Current research on integrated circuits and power electronics is rapidly advancing toward miniaturization, high power density, and multi-chip integration, which presents unprecedented challenges to the thermal management performance of packaging materials. Along the device-to-sink heat-flow path in power modules, thermal management relies primarily on two functional material systems: substrate materials that provide mechanical support and electrical insulation, and thermal interface materials (TIMs) that bridge heat transfer across heterogeneous interfaces. This paper summarizes recent advances in thermal management materials for power electronics, with a focus on ceramic-based substrate systems, particularly Si3N4 ceramics, and TIM systems including conductive adhesives, diamond-reinforced composites, and 2D filler-reinforced polymer composites. Emphasis is placed on improvements in thermal conductivity, reduction of thermal resistance, and enhancement of mechanical reliability through process optimization, interfacial engineering, and hybrid filler design. In addition, representative multiscale simulation approaches and emerging applications of artificial intelligence and machine learning are reviewed as tools for understanding interfacial heat transport and accelerating materials screening and optimization. Finally, key challenges and future directions toward scalable, reliable, and intelligent thermal management solutions are discussed, providing guidance for both academic research and industrial deployment in next-generation power-electronics packaging.

Thermal interface materials are critical components for ensuring efficient heat dissipation in thermal management systems. The current research focus is to fabricate thermal interface materials (TIMs) that demonstrate high thermal conductivity while at low filler loadings. In this study, an aligned, thermally conductive skeleton was fabricated via the freeze casting method, utilizing carbon nanofibers (CNFs) and nickel (Ni) particles. This skeleton was subsequently infiltrated with silicone rubber (SR) to obtain the polymer composite. Within the aligned skeleton, CNFs and Ni particles are densely packed, with the Ni particles acting as conductive bridges between adjacent CNFs. This bridging effect facilitates a substantial enhancement in the overall thermal conductivity with only a minimal addition of Ni. By combining the skeleton’s microstructure with thermal performance, the effects of key parameters on thermal conductivity were systematically investigated. A maximum thermal conductivity improvement of 64.8% was achieved by hybridizing CNFs with a small amount of Ni (1.09 vol%) compared to the CNF-only counterpart. Furthermore, at a low total loading (8.02 vol% CNFs and 1.09 vol% Ni), the composite achieved a thermal conductivity of 3.30 W/(m·K). This value was 47.2% higher than that of a CNF-only TIM and 36.2% higher than that of a composite prepared by common freezing under the same filler composition. Additionally, the incorporation of Ni enhanced the composite’s thermal stability. Moreover, the composite exhibited a favorable combination of enhanced mechanical strength and excellent elasticity.

ABSTRACT The present investigation studies the thermal conductivity of epoxy hybrid composites incorporating sugarcane, alumina (Al2O3), and titania (TiO2) with a parallel Genetic Algorithm-Particle Swarm Optimization (parallel GA-PSO) modeling technique. The generated MATLAB code enables statistical and systematic parametric evaluation of thermal conductivity for these epoxy laminates, employing GA and PSO for fine-tuning and extensive solution exploration. The model predicts enhanced thermal conductivity of hybrid composites by optimizing crucial factors such as particulate loading and fiber volume proportion. The optimization frameworks, with adjustable factors including mutation rate, crossover rate, and population size, facilitate comprehensive experimentation to determine thermal conductivity improvements. This investigation determines the effectiveness of the approach in optimizing the accurate configuration of reinforcement, with findings validated through residual and regression analysis. The research develops an effective optimization approach to enhance polymer composite thermal conductivity for engineering applications using lightweight structures. However, the current findings are based entirely on computational modeling and require experimental validation to confirm practical applicability.

Hybrid nanofluids have emerged as advanced heat-transfer media with the potential to significantly enhance the energy efficiency of thermal systems used in low-carbon chemical processes. By combining two or more distinct nanoparticles within a base fluid, these engineered suspensions demonstrate synergistic improvements in thermal conductivity, viscosity control, and stability compared to conventional nanofluids. This review synthesizes recent progress in hybrid nanofluid formulation strategies, stabilization techniques, and the underlying thermophysical mechanisms governing heat transfer. Their growing relevance is highlighted across applications such as compact heat exchangers, CO₂ capture and conversion, green chemical synthesis, and renewableenergy-based thermal systems. Although hybrid nanofluids offer substantial opportunities for process intensification and emission reduction, industrial integration remains limited by issues related to cost, long-term stability, pumping requirements, and material compatibility. The paper identifies critical research gaps and outlines future directions necessary for enabling the large-scale deployment of hybrid nanofluids in sustainable chemical engineering.

ABSTRACT The global transition to sustainable energy systems demands high‐performance thermal energy storage, with paraffin wax standing as a prominent phase change material (PCM) due to its high latent heat, chemical stability, and cost‐effectiveness. However, its low thermal conductivity (about 0.2 W/m·K) and phase segregation significantly limit its practical application. While nanofillers and carbon additives can enhance conductivity, they often reduce latent heat, increase costs, and complicate processing. This study introduces a novel, sustainable solution by valorizing Algerian slack wax, a local petroleum refinery byproduct, as a multifunctional enhancer for paraffin. Composites with 6, 10, 15, and 20 mass% slack wax were formulated and characterized using the T‐history method. The results demonstrate a breakthrough in simultaneous property enhancement, overcoming typical trade‐offs. The 20% composite achieved a 35.65% increase in latent heat (from 106.93 to 145.06 kJ/kg), a 30.48% rise in specific heat (from 3.51 to 4.58 kJ/kg·K), and a 33% improvement in thermal conductivity (from 0.18 to 0.24 W/m·K in the solid state). Furthermore, the material's thermal responsiveness was enhanced, with a 25% reduction in solidification time (from 165 to 120 s) and a 20% faster melting rate (from 125 to 100 s). These improvements are attributed to molecular interactions that disrupt paraffin's crystalline order, facilitating more efficient phonon transport and energy distribution. By transforming an industrial waste into a high‐performance PCM, this work provides a cost‐effective, scalable, and circular pathway for advanced thermal storage, directly benefiting solar energy integration, building efficiency, and industrial waste heat recovery.

Thermal conductivity improvement and heat transfer behavior of fluorine-chlorine reciprocal eutectic salts/graphite foam composites for high-temperature energy storage

This research utilizes first-principles calculations based on density functional theory (DFT) to conduct an in-depth investigation into the atomic structure and reaction mechanisms at the VC(111)/Diamond(111) interface by constructing a model of the VC(111)/Diamond(111) interface. By conducting thorough analyses of interfacial atomic configurations, adhesion energy, interfacial energy, differential charge density, density of states (DOS), and Mulliken population, it is shown that the C-terminated VC(111)/Diamond(111) interface displays stronger interfacial interactions, greater stability, and superior electronic properties compared to the V-terminated interface. Furthermore, the formation of chemical bonds at the interface facilitates a transition from a mechanical interface to a chemically bonded one, thereby contributing to the improvement of thermal conductivity across the composite interface.

ISRU (In Situ Resource Utilization) is an essential technology because it reduces the transportation of materials from Earth. Conventionally, regolith deposited on the lunar surface is a highly insulating material. However, if it can be endowed with heat storage properties, it is expected to provide part of the thermal energy source required for lunar overnight stays. In this study, we considered and evaluated a method of applying a small amount of resin (Polyamide-imide) coating to the regolith simulant and bonding the regolith pieces together to reduce the contact thermal resistance, which is the factor that gives the regolith its insulating properties. Measurements were actually carried out in a vacuum and the improvement in thermal conductivity was confirmed. Furthermore, we considered the mechanism for manufacturing on the lunar surface.

Abstract Aramid nanofiber (ANF), derived from poly‐ p ‐phenylene terephthamide (PPTA) fiber, becomes a rising star in the field of cutting‐edge nanomaterials. Considering its enticing intrinsic thermal conductivity, mechanical robustness and thermal stability stemming from the strong hydrogen‐bonding network constructed by rigid molecular chains, ANF and its thermally conductive composites have garnered tremendous attention. In the past decades, tremendous efforts have been made in the development of ANF‐based thermally conductive composites with path‐breaking thermal conductivity and mechanical properties. Herein, recent advances in nanofibrillation strategies, ANF films with high intrinsic thermal conductivity, and ANF‐based thermally conductive composites are summarized. Multiscale structural optimization associated with various processing methods to ameliorate the intrinsic thermal conductivity of ANF films is highlighted. The unique coupling mode between PPTA molecular chains and thermally conductive fillers as well as their correlations to the thermal conductivity and mechanical performance of composites are thoroughly probed. This review offers a guidance to develop advanced polymer‐based thermally conductive composites for efficient thermal management applications.

This study explores the comparative evaluation of PLA, carbon fiber-reinforced PLA (PLA-CF), and carbon fiber-reinforced high-temperature polyamide (PAHT-CF) for use in Fused Deposition Modeling (FDM) additive manufacturing. These materials were selected to examine how carbon fiber (CF) reinforcement affects PLA and PAHT, using virgin PLA as the baseline. Mechanical and thermal properties were tested to assess the influence of reinforcement on strength, toughness, and heat transfer. Tensile, impact, and thermal conductivity tests were conducted on all three materials. The results showed that PAHT-CF outperformed both PLA and PLA-CF in all categories, achieving an ultimate tensile strength of 57.5 MPa, an impact strength of 14.30 kJ/m2, and thermal conductivity of 0.182 W/m·K. PLA-CF showed moderate improvements in strength over neat PLA but with increased brittleness and slight improvement in thermal conductivity. Notably, this is the first study to investigate the thermal conductivity and resistivity of PAHT-CF in the literature, offering new insights into its heat dissipation capabilities and suitability for high-temperature applications. These findings highlight the critical role of polymer selection and fiber reinforcement in optimizing material performance. The results offer guidance for material selection in additive manufacturing, especially for lightweight, strong, and thermally efficient parts in various industries.

In this study, a two-dimensional transient computational fluid dynamics (CFD) model is developed using ANSYS Fluent to investigate the performance of a single-stage metal hydride hydrogen compression (MHHC) system. The system integrates waste heat recovery from an electrolyzer with a pair of MH reactors charged with a TiFe-based alloy. The model is validated against experimental data from the literature, ensuring its accuracy in predicting key system performance metrics, including hydrogen sorption capacity, compression work, energy consumption, hydrogen productivity, and compression efficiency under varying operating conditions. Specifically, the effects of the high-temperature heat source (TH), varied between 70 °C and 80 °C, and the low-temperature heat sink (TL), ranging from 10 °C to 20 °C, are analyzed while maintaining constant hydrogen suction and discharge pressures at 5 and 15 bars, respectively. The results demonstrate that increasing TH and decreasing TL significantly enhance MHHC system performance. Under the studied conditions, a maximum compression efficiency of 8.861% is achieved at TH = 80 °C and TL = 10 °C. Additionally, the influence of MH alloy thermal conductivity is evaluated over the range of 1.6–4 W/(m∙K). Improvements in thermal conductivity are found to increase hydrogen sorption capacity, compression work, and compression efficiency by up to 21.1%, 21.4%, and 12.1%, respectively.

Polyimide (PI) is widely used in aerospace, electronic packaging, and other fields due to its excellent dielectric and thermophysical properties. However, the performance of traditional PI materials under extreme conditions has become increasingly inadequate to meet the growing demands. To address this, this study designed a PI/Nano-Si3N4 advanced composite material and, based on molecular dynamics simulations, thoroughly explored the influence of silane coupling agents with different grafting densities on the interfacial microstructure and their correlation with the overall material’s physical properties. The results show that when the grafting density is 10%, the interfacial bonding of the PI/Nano-Si3N4 composite is optimized: non-bonded interaction energy increases by 18.4%, the number of hydrogen bonds increases by 32.5%, and the free volume fraction decreases to 18.13%. These changes significantly enhance the overall performance of the material, manifested by an increase of about 30 K in the glass transition temperature and a 49.5% improvement in thermal conductivity compared to pure PI. Furthermore, the system maintains high Young’s modulus and shear modulus in the temperature range of 300–700 K. The study reveals that silane coupling agents can effectively enhance the composite material’s overall performance by optimizing the interfacial structure and controlling the free volume, providing an efficient computational method for the design and performance prediction of advanced high-performance PI composites.

ABSTRACTAs electronic devices evolve toward miniaturization, integration and diversification, developing composites with thermal management and broadband microwave absorption has become critical for addressing electromagnetic compatibility and heat-dissipation challenges. Inspired by the multilevel thorny structure of a cactus, this study proposes a biomimetic 3D network structure via a ‘direction-decoupling’ design to enhance thermal conductivity and microwave absorption. Boron nitride nanosheets (BNNS) form horizontal thermal pathways, while cobalt-catalysed nitrogen-doped carbon nanotube arrays (Co@NCNTs) are vertically grown in the interlayer for cactus-like heterostructure fillers. Finally, composites are obtained by combining the solid–solid phase-change polyethylene glycol matrix with the directional assembly process. At a mass fraction of 30 wt% for (Co@NCNTs)@BNNS, the composites exhibit the best microwave absorption and thermal conductivity at a thickness of 2.5 mm. The maximum effective absorption bandwidth reaches 6.72 GHz, with in-plane and through-plane thermal conductivity coefficients reaching 2.55 and 0.94 W·m–1·K–1, realizing simultaneous improvements in thermal conductivity and microwave-absorption performance. Moreover, density functional theory analysis confirms the interfacial bonding between Co@NCNTs and BNNS systems and verifies the advantages of a unique electronic structure for microwave absorption between Co- and nitrogen-doped carbon nanotubes. This study provides new strategies for integrated thermal–electromagnetic management materials in next-generation high-density electronics.

Abstract With the growing demand for high‐performance electrical equipment, especially for power semiconductors, it is critical to develop advanced packaging materials with excellent electrical insulation, thermal conductivity, and high temperature stability. However, the simultaneous enhancement of thermal conductivity and dielectric breakdown strength is still a great challenge. Herein, a series of molecularly ordered epoxy/organic molecular acceptor composites is prepared by constructing a naphthoic anhydride‐biphenyl complex to induce well‐organized electrophilic epoxy resin, thus achieving a significant improvement in dielectric breakdown strength and thermal conductivity. For instance, the introduction of only 0.4 wt.% naphthoic anhydride into the biphenyl epoxy monomer increases the dielectric breakdown strength at room temperature by 11.3%. More importantly, its high‐temperature dielectric breakdown strength at 200 °C only decreased by 13.6% compared to that at room temperature. In addition, the thermal conductivity of this epoxy film increased to 0.544 W m·K −1 , ≈2 times higher than that of the original sample. This work elucidates a novel and scalable methodology for the design of polymer‐based packaging materials with exceptional electrical and thermal properties, and it is promising to address the critical demands of electrical equipment in extreme working environments.

In high-humidity environments, the epoxy resin solid insulation materials of high-frequency transformers are prone to aging, resulting in varying degrees of deterioration in the material’s dielectric properties and other aspects. To enhance the adaptability of epoxy resin in high humidity environments, this paper, based on the molecular dynamics simulation method, establishes epoxy resin-based nanocomposites with doped nanofillers: a pure epoxy resin model and three epoxy resin models, respectively, doped with carbon nanotubes, graphene(GR), and SiO2. Based on the above models, using LAMMPS-17Apr2024, the thermal diffusion coefficients (thermal conductivity and specific heat capacity), glass transition temperatures, and dielectric constants under different moisture contents are calculated. The results show that the various properties of the epoxy resin nanocomposites doped with nanofillers have been improved to varying degrees. Among them, the GR/epoxy resin composite model shows the most significant improvements in thermal conductivity, thermal diffusivity, and glass transition temperature, and the SiO2/epoxy resin composite model has the best dielectric properties. Considering the high-temperature operation conditions and heat dissipation requirements of the high-frequency transformer, the GR-enhanced epoxy resin becomes the optimal filler choice.

Loading highly thermally conductive fillers, such as graphene nanoplatelets, into low-conductivity matrices (e.g., polymers) allows significant thermal conductivity improvements required in various thermal management applications. At high loadings, percolation enhances this effect due to the formation of conductive pathways. In the excluded volume approach, one adds high-volume fillers to increase the effective concentration of the thermally conductive fillers, potentially lowering their percolation threshold and facilitating filler interactions at lower loadings. The present study aims to investigate this notion and examine conditions at which this phenomenon occurs. A two-dimensional numerical analysis is devised, focusing initially on a thermally inert high-volume filler, which allows isolating its effects on compacting the highly conductive fillers. The analysis reveals that relatively high loadings of the highly conductive filler, namely over 20% in volume, are required to achieve significant enhancements. Comparing the modeling with experimental results indicates a good correlation, predicting enhancements of up to 20% due to the addition of the high-volume filler. These findings highlight the potential for optimizing composite conductivity through controlled filler addition by utilizing the excluded volume effect.

ABSTRACT Using natural rubber as the polymer matrix, we systematically evaluate the impact of ternary filler systems (carbon black, boron nitride [BN], and silicon nitride [Si 3 N 4 ]) on composite properties. The filler is treated by a dual modification strategy combining non‐covalent modification of tannic acid (TA) and covalent modification of γ‐(2,3‐epoxypropoxy) propytrimethoxysilane (KH560). The influence of this modification method on the dispersion of fillers, the Payne effect, mechanical properties, thermal conductivity, and dynamic mechanical properties in the composite materials is mainly studied. The results show that the double modification optimizes filler dispersibility, enhances interfacial compatibility between the filler and rubber, and reduces interfacial thermal resistance. The BN‐Si 3 N 4 /NR composite demonstrates the best‐balanced comprehensive performance at a BN:Si 3 N 4 ratio of 13:7. Relative to N234/NR composites, the modified material exhibits a 17.2% enhancement in tensile strength accompanied by a 32.8% improvement in thermal conductivity; wear resistance increases by 40.3%, rolling resistance decreases by 19.7%, and anti‐wet slip performance is maintained. This research broadens the application potential of BN and Si 3 N 4 in rubber composites, providing new ideas for developing tire materials with high strength, high thermal conductivity, and low heat generation characteristics.

Abstract The increasing power density and miniaturization of modern electronic devices have underscored the critical need for efficient thermal management solutions. Boron nitride nanosheets (BNNS) have emerged as promising fillers for thermally conductive epoxy based composite. However, the improvement of composite thermal conductivity is often constrained by interfacial thermal resistance (ITR) at filler‐filler and filler‐matrix interfaces. The smooth and inert surface of BNNS exacerbates this challenge. To address these issues, silver nanoparticles (AgNPs) are in situ synthesized on BNNS surfaces through a simple annealing process. The BNNS‐Ag fillers are subsequently modified using 3‐(Mercaptopropyl)triethoxysilane (MPTS) to enhance filler‐polymer matrix interactions through thiol‐silver and silane‐epoxy reaction. This dual modification strategy reduces ITR at both filler‐filler and filler‐matrix interfaces, enabling the epoxy nanocomposite to achieve a thermal conductivity of 1.64 W (m·K)−1 at 30 wt.% filler loading, representing an 811.1% improvement compared to neat epoxy. Furthermore, the BNNS‐AgNPs@MPTS nanocomposite exhibits excellent electrical properties. Meanwhile, both experimental studies and simulations have demonstrated the promising potential of epoxy nanocomposites as high‐performance thermal interface materials (TIMs). These findings provide a novel approach to overcoming interfacial thermal resistance while maintaining high electrical insulation, advancing the design of polymer composites for next‐generation advanced electronic packaging applications.

ABSTRACTConventional battery thermal management systems in electric vehicles often face critical limitations, such as excessive system weight, low thermal conductivity of phase change materials, poor thermal contact resistance, slow response to transient loads, inadequate flame resistance, and inefficient utilization of latent heat storage. These shortcomings result in uneven heat dissipation, thermal hotspots, and reduced battery lifespan and safety. To overcome these limitations, this study introduces an advanced composite solution incorporating expandable graphite (EG) into paraffin (PA)‐based materials. Expandable graphite, recognized for its excellent thermal stability and flame‐retardant properties, is strategically blended with paraffin wax to significantly boost both thermal conductivity and fire resistance. As a result, the composite achieves a thermal conductivity of (27.10 W/mK) over 100 times greater than that of pure paraffin (0.24 W/mK) and enhances mechanical strength with tensile and compressive limits reaching 9.0 MPa and 39.4 MPa, respectively. Additionally, the system effectively reduces battery surface temperatures to below 42°C during high‐load operation, compared to over 52°C in conventional setups. This study uniquely combines the integration of expandable graphite into paraffin with optimization of its distribution using a novel biased random‐key elk herd optimizer algorithm. This approach achieves over 100‐fold improvement in thermal conductivity while reducing system weight without compromising performance or safety. Optimization using a Biased Random‐Key Elk Herd Optimizer (BRKEHO) further refines expandable graphite distribution for balanced weight, efficiency, and safety. Python‐based simulations and experiments validate that expandable graphite enhanced composites offer a promising path toward lightweight, efficient, and fire‐safe battery thermal management systems designs for future electric vehicle applications.

ABSTRACTWith the development of high‐power electronic devices, the demand for polymer composites with superior thermal management and mechanical properties is increasing. In this work, continuous carbon fiber/epoxy resin/hexagonal boron nitride (CCF/EP/h‐BN) composites were fabricated via in situ three‐dimensional (3D) printing. By adjusting the h‐BN content from 0 to 20 wt%, the composites achieved both enhanced interlaminar shear strength (from 53.5 to 60.4 MPa) and a remarkable improvement in thermal conductivity, reaching a peak value of 13.5 W/m·K at 15 wt% h‐BN (129% higher than unfilled CF/EP). Elemental mapping and finite element simulation revealed that increasing h‐BN content promotes the formation of a continuous 3D bridging network, which serves as an efficient thermal pathway and reduces interfacial thermal resistance. The combined experimental and simulation results confirm that the synergistic effect of highly oriented CFs and well‐dispersed h‐BN enables outstanding thermal management and mechanical reliability. This study provides new insights and technical guidance for the structural and functional integration of polymer composites for advanced electronic packaging.