Encapsulation Layer Research Articles

Parylene C as a Multipurpose Material for Electronics and Microfluidics.

Poly(p-xylylene) derivatives, widely known as Parylenes, have been considerably adopted by the scientific community for several applications, ranging from simple passive coatings to active device components. Here, we explore the thermal, structural, and electrical properties of Parylene C, and further present a variety of electronic devices featuring this polymer: transistors, capacitors, and digital microfluidic (DMF) devices. We evaluate transistors produced with Parylene C as a dielectric, substrate, and encapsulation layer, either semitransparent or fully transparent. Such transistors exhibit steep transfer curves and subthreshold slopes of 0.26 V/dec, negligible gate leak currents, and fair mobilities. Furthermore, we characterize MIM (metal-insulator-metal) structures with Parylene C as a dielectric and demonstrate the functionality of the polymer deposited in single and double layers under temperature and AC signal stimuli, mimicking the DMF stimuli. Applying temperature generally leads to a decrease in the capacitance of the dielectric layer, whereas applying an AC signal leads to an increase in said capacitance for double-layered Parylene C only. By applying the two stimuli, the capacitance seems to suffer from a balanced influence of both the separated stimuli. Lastly, we demonstrate that DMF devices with double-layered Parylene C allow for faster droplet motion and enable long nucleic acid amplification reactions.

Asymmetric “Janus” Biogel for Human‐Machine Interfaces

AbstractHuman‐machine interfaces (HMIs) are essential for effective communication between machines and tissues. However, mechanical and biological mismatches, along with weak adhesion between rigid electronic devices and soft tissue, often cause unreliable responses and affect the signal recording of HMIs. In this study, an asymmetrical “Janus” biogel patch with one side firmly adhering to tissues, and the other surface having little adhesion and minimal interactions with surrounding environments has been developed. A series of analytical, mechanical, and electrical tests are performed to investigate the “Janus” biogel patch as a functional and biocompatible HMI. It is found that the gallic acid‐modified gelatin adhesive surface on one side exhibits body temperature‐dependent tissue adhesion, enabling low modulus and seamless skin contact. The other side is a tough gelatin/glycerol gel layer, which is thermally welded into the adhesive layer and functions as an encapsulant to prevent external interference due to adhesion. The encapsulation layer also exhibits a low friction coefficient when wet and proves to be a reliable alternative barrier to conventional encapsulation materials. The scientific insights and engineering principles revealed in this type of “Janus” biogel will be applicable to a broad range of biomedical applications, such as epidermal adhesive electrodes or skin‐adhesive wearable devices.

Latest Advances in Narrow‐Band Phosphors and Their Role in Color Management

Latest Advances in Narrow‐Band Phosphors and Their Role in Color Management

Corrections to ‘‘Thermal Impact of Rear Insulation, Light Trapping, and Parasitic Absorption in Solar Modules’’ [Jul 22 1043-1050

In the above paper, there were errors in digitizing the spectral irradiance and extinction coefficient arrays. With the spectral irradiance fixed to the tabulated AM1.5G standard, the full-spectrum absorptance of GaAs changes by 2%. This change is on the order of the uncertainty of reflectance measurements. Furthermore, this change can be balanced by a proportional increase in the convection coefficient, leading to no visible changes to most figures. However, in the last two figures, there were changes on the order of 1%–3% for reflectance and 1 °C for modeled temperatures. This error is commensurate with the sample-to-sample variability in the extinction coefficients. Finally, the original abstract should be updated to “In Si modules, light trapping more than doubles the parasitic absorption of encapsulation layers, limiting the maximum sub-bandgap reflection to 66%. Higher values require thorough optimization of front, bulk, and rear layers, but could lower operating temperatures by up to 11 °C for insulated Si modules.” In the uncorrected abstract, the maximum sub-bandgap reflection was stated to be 63%, and the potential change in temperatures was stated to be 12 °C.

An efficient way of harvesting mechanoluminescent light: Flexible pressure sensor application

Mechanoluminescent (ML) materials are used for fabricating sensors and other devices such as artificial skin, colorful displays, and energy harvesting devices. However, a key challenge in developing ML-based sensors is the ability to effectively capture and efficiently transmit ML light from the sensing location. Here we report a flexible and sensitive thin film pressure sensor, created using a novel combination of ML material and perovskite. In this work, we adopted a simple lateral type design of a thin pressure sensor primarily consisting of (i) a sensing layer of copper-doped zinc sulfide (ZnS:Cu)/polydimethylsiloxane (PDMS) composite and (ii) a light absorbing layer of perovskite. The mixed halide perovskite, a light absorbing material, fully absorbs the green light emitted from ZnS:Cu. The sensor demonstrated consistent signal output under the mechanical bending test. A thin encapsulation layer of PMMA on the perovskite layer prevents moisture inclusion. This innovative technique of utilizing integrated thin perovskite to efficiently harvest ML light has the potential to open up new avenues for advanced research in ML-perovskite-based sensor systems.

High‐Performance Low‐kPoly(dicyclopentadiene) Nanocomposites as Achieved via Reactive Blending with Norbornene‐Functionalized Larger POSS

AbstractLow dielectric constant (k) polymers with excellent comprehensive properties are useful materials in the microelectronics industry as matrix resins or encapsulation layers. With the inherent low polarization, high reactivity, good processability, and low cost, poly(dicyclopentadiene) (PDCPD) has received considerable attention as low‐kmaterials. However, its practical application is limited by the relatively high thermal expansion andkvalue. Herein, three norbornene‐functionalized polyhedral oligomeric silsesquioxanes (POSSs) with T8, T10, and T12polyhedral cores are synthesized and employed for enhancing the dielectric and comprehensive properties of PDCPD via reactive blending. The results show that these POSSs have good compatibility with PDCPD matrix and nano‐dispersed POSSs particles could be obtained. As a result, the materials’ properties can be largely enhanced by varying the POSS content and POSS size. Especially, PT12N12‐40 (40 wt% of T12N12) shows the lowestkvalue (2.1) and coefficient of thermal expansion (63.4 ppm°C−1), highest glass transition temperature (202.5 °C), yield strength (78.0 MPa), and elastic modulus (2.36 GPa), along with excellent hydrophobicity. This study highlights a useful strategy to fabricate high‐performance low‐kpolymer nanocomposites by using larger POSS and reactive blending, which provides useful materials for the future microelectronic industry and high frequency communication.

In Situ 1D Carbon Chain-Mail Catalyst Assembly for Stable Lithium-Sulfur Full Batteries.

The main obstacles for the commercial application of Lithium-Sulfur (Li-S) full batteries are the large volume change during charging/discharging process, the shuttle effect of lithium polysulfide (LiPS), sluggish redox kinetics, and the indisciplinable dendritic Li growth. Especially the overused of metal Li leads to the low utilization of active Li, which seriously drags down the actual energy density of Li-S batteries. Herein, an efficient design of dual-functional CoSe electrocatalyst encapsulated in carbon chain-mail (CoSe@CCM) is employed as the host both for the cathode and anode regulation simultaneously. The carbon chain-mail constituted by carbon encapsulated layer cross-linking with carbon nanofibers protects CoSe from the corrosion of chemical reaction environment, ensuring the high activity of CoSe during the long-term cycles. The Li-S full battery using this carbon chain-mail catalyst with a lower negative/positive electrode capacity ratio (N/P < 2) displays a high areal capacity of 9.68mAhcm-2 over 150 cycles at a higher sulfur loading of 10.67mgcm-2 . Additionally, a pouch cell is stable for 80 cycles at a sulfur loading of 77.6mg, showing the practicality feasibility of this design.

Surface Passivation for Promotes Bi-Excitonic Amplified Spontaneous Emission in CsPb(Br/Cl)3 Perovskite at Room Temperature.

Perovskite-type lead halides exhibit promising performances in optoelectronic applications, for which lasers are one of the most promising applications. Although the bulk structure has some advantages, perovskite has additional advantages at the nanoscale owing to its high crystallinity given by a lower trap density. Although the nanoscale can produce efficient light emission, its comparatively poor chemical and colloidal stability limits further development of devices based on this material. Nevertheless, bulk perovskites are promising as optical amplifiers. There has been some developmental progress in the study of optical response and amplified spontaneous emission (ASE) as a benchmark for perovskite bulk phase laser applications. Therefore, to achieve high photoluminescence quantum yields (PLQYs) and large optical gains, material development is essential. One of the aspects in which these goals can be achieved is the incorporation of a bulk structure of high-quality crystallization films based on inorganic perovskite, such as cesium lead halide (CsPb(Br/Cl)3), in polymethyl methacrylate (PMMA) polymer and encapsulation with the optimal thickness of the polymer to achieve complete surface coverage, prevent degradation, surface states, and surface defects, and suppress emission at depth. Sequential evaporation of the perovskite precursors using a single-source thermal evaporation technique (TET) effectively deposited two layers. The PL and ASEs of the bare and modified films with a thickness of 400 nm PMMA were demonstrated. The encapsulation layer maintained the quantum yield of the perovskite layer in the air for more than two years while providing added optical gain compared to the bare film. Under a picosecond pulse laser, the PL wavelength of single excitons and ASE wavelength associated with the stimulated decay of bi-excitons were achieved. The two ASE bands were highly correlated and competed with each other; they were classified as exciton and bi-exciton recombination, respectively. According to the ASE results, bi-exciton emission could be observed in an ultrastable CsPb(Br/Cl)3 film modified by PMMA with a very low excitation energy density of 110 µJ/cm2. Compared with the bare film, the ASE threshold was lowered by approximately 5%. A bi-exciton has a binding energy (26.78 meV) smaller than the binding energy of the exciton (70.20 meV).

Effect of a-SiCxNy:H Encapsulation on the Stability and Photoluminescence Property of CsPbBr3 Quantum Dots.

The effect of a-SiCxNy:H encapsulation layers, which are prepared using the very-high-frequency plasma-enhanced chemical vapor deposition (VHF-PECVD) technique with SiH4, CH4, and NH3 as the precursors, on the stability and photoluminescence of CsPbBr3 quantum dots (QDs) were investigated in this study. The results show that a-SiCxNy:H encapsulation layers containing a high N content of approximately 50% cause severe PL degradation of CsPbBr3 QDs. However, by reducing the N content in the a-SiCxNy:H layer, the PL degradation of CsPbBr3 QDs can be significantly minimized. As the N content decreases from around 50% to 26%, the dominant phase in the a-SiCxNy:H layer changes from SiNx to SiCxNy. This transition preserves the inherent PL characteristics of CsPbBr3 QDs, while also providing them with long-term stability when exposed to air, high temperatures (205 °C), and UV illumination for over 600 days. This method provided an effective and practical approach to enhance the stability and PL characteristics of CsPbBr3 QD thin films, thus holding potential for future developments in optoelectronic devices.

MXene Functionalized, Highly Breathable and Sensitive Pressure Sensors with Multi‐Layered Porous Structure

AbstractBreathable, flexible, and highly sensitive pressure sensors have drawn increasing attention due to their potential in wearable electronics for body‐motion monitoring, human‐machine interfaces, etc. However, current pressure sensors are usually assembled with polymer substrates or encapsulation layers, thus causing discomfort during wearing (i.e., low air/vapor permeability, mechanical mismatch) and restricting their applications. A breathable and flexible pressure sensor is reported with nonwoven fabrics as both the electrode (printed with MXene interdigitated electrode) and sensing (coated with MXene/silver nanowires) layers via a scalable screen‐printing approach. Benefiting from the multi‐layered porous structure, the sensor demonstrates good air permeability with high sensitivity (770.86–1434.89 kPa−1), a wide sensing range (0–100 kPa), fast response/recovery time (70/81 ms), and low detection limit (≈1 Pa). Particularly, this sensor can detect full‐scale human motion (i.e., small‐scale pulse beating and large‐scale walking/running) with high sensitivity, excellent cycling stability, and puncture resistance. Additionally, the sensing layer of the pressure sensor also displays superior sensitivity to humidity changes, which is verified by successfully monitoring human breathing and spoken words while wearing a sensor‐embedded mask. Given the outstanding features, this breathable sensor shows promise in the wearable electronic field for body health monitoring, sports activity detection, and disease diagnosis.

Fully paper-integrated hydrophobic and air permeable piezoresistive sensors for high-humidity and underwater wearable motion monitoring

Paper-based electronics have attracted much attention due to their softness, degradability, and low cost. However, paper-based sensors are difficult to apply to high-humidity environments or even underwater. Here, we report a fully paper-integrated piezoresistive sensing system that exhibits flexibility, waterproofing, air permeability, and biocompatibility. This system consists of hydrophobic paper as the substrate and encapsulation layer, conductive paper with a double ‘zig-zag’ and dotted surface structure as the sensing layer, and silver paste films as the interconnects. The structural design of the sensing layer helps to increase the contact area in adjacent layers under pressure and further improves the pressure sensitivity. The piezoresistive system can be worn on human skin in the ambient environment, wet environment, and water for real-time monitoring of physiological signals with air permeability and waterproofing due to its hydrophobic fiber structure. Such a device provides a reliable, economical, and eco-friendly solution to wearable technologies.

Strain and Pressure Sensors Based on MWCNT/PDMS for Human Motion/Perception Detection.

Flexible wearable devices have attracted wide attention in capacious fields because of their real-time and continuous monitoring of human information. The development of flexible sensors and corresponding integration with wearable devices is of great significance to build smart wearable devices. In this work, multi-walled carbon nanotube/polydimethylsiloxane-based (MWCNT/PDMS) resistive strain sensors and pressure sensors were developed to integrate a smart glove for human motion/perception detection. Firstly, MWCNT/PDMS conductive layers with excellent electrical and mechanical properties (resistivity of 2.897 KΩ · cm, elongation at break of 145%) were fabricated via a facile scraping-coating method. Then, a resistive strain sensor with a stable homogeneous structure was developed due to the similar physicochemical properties of the PDMS encapsulation layer and MWCNT/PDMS sensing layer. The resistance changes of the prepared strain sensor exhibited a great linear relationship with the strain. Moreover, it could output obvious repeatable dynamic response signals. It still had good cyclic stability and durability after 180° bending/restoring cycles and 40% stretching/releasing cycles. Secondly, MWCNT/PDMS layers with bioinspired spinous microstructures were formed by a simple sandpaper retransfer process and then assembled face-to-face into a resistive pressure sensor. The pressure sensor presented a linear relationship of relative resistance change and pressure in the range of 0-31.83 KPa with a sensitivity of 0.026 KPa-1, and a sensitivity of 2.769 × 10-4 KPa-1 over 32 KPa. Furthermore, it responded quickly and kept good cycle stability at 25.78 KPa dynamic loop over 2000 s. Finally, as parts of a wearable device, resistive strain sensors and a pressure sensor were then integrated into different areas of the glove. The cost-effective, multi-functional smart glove can recognize finger bending, gestures, and external mechanical stimuli, which holds great potential in the fields of medical healthcare, human-computer cooperation, and so on.

Single-crystalline van der Waals layered dielectric with high dielectric constant.

The scaling of silicon-based transistors at sub-ten-nanometre technology nodes faces challenges such as interface imperfection and gate current leakage for an ultrathin silicon channel1,2. For next-generation nanoelectronics, high-mobility two-dimensional (2D) layered semiconductors with an atomic thickness and dangling-bond-free surfaces are expected as channel materials to achieve smaller channel sizes, less interfacial scattering and more efficient gate-field penetration1,2. However, further progress towards 2D electronics is hindered by factors such as the lack of a high dielectric constant (κ) dielectric with an atomically flat and dangling-bond-free surface3,4. Here, we report a facile synthesis of a single-crystalline high-κ (κ of roughly 16.5) van der Waals layered dielectric Bi2SeO5. The centimetre-scale single crystal of Bi2SeO5 can be efficiently exfoliated to an atomically flat nanosheet as large as 250 × 200 μm2 and as thin as monolayer. With these Bi2SeO5 nanosheets as dielectric and encapsulation layers, 2D materials such as Bi2O2Se, MoS2 and graphene show improved electronic performances. For example, in 2D Bi2O2Se, the quantum Hall effect is observed and the carrier mobility reaches 470,000 cm2 V-1 s-1 at 1.8 K. Our finding expands the realm of dielectric and opens up a new possibility for lowering the gate voltage and power consumption in 2D electronics and integrated circuits.

Influence of Printed Encapsulation Layer on the Mechanical Reliability and Performance of V₂O₅ Nanowires-Based Flexible Temperature Sensors

Nanowires (NWs) based sensors have been studied extensively to measure various physical, chemical, and biological parameters as their large surface-to-volume ratio leads to sensitive devices. Further, due to the low flexural rigidity of NWs, these sensors can be developed on ultra-flexible substrates. However, their performance often degrades after repeated mechanical deformations or when they are exposed to the different ambient environment. A well-thought-out device engineering step could resolve these issues. As a potential solution, the soft material-based encapsulation layers have been explored. These are suitable for most sensor types except the temperature sensors, where they reduce the efficiency of heat transfer. Addressing this issue, we present here vanadium pentoxide (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> ) NWs based temperature sensors with nanosilica/epoxy (NS/epoxy) based encapsulation layer. The encapsulation layer is selectively deposited with high resolution electrohydrodynamic printing. The comparison of non-encapsulated (N-ES) and encapsulated (ES) devices, after applied mechanical loadings (bending and twisting), shows a robust and reliable temperature sensing performance of the latter. This study shows how the sensing performance can be preserved and the lifetime of flexible temperature sensors elongated by using an encapsulation layer.

Stretchable and self-healable conductive hydrogel-based multifunctional triboelectric nanogenerator for energy harvesting and dance motion sensing

Hydrogels with the integrated characteristics of adhesion, self-healing, deformability, and conductivity hold enormous potential for the design of next-generation flexible human body posture sensor and energy device. Here, we proposed a double-network hybrid polyacrylamide/poly(acrylic acid)/MXene/PEDOT:PET (PPMP) hydrogel with excellent flexibility, self-healing capabilities, and stability. Furthermore, the proposed PPMP conductive hydrogel with MXene/PDMS encapsulation layer can play the role of a wearable strain sensor that can be used to detect various dance movement postures, including those of facial expressions, blinking, and elbow joints. Additionally, the proposed PPMP hydrogel with MXene/PDMS encapsulation layer can function as a flexible and stretchable triboelectric nanogenerator (FS-TENG) to harvest human motion energy. The FS-TENG can obtain an open-circuit voltage (Voc) of 169.2 V and a short-circuit current (Isc) of 9.6 µA. Moreover, the electric energy generated by these FS-TENGs can be used to drive hygrothermographs. This research offers a feasible strategy to design self-powered strain sensors for use in dance posture monitoring and energy harvesting in human motion.

Thickness-Dependent Cross-Plane Thermal Conductivity Measurements of Exfoliated Hexagonal Boron Nitride.

Submicrometer-thick layers of hexagonal boron nitride (hBN) exhibit high in-plane thermal conductivity and useful optical properties, and serve as dielectric encapsulation layers with low electrostatic inhomogeneity for graphene devices. Despite the promising applications of hBN as a heat spreader, the thickness dependence of its cross-plane thermal conductivity is not known, and the cross-plane phonon mean free paths (MFPs) have not been measured. We measure the cross-plane thermal conductivity of hBN flakes exfoliated from bulk crystals. We find that submicrometer thick flakes exhibit thermal conductivities up to 8.1 ± 0.5 W m-1 K-1 at 295 K, which exceeds previously reported bulk values by more than 60%. Surprisingly, the average phonon mean free path is found to be several hundred nanometers at room temperature, a factor of 5 larger than previous predictions. When planar twist interfaces are introduced into the crystal by mechanically stacking multiple thin flakes, the cross-plane thermal conductivity of the stack is found to be a factor of 7 below that of individual flakes with similar total thickness, thus providing strong evidence that phonon scattering at twist boundaries limits the maximum phonon MFPs. These results have important implications for hBN integration in nanoelectronics and improve our understanding of thermal transport in two-dimensional materials.

Synergetic Excess PbI2 and Reduced Pb Leakage Management Strategy for 24.28% Efficient, Stable and Eco‐Friendly Perovskite Solar Cells

AbstractIntroducing excess PbI2 has proven to be an effective in situ passivation strategy for enhancing efficiency of perovskite solar cells (PSCs). Nevertheless, the photoinstability and hysteresis are still tough issues owing to the photolysis nature of PbI2. Moreover, the humidity‐related degradation of perovskite films is also a difficult territory to cover in such an in situ passivation strategy. Herein, a synergistic strategy is reported via initiatively inducing vertical graded PbI2 distribution (GPD) in the whole perovskite film and capping a cis‐Ru(H2dcbpy)(dnbpy)(NCS)2 (Z907) internal encapsulation (IE) layer on the surface to ameliorate the above issues. The GPD design can enhance luminescence, prolong carrier lifetimes, ascertaining the improvement of efficiency and elimination of photoinstability in the PSCs. Besides, the introduced IE layer not only can promote the moisture and thermal resistance, but also inhibit Pb leakage and ion migration in the PSCs. Through the synergetic regulations, the resultant PSCs exhibit an impressive open circuit voltage (VOC) of 1.253 V, fill factor of 81.25%, and power conversion efficiency (PCE) of 24.28%. Moreover, the PSCs maintain 91% of its initial PCE at relative humidity of 85% after 500 h aging and 94% under continuous heating at 85 °C after 750 h aging.

Analysis of Impact of Bioimpedance on Performance of Implant coil of Artificial Retina for Optimizing Q factor & Bandwidth.

Spiral coils are indispensable part of implantable electronics for facilitating wireless power and data transfer. Although many advanced high Q receiver design have emerged, implementing and retaining high Q in biological medium so as to improve link efficiency is challenging. This article bridges the gap between advanced techniques towards improving link efficiency and the tissue losses that deteriorates the Q factor of coil in heterogeneous tissue medium. The purpose of this research is to improve the Q factor and bandwidth of the coil in tissue medium by reducing the net conductance of the coil in tissue medium, which is comparable to the net conductance in air. Bioimpedance of each layer of the eye is modelled to identify the highly capacitive and highly conductive tissue layer in the eye. To investigate the worst-case and best-case scenario, Q factor and bandwidth of the implant coil is analysed in the eye with and without aqueous humor which is a highly conductive and capacitive tissue layer in the eye. The coil is encapsulated with breast fat which possess lowest permittivity of all body tissue. After removing the high conductive tissue layer from the implantation zone, the Q factor and bandwidth of the coil is improved by 87.5 % and 97.7 % respectively. It is observed that 100 % Q at 10 MHz and 76.75 % of bandwidth is recovered in tissue medium after using breast fat as encapsulation layer. This demonstration of coil for various test cases in tissue medium aids to device a reliable, safe and efficient wireless power/data transfer system for artificial retina.

A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation

Lamination of a thin film encapsulation (TFE) layer is regarded as one of the most promising methods that enable the reliable operation of organic electronic devices by attaching the TFE layers thereon directly using an adhesive layer. In this study, a low-temperature curable adhesive thin film with low glass transition temperature (T g) is newly designed and synthesized. Low T g allows conformal contact at the interface of the adhesive layer and the substrate subsequently leads to the enhancement of adhesion, and thus the barrier performance of the lamination of barrier film increases. In order to fabricate a low-T g adhesive layer, glycidyl methacrylate (GMA) was copolymerized with a 2-hydroxyethyl acrylate (HEA) monomer in the vapor phase via initiated chemical vapor deposition. With a 5 µm thick p(GMA-co-HEA) adhesive layer, a strong adhesion was readily achieved by curing it at 60 °C for 1 h, with the peel strength of 16.6 N/25 mm, and the water vapor transmission rate of the glass-laminated encapsulation was as low as 3.4 × 10−3 g/m2 · day under accelerating conditions (38 °C, 90% relative humidity). We believe the low-temperature curable thin adhesive layer will serve as a powerful material for the lamination of organic electronic devices in a damage-free way.

Impact of different backsheets and encapsulant types on potential induced degradation (PID) of silicon PV modules

Photovoltaic (PV) modules during field exposure are subject to many durability and reliability issues, such as potential induced degradation (PID). The shunting type PID (PID-s) can significantly affect module performance. Most of the current studies on PID-s focus on understanding its mechanisms and mitigating its effects by modifying the glass, cell, or encapsulant component. Since the backsheet type influences the water vapor transmission rate, the conductivity of the encapsulant is significantly influenced by the backsheet type, and hence the level of voltage drop in the encapsulant layer during the PID stress test. The higher the conductivity of the encapsulant, the lower the voltage drop in the encapsulant and the worse the PID. Therefore, in the current work, the influence of four different backsheet types (PVF, PVDF, PA, ECTFE) and two different encapsulant types (EVA and POE) on PID is investigated. With multiple construction combinations of these materials, a set of 1-cell modules were fabricated and stressed for PID using an environmental chamber at −1000 V and 85 °C/85 %RH for 288 h. The performance and defect level changes were obtained using several pre- and post-stress characterizations, including IV and EL. The results indicate a power degradation in the range between 0 % and 9 %, depending on the backsheet-encapsulant combination. The results of this study are pertinent to understanding the influence of substrate relative to PID in PV modules. Moreover, these results can also help the manufacturers to select the best backsheet-encapsulant combination to minimize the persisting PID issues in the field.