There has been a resurgence of the TEM/STEM being applied to the inspection and microanalysis of solid state electronic structures and devices. As the IC industry scaled down to submicron lines and spaces the IC designer, manufacturing processor and failure analyst required better “eyes” than the SEM could give. In addition to the image improvement, the TEM/STEM provided the microanalysis capability of microelectron diffraction (<30 angstroms) and sub-micron EDXA of ultra-thinned samples.