The objective of this contribution is to develop a thermodynamically consistent theory for general imperfect coherent interfaces in view of their thermomechanical behavior and to establish a unified computational framework to model all classes of such interfaces using the finite element method. Conventionally, imperfect interfaces with respect to their thermal behavior are often restricted to being either highly conducting (HC) or lowly conducting (LC) also known as Kapitza. The interface model here is general imperfect in the sense that it allows for a jump of the temperature as well as for a jump of the normal heat flux across the interface. Clearly, in extreme cases, the current model simplifies to HC and LC interfaces. A new characteristic of the general imperfect interface is that the interface temperature is an independent degree of freedom and, in general, is not a function of only temperatures across the interface. The interface temperature, however, must be computed using a new interface material parameter, i.e., the sensitivity. It is shown that according to the second law, the interface temperature may not necessarily be the average of (or even between) the temperatures across the interface. In particular, even if the temperature jump at the interface vanishes, the interface temperature may be different from the temperatures across the interface. This finding allows for a better, and somewhat novel, understanding of HC interfaces. That is, a HC interface implies, but is not implied by, the vanishing temperature jump across the interface. The problem is formulated such that all types of interfaces are derived from a general imperfect interface model, and therefore, we establish a unified finite element framework to model all classes of interfaces for general transient problems. Full details of the novel numerical scheme are provided. Key features of the problem are then elucidated via a series of three-dimensional numerical examples. Finally, we recall since the influence of interfaces on the overall response of a body increases as the scale of the problem decreases, this contribution has certain applications to nano-composites and also thermal interface materials.
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