The thermal spike model is investigated theoretically in order to clarify the mechanism of defect production by electron excitation in Cu [Iwase et al., J. Phys. Soc. Jpn 61 (1992) 3878]. The electron temperature and the lattice temperature are calculated numerically solving the heat-flow equation. It is clarified that the maximum lattice temperature is about 100 K when the electronic stopping power of the incident ion is 100 keV/nm and the initial lattice temperature is 10 K. This means that no defect is created by purely thermal processes induced by electron excitation in the case of Cu.
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