ABSTRACT For enhancing productivity of glulam, high frequency (HF) curing technique was researched in this study. Heat en-ergy is generated by electromagnetic energy dissipation when HF wave is applied to a dielectric material. Because bothlamina and adhesives have dielectric property, internal heat generation would be occurred when HF wave is applied toglulam. Most room temperature setting adhesives such as phenol-resorcinol-formaldehyde (PRF) resin, which is popu-larly used for manufacturing glulam, can be cured more quickly as temperature of adhesives increases. In this study,dielectric properties of larch wood and PRF adhesives were experimentally evaluated, and the mechanism of HF heat-ing, which induced the fast curing of glue layer in glulam, was theoretically analyzed.Result of our experiments showed relative loss factor of PRF resin, which leads temperature increase, was higher than that of larch wood. Also, it showed density and specific heat of PRF, which are resistance factors of temperature increase, were higher than those of wood. It was expected that the heat generation in PRF resin by HF heating would occur greater than in larch wood, because the ratio of relative loss factor to density and specific heat of PRF resin wasgreater than that of larch wood. Through theoretical approach with the experimental results, the relative strengths of ISM band HF electric fields to achieve a target heating rate were estimated.