Thin layered structures of dissimilar materials have found increasing applications in many new advancing technologies. For instance, a layered structure is an essential feature in packaged electronic devices and in the more recent microelectromechanical systems (MEMS). The performance of thin layered structures under hygrothermal and mechanical loads has been a subject of intense research during the past decade or so. One wellrecognized problem associated with the performance of the layered systems in electronic devices is delamination and subsequent cracking of the packaging system, and the mechanisms have been studied in detail [1, 2]. Delamination behavior in these layered structures is a time-dependent, coupled process under hygrothermalmechanical loading [3]. The onset and growth of delamination and the subsequent cracking behavior in layered systems depend on geometric configuration of the system, layer thickness, amount of entrapped moisture, interfacial characteristics between the layers, reflow process temperature, as well as material properties (elastic modulus) [1, 4, 5]. Although thermal mechanical fatigue behavior in layered structures has been demonstrated [5–7], available data are still very limited in the literature [1, 8–10]. Currently standard tests for evaluating the durability and reliability of electronic components are based on rather crude methods. They include temperaturehumidity-bias (THB) tests, temperature cycling tests, pressure pot tests, and thermal shock tests [11]. All of the aforementioned tests are performed based on mode II shearing fracture in real specimens (for instance, packaged chips), however, an efficient and effective way of conducting well-controlled tests for design purposes at constant temperature is not currently available. Data for mode I fracture is not available because of difficulties in defining a testing method. As a result, a systematic approach in designing layered structures for improved durability through analysis and well-controlled experiments is of great interest to related industries. The conventional adhesion test includes tab pull testing, button shear testing, pressurized blister testing, and peel testing. However, as the size and the thickness of layered systems are decreasing with advancing technical demands, for instance, thin polymer coating, difficulties are anticipated in carrying out these types of tests for samples thinner and smaller in size. To date, a standard methodology has not yet been established. Recently, a shaft-loaded loaded blister test method has been developed to evaluate the adhesion strength of the film-substrate system [12–14]. Theoretical analysis and experimental results on model systems have shown that the shaft-loaded blister test is an effective way of evaluating the performance of layered structures, especially for systems in the micro scale. The objective of this short communication is to report on the use of the shaft-loaded blister method to study the durability of the film-substrate interface under repeated mechanical loading. The experimental setup for the shaft-loaded blister test consisted of a rigid plate (the substrate) with a center hole and a loading shaft with a steel ball tip. An aluminum plate (15 cm× 10 cm× 0.5 cm) with a 20 mmdiameter central hole and a glass plate (10 cm× 10 cm × 0.5 cm) with a 15 mm-diameter center hole were used as substrates. The surface of the aluminum plate was finely polished while the smooth-surfaced glass plate was used as received. The loading shaft, a 5 cm long, 6 mm-diameter hollow shaft with an 8 mm diameter steel ball firmly attached at one end, was fastened to the cross head. A commercially available adhesive tape (Nikko tape, 7.5 cm width, 50μm thick) was used as the thin film for all samples. Before adhering the film onto the substrate, the surface of the plate was pretreated by spraying on to it a uniform, thin layer of silicone mold release in order to enhance delamination. The experimental set up is shown in Fig. 1. The substrate with the attached film was affixed on top of a rigid support between the cross-heads, with the adhesive side of the film facing the steel ball, and the center of the circular hole aligned with the loading point. Both quasi-static tests and cyclic tests were carried out in an Instron Tester using a 50 N load cell.