondly, the recently-developed single shot multibox detector (SSD), as a typical DCNN model, is employed to detect and identify objects. Finally, in order to verify robot performance, a supermarket environment is designed to simulate real-world scenario for experiments. Experimental results show that the designed supermarket service robot can automatically complete the procurement and replenishment of commodities well and present promising performance on commodity detection and recognition tasks.

Design and Realization of Intelligent Energy-Saving Circuit

An intelligent energy-saving system is designed in order to save energy for the lighting system for classroom, which is composed of single chip, artificial wireless control module, pyroelectric infrared detection module and sunlight intensity detection module. The system can run in two ways of manual control and automatic control. In the case of automatic control, when the light intensity is less than the preset value and there are some people in the classroom, the lamp will light-on automatically. The lamp will remain lighting-on in a period of time after the leaving of people, and the delay time can be set according to the actual situation.

Size, weight, and power reduction of mercury cadmium telluride infrared detection modules

Application requirements driving present IR technology development activities are improved capability to detect and identify a threat as well as the need to reduce size weight and power consumption (SWaP) of thermal sights. In addition to the development of 3rd Gen IR modules providing dual-band or dual-color capability, AIM is focused on IR FPAs with reduced pitch and high operating temperature for SWaP reduction. State-of-the-art MCT technology allows AIM the production of mid-wave infrared (MWIR) detectors operating at temperatures exceeding 120 K without any need to sacrifice the 5-μm cut-off wavelength. These FPAs allow manufacturing of low cost IR modules with minimum size, weight, and power for state-of-the-art high performance IR systems. AIM has realized full TV format MCT 640×512 mid-wave and long-wave IR detection modules with a 15-μm pitch to meet the requirements of critical military applications like thermal weapon sights or thermal imagers in unmanned aerial vehicles applications. In typical configurations like an F/4.6 cold shield for the 640×512 MWIR module an noise equivalent temperature difference (NETD) <25 mK @ 5 ms integration time is achieved, while the long-wavelength infrared (LWIR) modules achieve an NETD <38 mK @ F/2 and 180 μs integration time. For the LWIR modules, FPAs with a cut-off up to 10 μm have been realized. The modules are available either with different integral rotary cooler configurations for portable applications that require minimum cooling power or a new split linear cooler providing long lifetime with a mean time to failure (MTTF) > 20000, e.g., for warning sensors in 24/7 operation. The modules are available with optional image processing electronics providing nonuniformity correction and further image processing for a complete IR imaging solution. The latest results and performance of those modules and their applications are presented.

Micromachined Thermopile IR Detector Module With High Performance

In this letter, we describe a novel micromachined thermopile infrared (IR) detector module with filter and detector cointegrated by Au-Au thermocompression vacuum bonding technology. To miniaturize the detector module, both the thermopile IR detector and filter were fabricated by the silicon process, and the cap silicon wafer as the optical filter was bonded with the thermopile IR detector wafer in a base vacuum of 3 × 10-5 millibar. Because the vacuum packaging reduces the gas convection, the wafer-level vacuum packaged thermopile IR detector module exhibits a 4 times higher response voltage than the atmosphere pressure packaged thermopile IR detector module. Using a sputtered pure thin Au layer as a bonding layer, average shear strength of 47.5 megapascals and leak rate of 3.9 × 10-9 atm cc/s have been achieved, which guarantees the high reliability and good long-term stability of the vacuum packaged detector module.

Third gen focal plane array IR detection modules at AIM

The third generation of infrared detection modules is characterized by advanced functionalities like more pixels (array size⩾640×512), higher frame rates (⩾800 Hz at an array size of 256×256), multicolor or multiband capability, and better thermal resolution. This paper focuses on the present status of such technologies at AIM, based on HgCdTe and quantum well focal plane array detectors.