Electronics manufacturers’ roadmaps are pushing the boundaries of dispensing to levels where new capabilities and new technologies are needed. Materials are expected to be deposited at always higher resolutions. Various process solutions are being offered, but these always require tradeoffs. Higher resolutions come at the expense of having to use custom materials, such as in inkjet, or lower speed, such as in dispensing. Ideally,ly, we would discover a a process concept solution that has thewould should combine allow to keep the throughput of traditional analog solutions, such as screen printing, with the accuracy and flexibility of traditional digital solutions, such as jetting and needle dispensing, while using industry standard materials, in a and offering a greener approacsustainable and cost effective manner. With Continuous Laser Assisted Deposition (CLAD), there is no more tradeoff between materials and other parameters. ioTech’s contactless technology is nozzle and mesh-free. In the CLAD dispensing process, materials are evenly coated on a transparent carrier film and then exposed to a laser beam. The laser applies a short burst of energy which releases perfectly consistent drops of material onto the substrate below. The deposited material can then be sintered or cured inline. A very wide range of geometries and form factors can be achieved. CLAD can deposit material drops at high speed and high resolution. The viscosity window includes standard certified materials between 500cPs and 500,000cPs, without the need for any reformulation. Most materials can be printed, including conductive materials, polymers, carbon inks, ceramics pastes and silicone. The CLAD deposition technology can be used for multiple applications. In this presentation, we will focus on applications related to SEMI packaging and µelectronics applications, such as conductive and dielectric deposition. We will highlight examples such as RDL/Fan Out structures and Flip Chips pillars. The system’s multi material printing feature comes with embedded post-processing options such as heat and UV curing, sintering and ablation. This combination delivers a unique capability to build multi-functional 3D structures. The CLAD technology provides manufacturers with unmatched design flexibility, high productivity, and a major sustainability advantage vs existing technologies. As the system process also allows for the concurrent deposition and curing of up to five different materials, we will also study the case of complex 3D interconnects. CLAD and its multiple benefits have been warmly welcomed by the industry, leading to multiple awards, and attracting prestigious semiconductor customers.
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