The Ni–P stratum was fabricated upon the Cu substrate via an electroless plating technique, and the microstructure and properties of electroless Ni–P/Sn2.5Ag0.7Cu0.1RE micro-joints under temperature gradient was studied. Research indicates that in the initial stage of thermomigration in micro-solder joints, the intermetallic compound (IMC) in the Ni–P/soldering seam transition area appears as both “needle-shaped” and “block-shaped” (Ni, Cu)3Sn4, with an average thickness of 1.1–1.5 μm. Additionally, between Cu and (Ni, Cu)3Sn4 IMC, there exists a 0.8 μm thick “layered” Ni3P within the Ni–P layer. The temperature gradient causes the asymmetric growth of (Ni, Cu)3Sn4 IMC and the asymmetric evolution of the Ni–P layer at the hot and cold ends of the micro-solder joint. The Ni–P layer evolution is divided into two stages: Ni–P → Ni3P + Ni and Ni3P + Sn → Ni–Sn–P, and the cold end structure evolves faster than the hot end. After 60 h under the temperature gradient condition of 550 °C/cm, the shear fracture position of the micro-solder joint shifts from the soldering seam to the Ni–Sn–P/IMC layer junction, and fracture mode changes from ductile fracture dominated by dimples to brittle fracture dominated by cleavage and slip steps, corresponding to a decrease of 21.8% in micro-solder joint pushing shear force from 16N.
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