Fabrication Of TFTs Research Articles

Considerations for Large Area Fabrication of Integrated a-Si and Poly-Si TFTs

ABSTRACTThe combination of a-Si low leakage pixel TFTs with poly-Si TFTs in peripheral circuits provides an excellent method for reducing the number of external connections to large-area imaging arrays and displays. To integrate the fabrication of the peripheral poly-Si TFTs with the a-Si pixel TFTs, we have developed a three-step laser process which enables selective crystallization of PECVD a-Si:H. X-ray diffraction and transmission electron microscopy show that the polycrystalline grains formed with this three-step process are similar to those crystallized by a conventional one step laser crystallization of unhydrogenated amorphous silicon. The grain size increases with increasing laser energy density up to a peak value of a few Microns. The grain size decreases with further increases in laser energy density. The transistor field effect mobility is correlated with the grain size, increasing gradually with laser energy density until reaching its maximum value. Thereafter, the transistors suffer from leakage through the gate insulators. A dual dielectric gate insulator has been developed for these bottom-gate thin film transistors to provide the correct threshold voltages for both a-Si and poly-Si TFTs.

Rapid Thermal Crystallization Of LPCVD Amorphous Silicon Films

AbstractThe crystallization of LPCVD a-Si by Rapid Thermal Anneal was investigated. RTA polysilicon films can find application in the fabrication of TFTs for AMLCDs, due to the lower thermal budget associated with fast crystallization at high temperatures. It was found that the grain size of the crystallized films decreases with the temperature, in the range of 700°C to 1100°C, while for higher temperatures the opposite trend is observed. The latter observation was attributed to the high thermal vibration of subcritical clusters, that was assumed responsible for the decline in the nuclei population at high annealing temperatures, combined with the faster crystalline growth rate at high temperatures. RTA silicon films were found to have lower intra-grain defect density, that may result in the improvement of the electrical characteristics of the polysilicon films.

Pulsed laser crystallization and doping for the fabrication of high-quality poly-Si TFTs

We review the various applications of pulsed lasers, working in the nanosecond regime, to prepare high-quality poly-Si TFTs. It is shown that the best device performances (field-effect mobilities in excess of 140 cm 2/V·s) are achieved by pulsed excimer laser crystallization of unhydrogenated amorphous Si thin films. In addition, for source and drain formation, we demonstrate that the excimer laser induced diffusion of dopant from a solid source (spin-on phosphorus-doped silicate glass) is very attractive to achieve good electrical properties of the n-channel TFTs.

Poly-crystalline silicon thin film devices for large area electronics

Thin film devices are generating increasing interest for large area electronics on glass applications. The use of glass substrates limits the temperature range available for device processing, leading to the widespread use of plasma deposited amorphous silicon. However, due to the low carrier mobility in this material, attention is being directed towards low temperature processed poly-silicon devices. In this paper the different technologies for the fabrication of poly-Si TFTs are reviewed and the influence of the resulting grain structure on device performance is discussed.