Glass Transition Temperature In Range Research Articles

Developing Hydration Maps of Polymer Latex Film Formation Using Terahertz Time-Domain Spectroscopy.

The dynamics of the drying process of polymer latexes after casting as a wet film onto a substrate are important to track as they influence the physical and mechanical properties and performance of the dried polymer films. Current methods used to follow this drying process include gravimetric analysis, coupled with advanced techniques like GARField-NMR or optical coherence tomography. The latter two methods provide height and spatial information in the z-direction, normal to the substrate, and occasionally in the xz- or yz-planes. Terahertz time-domain spectroscopy (THz-TDS) is a welcome addition as it provides both the structural and spectroscopic information in the parallel xy-plane, filling the geometric gap. Herein, we utilize THz-TDS to study the drying and film formation process of various polymer latexes with a broad range of glass transition temperatures. We showcase the applicability of this technique in obtaining 2D parallel hydration maps of the drying dispersions, in the form of droplets, using latex-dependent calibration lines. Our findings display known phenomena arising from the drying of the colloidal dispersions.

Synthesis and chemical recycling investigations of polythioureas

There is currently intensive research on the development of biobased polymers as potential alternatives to the environmentally hazardous isocyanate-based polyurethanes. In this context, polythioureas (PTUs) form a particularly attractive target because they can be synthesized by using isothiocyanates, a class of molecules that can be found in nature with expected low toxicity. Herein, a series of 16 PTUs with varied chemical structures, mostly being new polymers, have been synthesized and their possible chemical recycling pathways via thermally induced and acid-catalyzed depolymerizations have been investigated. The obtained PTUs showed a varied range of molecular weights (up to Mn ∼ 69.5 kDa), intrinsic viscosity (up to ∼6 dL/g), and glass transition temperatures (Tg ∼ 59–128 °C). Notably, we observed that the presence of aromatic segments lowered the thermal stability of the polymers, so they were generally easier to depolymerize (compared to those without aromatic groups), forming oligomers with controlled end-groups (i.e. telechelic polymers) that could be repolymerized. The obtained aliphatic PTUs were generally resistant against thermochemical depolymerizations, but they could be effectively depolymerized by sulfuric acid. The repolymerization methods depended on the end groups of the depolymerized products, which in this work included direct repolymerization of polythioureas (if the end groups contain ∼1:1 of isothiocyanates and amines) and copolymerizations with another monomer terephthaldehyde (if the end groups contain only amines). Our results provided a first comprehensive molecular insight into the synthetic and recycling possibilities of using isothiocyanates and polythioureas in the exploration of potential alternatives for isocyanates and polyurethanes.

Shape memory resin with high temperature resistance for plugging fracture formations drilled with oil-based drilling fluid

Lost circulation usually occurs when drilling fracture formations using oil-based drilling fluids (OBDFs). This study synthesized the shape memory epoxy resins (EHN) with a glass transition temperature range of 94–122 °C. They exhibited good thermal stability and dynamical mechanism performance. The EHN did not swell in oil at different temperatures; however, its shape changed with temperature. Optimized by an orthogonal experiment, the thickness swelling rate prepared under the optimal conditions was more than 74%. The particle size reduction rate did not exceed 5% after aging at 150 °C in oil, which was less than 1/4 of that of the nutshell. The EHN1 with a glass transition temperature of 122 °C, prepared under the optimal conditions (OEHN1), was utilized to control lost circulation in OBDF at high temperatures. At a heating rate of 1–10 °C/min, the shape memory rate of OEHN1 required 14–107 min to reach 100% in the temperature range of 30–150 °C, respectively. The shape memory recovery rate of OEHN1 reached to 10, 28, 57, and 97% at 80, 100, 120, and 125 °C within 60 min, respectively. In addition, it required 4–10 min to recover to 100% at 135–150 °C, respectively. OEHN1 did not recover below 80 °C, partially recovered between 80 and 120 °C, and completely recovered above 125 °C (>glass transition temperature). When plugging the wedge fracture with inlet/outlet fracture widths of 3/1 mm at 80–150 °C, formula 2 (F2) containing OEHN1 exhibited lower fluid loss and stabler pressure-bearing capacity under 15 MPa. When plugging the wedge fracture with inlet/outlet fracture widths of 4/2 mm, F2 withstood a pressure of 5 MPa at 80 °C and 15 MPa at 120 °C and 150 °C. Further, OEHN1 exhibited excellent temperature responsiveness and plugging performance. They transformed from the glassy to rubber state following full activation at 125–150 °C. They became elastic particles, expanded from flakes to cubes, and could adapt to different crack sizes. In addition, they bridged, accumulated, filled, and formed compact cracks with other lost circulation materials. Consequently, they formed a force-chain network that improved the stability of the plugging layer.

Largely enhanced damping performance of nitrile rubber/ethylene–vinyl acetate blends via phenolic resin-induced phase separation

The low glass transition temperature (Tg) and narrow effective damping temperature range (EDTR) greatly restrict the application of common vulcanized rubbers in fields relating to high temperature environmental condition due to the greatly reduced damping performances. In this work, phenolic resin (PR) was incorporated into nitrile rubber/ethylene–vinyl acetate (NBR/EVM) blends through melt-compounding processing, and the microstructure and damping performance changes induced by PR were comparatively investigated. The results show that PR induces the phase separation of the blends and most of PR particles selectively locate in the NBR component. Molecular dynamics simulation confirms that more hydrogen bonds form in the ternary blends, and reduced free volume fraction is also achieved. The ternary blends show good high-temperature damping performances, and apparently enhanced Tg (up to 17.7 °C) and EDTR (82.6 °C, from −2.6 to 80 °C) are also achieved. Additionally, the ternary blends exhibit good mechanical properties, including higher ductility and larger fracture energy, and better energy dissipation ability. This work provides an alternative resolution way to enhance the damping performances of the common vulcanized rubbers at high temperatures.

Influence of cerium addition and redox state on silicate structure and viscosity

AbstractThe viscosities of Ce‐free and Ce‐bearing (∼1.3 mol%, ∼6.5 wt.% Ce2O3) soda lime silicate (window glass) melts were measured with respect to oxidation state. Experiments were performed isothermally using a concentric‐cylinder viscometer on melts equilibrated with successively reducing CO–CO2 gas mixtures within a gas tight vertical tube furnace at 1 atm. Viscosity measurement and sampling were performed at the end of each melt reduction step. Further, viscosities in the glass transition temperature range were estimated using the shift factor method applied to glass transition temperature values determined using differential scanning calorimetry (DSC) measurements on quenched glasses. The Ce speciation at each stepwise melt reduction was probed using Ce L3‐edge X‐ray absorption near‐edge structure (XANES) spectroscopy, while structural information upon Ce addition and reduction was provided by Raman spectroscopy. The viscosities of these materials remain constant at this level of Ce addition and do not vary significantly with redox state at high temperature. Conversely, viscosity values in the glass transition temperature range increase upon both Ce addition and reduction. Our analysis, based on the glass composition analyses obtained via electron probe microanalyzer (EPMA), viscosity calculations, and observations of silicate structural changes, leads to the conclusion that the observed viscosity increase around the glass transition temperature is explained by the high ionic field strength of Ce ions as well as the polymerization behavior of the silicate matrix occurring during reduction of Ce. Because of its low concentration, resulting from its low solubility, Ce redox changes exert only minimal effects on the viscosity of this melt.

Influence of graphene on the composite modified asphalt based on viscoelastic and elastic properties

In order to explore high-viscosity, high-elasticity composite modified asphalt materials suitable for drainage pavements, different dosages of graphene-modified asphalt and graphene composite-modified asphalt were prepared. Elastic recovery efficiency and rotational viscosity as the main experimental indicators for modified asphalt are employed to determine the optimal dosage of graphene and help conduct a study on the viscoelastic properties, analyzing the fatigue performance of the modified asphalt through linear amplitude sweep (LAS). Based on molecular dynamics simulation (MD) to build an asphalt model, the study on viscoelastic properties uses calculated viscosity and the asphalt glass transition temperature range (Tg) obtained from simulation results as indicators to verify the optimal dosage of graphene. Scanning Electron Microscopy (SEM) is utilized to reveal the effects of different dosages of graphene modification. The research results indicate that the optimal dosages of graphene in graphene-modified asphalt and graphene composite-modified asphalt are 0.1 % and 0.2 %, respectively. At these concentrations, graphene significantly enhanced the elastic recovery properties of the matrix asphalt (113 % increase) and the composite-modified asphalt (28 % increase). In terms of rotational viscosity, the matrix asphalt saw a 54 % rise with the addition of graphene, while the composite-modified asphalt experienced a substantial 151 % increase. Notably, the incorporation of graphene also resulted in a rise in the glass transition temperature and a reduction in the length of the graphene-modified asphalt, signifying an improvement in its elastic properties. Furthermore, the calculated viscosity of the graphene-modified asphalt and composite-modified asphalt surged by 47.49 % and 64.01 %, respectively. Additionally, SEM results indicate that differences in the effects of graphene modification are primarily due to the dispersion and coating extent of graphene.

The use of carbodicarbene for bio-based polyester synthesis via ring-opening copolymerization of cyclic anhydrides and epoxides

Alternating ring-opening copolymerization (ROCOP) of epoxides and cyclic anhydrides was investigated using carbodicarbene (CDC) as a single-component organic initiator. CDC produced various polyesters with different combinations of monomers, including bio-based monomers. The synthesized polyesters exhibited narrow dispersity and a wide range of glass transition temperatures. Moreover, a diblock copolyester was synthesized using self-switchable polymerization (ROCOP of the cyclic anhydride/epoxide, and ring-opening polymerization of lactone) in a one-pot synthesis. The formation of a terpolymer product was confirmed by diffusion-ordered spectroscopy and thermal gravimetric analysis.

One-Pot Preparation of Double-Network Epoxy Vitrimers with High Performance, Recyclability, and Two-Stage Stress Relaxation.

Although considerable progress has been made in developing different types of vitrimers, ongoing challenges remain in tuning their mechanical and rheological properties, self-healing, and adhesion. Here, we demonstrate a one-pot method to produce a novel double-network epoxy vitrimer using an aliphatic amine cross-linker with a siloxane covalent bond and an aromatic amine cross-linker with a disulfide covalent bond. When a controlled two-stage curing process is employed, the markedly different reactivities of aliphatic amine and aromatic amine with epoxy allow for sequential cross-linked network formation, leading to the development of a double network that incorporates two types of dynamic covalent bonds. As a result, the produced vitrimers exhibit controllable mechanical, thermal, and rheological properties, as well as recyclability. This is evidenced by a tensile strength as high as 72 MPa, while maintaining ∼10% elongation at break, a wide glass-transition temperature range from 91 to 171 °C, and an adjustable two-stage stress relaxation. These characteristics suggest opportunities to develop high-performance cross-linked polymers with specific responses to time and temperatures.

Damage and failure mechanisms of carbon fiber reinforced composite thin-walled bushings under hygrothermal-mechanical loadings

Numerous thin-walled bushings, injection-molded from AS4 short carbon fiber reinforced polyetherketone (AS4/PEK) composites, are employed in the chains of stenter heat-setting machines. These bushings rapidly deteriorate under the hygrothermal-mechanical loadings prevalent in their service conditions. This necessitates regular replacements, critically limiting machine efficiency. In this paper, considering hygrothermal-mechanical loadings, the macro–micro dual-scale damage model of composite bushings is established. The wet and thermal effects are introduced into constitutive models and damage criteria based on the macro–micro mechanics of composites and their constituents. The micro-damage and macro-destruction phenomena in the bushing are analyzed, and the related measures are proposed to delay its failure. Comparing the simulation results with the test, the macro–micro damage and failure behavior are discussed for the failed bushing. It reveals that stress concentrations near AS4 fibers initiate interfacial damage and microcracks in the PEK matrix, inciting interface debonding and matrix fragmentation, ultimately provoking composites failure. Increasing the interface thickness can delay the onset of damage. Fiber tension failure, matrix tensile, and compressive failure induce destruction at the component extremities. According to the influence of hygrothermal performance, within the glass transition temperature range of 160 °C to 240 °C, selecting composites with higher glass transition temperatures can enhance the failure strength of bushings by 19 %. Conversely, within a moisture absorption range of 0.5 % to 0.8 %, opting for materials with lower moisture absorption decreases the failure strength of bushings by 37 %. Optimal failure strength is achieved with composites having a 0.5 % moisture absorption rate and a 240 °C glass transition temperature.

Novel bio-based polyurethane elastomers for adjustable room-temperature damping property

The distinctive viscoelastic behavior of elastomeres can be exploited for reducing vibrations and noise. However, the utility of conventional rubber-based elastomers is limited by low glass transition temperature (Tg) and narrow adjustable damping range, which constrain the room-temperature damping property. Moreover, the majority of rubber-based elastomers are sourced from unsustainable petroleum-based resources. Therefore, designing bio-based materials with room-temperature high-damping property to replace conventional rubber-based elastomers is crucial. Herein, a novel bio-based polyurethane (bio-PU) elastomer with an adjustable damping-temperature range and room-temperature high-damping property is successfully synthesized from bio-based poly (trimethylene ether) glycol. The effects of molecular chain structure on the thermal properties, mechanical properties, and adjustable damping-temperature range of the bio-PU elastomers, along with the mechanisms underlying these effects, are elucidated in detail. As the content of hard segment increasing, the Tg of bio-PU elastomers significantly increases from −13.0 to 29.9 °C, effectively encompassing the damping temperature range within the room-temperature working range. This promising strategy for formulating bio-based elastomers with adjustable damping-temperature range can advance the sustainable growth of PU industry and broaden the scope of PU damping applications.

Synthesis of polymer ionic liquids of the ionene type

New regularities have been discovered in the synthesis of polymer ionic liquids and ionene-type ionic liquids based on polyionenes derived from tetrahydro-1,4-oxazine. The methods for regulating the molecular weight of the synthesized polymers have been improved by varying the nature and composition of the solvent, as well as the concentration of the starting monomers. These improvements have resulted in the creation of new and promising materials. For the first time, we investigated the effects of temperature, solvent type and composition, chemical structure, and concentration of polyionenes derived from tetrahydro-1,4-oxazine on their behavior in water and water-ethanol solutions, as well as the shape of macromolecules in different solvents. Newly synthesized polymeric ionic liquids and ionene ionic liquids with an ionic conductivity of 10–2–10–5 S•cm–1 and a glass transition temperature range of –1500С–150С exhibit five to six orders of magnitude higher ionic conductivity compared to known analogues.

Synthesis and properties of modified thermoplastic polyimide films with good dielectric properties at high frequency and enhanced thermal stability via incorporation of rigid ester and biphenyl structural units

AbstractA series of ester‐ and fluoro‐containing thermoplastic polyimide (PI) films, PEsI‐1 ~ PEsI‐4 have been prepared by the two‐step thermal imidization procedure via the soluble poly(amic acid) (PEsAA) precursors from the copolymerization of four monomers, including the dianhydrides of bisphenol A dibenzoate‐3,3′,4,4′‐tetracarboxylic acid dianhydride (TMBPA) and 3,3′, 4,4′‐biphenyl tetracarboxylic acid dianhydride (BPDA) and the diamine monomers of 4‐aminophenyl‐4′‐ aminobenzoate (APAB) and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFMB) in the polar aprotic solvent of N‐methyl‐2‐pyrrolidinone (NMP). The PI films obtained from the high‐temperature dehydration of the PEsAA solutions exhibited the good thermal stabilities with the glass transition temperatures (Tg) over 269°C, the 5% weight loss temperatures (T5%) higher than 480°C, and the linear coefficients of thermal expansion (CTE) values in the range of 17.7 × 10−6/K–33.6 × 10−6/K in the temperature range of 50–250°C. Meanwhile, the PI films showed good thermoplasticity in the dynamic mechanical analysis (DMA) tests, in which the storage modulus of the PI films dropped sharply in the temperature range of glass transition of the polymers. At last, the PI films exhibited the good dielectric properties with the breakdown voltages (Vb) over 5200 V, the dielectric strength (Ds) higher than 210 V/μm, the dielectric constants (Dk) in the range of 3.26 ~ 3.32 at the frequency of 10 GHz, and the dielectric dissipation factors (Df) of 0.0038 ~ 0.0047. Compared with the commonly used PEsI‐ref film for high‐frequency flexible copper clad laminates (FCCL), the currently developed PI films exhibited the obviously increased Tg values, decreased CTE values, and comparable dielectric properties.

Cryogenic thermal cycling effects on serration behavior in wide glass transition temperature Zr-based bulk metallic glasses

Serration behavior serves as a pivotal link connecting micro-deformation mechanism to the mechanical properties of metallic glasses. To elucidate the impact of cryogenic thermal cycling (CTC) and compositional modifications on metallic glasses’ serration behavior, a series of Zr-based metallic glasses, exhibiting a broad range of glass transition temperatures (Tg), were meticulously manufactured. The stress drop magnitude initially decreases before the peak-rejuvenation induced by CTC, then gradually increases, while the number of stress drops exhibits an initial increase and then a decrease. These trends correlate with optimized plasticity of the metallic glasses. Remarkably, metallic glasses with lower Tg predominantly undergo strain hardening during plastic deformation. They exhibit lower viscosity in shear band zones and stress drop compared to others, attributed to the temperature increase around shear band zones approaching Tg. This phenomenon promotes shear band activation in smaller flow units, leading to finer serrations compared to glasses with higher Tg.

Thiol-ene-based degradable 3D printed network from bio resource derived monomers ethyl-lactate and isosorbide

A polymeric ene-based thiol-ene network is reported that was demonstrated for light-based 3D printing. Allyl poly (acrylate ethyl lactate) (PAEL) was synthesized starting from ethyl lactate in an efficient and scalable manner. Ethyl lactate is a biobased material obtained naturally or chemically in high yields in the form of ethyl ester of lactic acid. Isosorbide, which is also a bio based resource was converted into thiol derivative and was used along with Pentaerythritol tetrakis(3-mercaptopropionate) (PETMP) as multifunctional thiol. The polymeric nature of the ene (i.e. PAEL) imparted exceptionally high mechanical properties like Young's modulus of 1.75 GPa as well as high thermal stability with a decomposition temperature (Td,10%) exceeding 350 °C for all the networks studied. The properties could also be customized by fine tuning the type and stoichiometric ratio of the thiol crosslinked employed. For instance, the Young's modulus range from 1.75 GPa to 1.03 GPa and glass transition temperature range from 44 °C to 54 °C could be achieved. DLP 3D printing was used to demonstrate the printability of the resins with high resolution and structural fidelity. The study also highlights the base-mediated rapid hydrolytic degradation efficiency of the 3D printed parts, demonstrating the applicability of these novel polymeric ene based thiol-ene for sustainable and eco-friendly 3D printable formulations.

A stiff and tough triple-shape memory hydrogel triggered at body temperature by hydrophobic association and electrostatic interaction

While triple-shape memory hydrogels (TSMHs) are considered promising materials for intelligent medical devices, obtaining TSMHs triggered at the human body temperature with adequate mechanical performance remains challenging. Herein, a stiff and tough TSMH with a wide glass transition temperature (Tg) range at approximately 36 °C is constructed by copolymerizing hydrophobic 2-aminoethyl methacrylate isopropyl carbamate (IMA) with zwitterionic sulfobetaine methacrylate (SBMA). While the introduction of SBMA into the poly(2-aminoethyl methacrylate isopropyl carbamate) (PIMA) polymer chain weakens the ultra-strong hydrophobic association, it causes an electrostatic interaction, which increases the flexibility of the copolymer chains and the cross-linking density of the network. Based on these structural characteristics, the poly(2-aminoethyl methacrylate isopropyl carbamate-co- sulfobetaine methacrylate) [P(IMA-co-SBMA)] hydrogels show reasonable triple shape memory effect with wide Tg ranging from 22 °C to 46 °C, Young's modulus from 2.82 MPa to 22.15 MPa, and fracture strain from 43 % to 444 %. This study provides a novel strategy for balancing the mechanical properties and Tg of TSMHs as materials for intelligent medical devices.

Processable crosslinked terpolymers made from elemental sulfur with wide range of thermal and mechanical properties

Inverse vulcanization has emerged as a popular strategy for transforming the waste material, elemental sulfur, into functional polymers with high sulfur content (>50 wt.%, normally). Inverse vulcanized polymers are intrinsically processable and recyclable, and have been demonstrated as promising for applications in many fields. However, the mechanical properties of inverse vulcanized polymers are currently underdeveloped. If this kind of material is to be widely used in some scenarios to replace some traditional plastics, it is necessary to make them with appropriate thermal and mechanical properties that meet basic application requirements. Here, we report a series of terpolymers copolymerized from two distinct organic comonomers and elemental sulfur to obtain polymers with a wide range of glass transition temperatures (−43 °C to 45 °C) that exhibit good mechanical properties, by blending crosslinkers with varying feed monomer ratio and chain length of linear sections, which expands the application opportunities of inverse vulcanization.

Superior high-temperature mechanical and thermal performance of carbon fiber/epoxy composites by incorporating highly dispersed aramid nanofibers

Enhancing the high-temperature properties of polymer-matrix fiber-reinforced composites is a challenging task, given the thermal limitations of polymer resins. In this study, we propose a straightforward and efficient method for producing high-performance carbon fiber/epoxy composites with superior high-temperature properties by incorporating highly dispersed aramid nanofibers. To achieve high dispersion of aramid nanofibers in the epoxy, we used a sequential solvent exchange method, which allowed us to fabricate B-stage cured resin films. The aramid nanofiber-hybridized carbon fiber composite, manufactured using resin film infiltration, demonstrated impressive mechanical and thermal properties. Specifically, in the glass transition temperature range at high temperatures, the composite provided 3.1, 5.1, and 6.8 times higher Young's modulus, tensile strength, and short beam strength, respectively, compared to the unmodified composite. Moreover, incorporating aramid nanofibers significantly increased the glass transition temperature by 31 °C, resulting in 2.4 times higher storage modulus and improved thermal stability with an increase in the total weight residue at 800 °C by 33.7 %. Therefore, the highly dispersed aramid nanofiber-embedded carbon fiber composite shows great potential for use in high-performance polymer composite applications.

Influence of Epoxy Functional Chain-Extenders on the Thermal and Rheological Properties of Bio-Based Polyamide 10.10.

Bio-based polyamide 10.10 (PA 10.10) has excellent properties compared to other bio-based polymers such as polylactic acid (PLA) or polyhydroxyalkanoates (PHAs) and is therefore used in more technical applications where higher strength is required. For foam and filament extrusion, a good balance between strength and stiffness of the polymer is needed. Therefore, two commercial chain-extenders (Joncryl® ADR types) with different epoxy functionalities are used to modify the melt properties of PA 10.10. The chain-extenders are used in a concentration range up to 1.25 wt.%. The range of glass transition temperature widens with increasing Joncryl® content, and the apparent activation energy shows a maximum at a concentration of 0.5 wt.%. Furthermore, the melting temperatures are constant and the crystallinity decreases with increasing chain-extender content due to the formation of branches. During the second heating run, a bimodal melting peak appeared, consisting of α-triclinic and pseudo γ-hexagonal crystals. The weight average molar masses (Mw) measured by gel permeation chromatography (GPC) increased linearly with increasing ADR 4400 content. In contrast, the compounds containing ADR 4468 show a maximum at 0.5 wt.% and it begins to decrease thereafter. The rheological data show an increase in viscosity with increasing chain-extender content due to branch formation. ATR spectra of the compounds show a decrease at the wavelength of the primary (3301 cm-1) and secondary (1634 cm-1) (-NH stretching in PA 10.10) amine, indicating that chain-extension, e.g., branching, takes place during compounding.

Molecular design of soluble poly(amide-imide) with high char yield for flame retardant epoxy resin

Abstract In this study, a noncoplanar diimide diacid monomer (DIDA) was synthesized by direct condensation of trimellitic anhydride (TMA) with m-tolidine. The noncoplanar unit was incorporated into poly(amide-imide)s (PAIs) main chain by Yamazaki-Higashi phosphorylation of DIDA with various aromatic diamines. Encouragingly, all of the PAIs show good solubility in some common solvents such as N,N-Dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), and m-cresol. In addition, the soluble PAIs show good optical transmittances of beyond 85 % at 500 nm due to the decreased crystallization ability. On the other hand, PAIs possess good mechanical properties with tensile strengths of 72–90 MPa and tensile moduli beyond 2 GPa. Meanwhile, the designed PAIs also exhibit excellent thermal properties: their glass transition temperatures (T g) range from 278 to 314 °C, initial decomposition temperatures (5 % weight loss temperatures, T 5wt%) are beyond 470 °C, coefficients of thermal expansion (CTE) are below 10 ppm/°C. The excellent mechanical and thermal properties are due to the strengthened hydrogen bonding interaction among the amide groups. Therefore, it is believed that incorporating noncoplanar unit and amide group into the polymer main chain at the same time can simultaneously improve processability, optical transparency, mechanical and thermal properties. Furthermore, it is worth noting that the char of PAI at 800 °C is as high as 72.5 %, which is one of the highest known values. When PAI was incorporated into epoxy resin, the blend passed UL94 V-0 rating due to the high charring capability of PAI.

Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.

This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young's modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25-35 °C (EL) and 235-260 °C (EH), coefficient of thermal expansion (α1, α2), and the temperature change (∆T) between EL and EH. Results show that, within the range of extreme values of material properties, EL and α1 are the critical factors that affect wafer warpage during the decarrier process in fan-out packaging. α1 has a more significant impact on wafer warpage compared with EL. EH, α2, Tg, and ∆T have little influence on wafer warpage. Additionally, the study identified the optimized material property of the epoxy molding compound that can reduce the maximum wafer warpage in the X and Y directions from initial values of 7.34 mm and 7.189 mm to 0.545 mm and 0.45 mm, respectively, resulting in a reduction of wafer warpage of 92.58% (X direction) and 93.74% (Y direction). Thus, this study proposes an approach for evaluating the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. The approach aims to address the issue of excessive wafer warpage due to material variation and to provide criteria for selecting appropriate epoxy molding compounds to enhance process yield in packaging production lines.