Electromigration Effects Research Articles

Electrokinetic in situ leaching of U from low-permeability uranium ore

In this study, the impacts of electrokinetic in situ leaching of uranium (EK-ISLU) on the pore structure and connectivity of the low-permeability uranium ore and its leaching efficiency were investigated. Our results demonstrated that a direct current field with an intensity of 7.5 V/cm increased the porosity by 7.07 % and enhanced the uranium leaching efficiency by 73.73 % using a sulfuric acid solution. Under electrical stimulation, the leaching agent exhibited uniform penetration ability through combined electromigration and electroosmosis effects, significantly improving the directed migration of the target ions. Various characterization techniques, such as Fourier transform infrared (FTIR) spectroscopy, scanning electron microscopy-energy dispersive X-ray spectrometry (SEM-EDS), three-dimensional computed tomography (CT) pore scanning and Brunauer-Emmett-Teller (BET), showed that the electrokinetic-induced action overcame the preferential flow phenomena, promoted the dissolution of the target minerals and gangue rocks, and notably improved the pore structure to ultimately enhance the uranium leaching efficiency. Our results provide valuable insights for the development of innovative technologies aimed at efficiently recovering U from low-permeability uranium ores.

Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires: A nanoindentation test with molecular dynamics simulation study

Electromigration (EM) is a crucial failure mode in Aluminum (Al) interconnection wires those are widely used in high density semiconductor packaging. This study systematically investigated the influence of EM on the mechanical properties of Al interconnects via nanoindentation experiments and molecular dynamics (MD) simulations. The results are list as follows. (1) The indentation depth gradually increases with the increase in indentation load, resulting in a gradual increase and stabilization of the Young’s modulus and hardness of the structure. Within a specific range, the influence of the loading rate on the indentation depth and mechanical properties is relatively small. (2) The region where Young’s modulus of the interconnect decreases correlates with the location where EM-induced voids initiate. EM-induced voids have a direct impact on the material’s mechanical properties, particularly the decrease in Young’s modulus. (3) These EM-induced voids affect the nucleation and formation of dislocations. With the increase in void concentration and indentation depth, The generation and slip of dislocations increase as the void concentration and indentation depth increase, leading to a decrease in the material’s mechanical properties over time. This comprehensive findings expand the knowledge on mechanical behavior degradation of Al interconnects when EM failure occurs, providing a scientific basis for designing and optimizing high density semiconductor packaging.

Iodide- and electrochemical assisted removal of mercury by Cirsium arvense from gold tailings in the Amansie West District, Ghana

Mercury (Hg) pollution in Ghana through mining has become a serious environmental challenge. This study investigates the potential of Cirsium arvense to photostabilize Hg using electrokinetic current with or without an iodide solution in gold mine tailings heavily contaminated through mining activities in southern Ghana. An initial Hg concentration of 9.60 mg/kg using cold vapor atomic absorption spectrometry (CVAAS) was determined. The biological absorption coefficient, bioconcentration factor, and translocation factor of Hg have been presented. Cirsium arvense therefore had a higher bioconcentration factor (BCF) of 2.6–5.15 mg/kg, and a transfer factor (TF) of 0.24–0.36 indicating a higher efficiency for phytostabilization. Both the rate and time of extractions of Hg from the tailings by Cirsium arvense are efficiently improved in the combined electric current and iodide treatment. Plant and electric current combined treatment and plant and iodide combined treatment had only 60 and 50% phytostabilization rates, respectively. The combined plant, iodide, and electric current treatment has proven to be superior with about >90% Hg removal rate. Therefore, the combined plant, iodide, and electric current treatment resulted in a higher Hg removal efficiency by Cirsium arvense in a shorter period due to higher solubilization rate and electromigration effects on Hg species.

Ultrafast recrystallization and grain refinement of 2A97 Al-Cu-Li alloy by electropulsing assisted annealing at lower temperature

In the current work, a pulsed current was applied on recrystallization annealing to promote the recrystallization of cold-rolled 2A97 Al-Cu-Li alloys. Besides, the effect of stored deformation energy on electropulsing assisted recrystallization was also investigated. The results indicated that, with the assistance of electropulsing, the complete recrystallization temperature of the 55 % cold-rolled alloys was decreased from 480 °C to 440 °C, and the holding time was significantly decreased from 30 min to 15 s. Moreover, the recrystallization promotion effect of electropulsing was enhanced with the increment of stored deformation energy. As the rolled reduction increased from 23 % to 55 %, the drop in complete recrystallization temperature induced by electropulsing rose from 20 °C to 40 °C. Additionally, the average grain size decreased from 46.8 μm to 22.6 μm, leading to an enhancement in the mechanical properties of the 2A97 alloy. The microstructure observation showed that the electropulsing assisted recrystallization was a process of nucleation and nuclei growth dominated by dislocation rearrangement, and the ultrafast recrystallization at lower temperature induced by electropulsing may be attributed to the reduction of the nucleation energy barrier and the promotion of dislocation rearrangement caused by the ‘local hot spot effect’ and ‘electromigration effect’.

Microstructural and kinetics analysis of FeB–Fe2B layer grown by pulsed-DC powder-pack boriding on AISI 316 L steel

In this study, novel findings were obtained regarding the influence of a 10 A current intensity on the growth of an FeB–Fe2B layer during pulsed-DC powder-pack boriding. Boride layer formation was carried out on AISI 316 L steel at 1123–1223 K for different exposure times at each temperature, considering 10 s polarity inversion cycles. The boride layer was characterized by x-ray diffraction and high-speed Berkovich nanoindentation, the latter being used to determine the hardness and reduced Young’s modulus mappings along the depth of the layer-substrate system. Moreover, the growth kinetics of the FeB–Fe2B layer on the steel’s surface was modeled using the heat balance integral method (HBIM). This involved transforming Fick’s second law into ordinary differential equations over time, assuming a quadratic boron concentration profile in space to determine the B diffusion coefficients in FeB and Fe2B, respectively. From the Arrhenius relationship, the B activation energies in the boride layer were estimated considering the contribution of the electromigration effect; the results showed an approximately 30% reduction compared to the values obtained in the conventional powder-pack boriding for AISI 316 L steel. Finally, the theoretical layer thickness obtained by the HBIM demonstrated an error of no more than 5% against the experimental FeB and FeB + Fe2B layer thickness values.

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

To mitigate the decrease in mechanical performance of Sn58Bi/Cu solder joints resulting from electromigration-induced damage. The CeO2 nanoparticles were incorporated into Sn58Bi solder by a melt-casting method, and their effects on the microstructure and properties of Sn58Bi/Cu solder joints under electromigration were investigated. The study results demonstrate that the addition of 0.125 ~ 0.5 wt% CeO2 nanoparticles refines the eutectic microstructure of Sn58Bi solder alloy. At an addition amount of 0.5 wt%, the composite solder alloy exhibits the maximum tensile strength of 68.9 MPa, which is 37% higher than that of the base solder. CeO2 nanoparticle-reinforced Sn58Bi solder can achieve excellent solderbility with Cu substrates and the joints can significantly inhibit the growth of the anodic Bi-rich layer, which is responsible for electromigration. With the extension of current stressing time, Bi-rich and Sn-rich layer are respectively formed on the anode and cathode in the joints. The intermetallic compound (IMC) layer grows asymmetrically, transitioning from a fan-shaped morphology to a flattened structure at the anode and to a thickened mountain-like morphology at the cathode. Adding the CeO2 nanoparticles helps to mitigate the decrease in mechanical performance caused by electromigration damage during current application to some extent. Over the current stressing period of 288 ~ 480 h, the fracture position shifts from the anodic IMC/Bi-rich interface to the cathodic Sn-rich/IMC interface. The fracture mechanism transitions from a brittle fracture characterized by plate-like cleavage to a ductile–brittle mixed fracture with fine dimples and cleavage.

Electromigration Effects in Overcurrent PVC-Insulated Copper Wire: Failure and Deformation Impacts

Electromigration is a critical issue in materials science and electrical engineering, significantly impacting the reliability and efficiency of electrical systems. This study investigates the electromigration behavior of PVC-insulated copper wires under various overcurrent conditions, focusing on material degradation and electrical performance. Copper cables, identified as 046620.3 Eterna CU/PVC 1.5 mm2, were subjected to currents ranging from 0 to 110 A. The mean time to failure (MTTF) was calculated using Black’s equation, revealing a sharp decline in MTTF with increasing current density. Surface morphology analysis using SEM showed the formation of voids and hillocks at higher currents, indicating severe electromigration damage. XRF analysis demonstrated significant changes in the elemental composition, particularly a reduction in copper content and an increase in chlorine and other elements, suggesting degradation of the PVC insulation. FTIR spectroscopy revealed substantial chemical changes in the PVC material, especially under extreme overcurrent conditions, highlighting dehydrochlorination and carbonyl group formation. There is a clear relationship between overcurrent conditions and electromigration phenomena, as evidenced by the observed damage to surface morphology, changes in elemental composition, and alterations in the chemical structure of PVC. The mechanisms and causes of electromigration are explained comprehensively in this work, illustrating how increased overcurrent accelerates the electromigration process, leading to the formation of voids and hillocks in the copper conductor. This damage is accompanied by a significant reduction in copper content and an increase in chlorine levels, indicating the degradation of PVC insulation. FTIR spectra further confirmed these findings by showing chemical changes such as dehydrochlorination and carbonyl group formation under high current stress. The MTTF values reflect the severity of these impacts, with samples exposed to higher currents showing drastically reduced lifespans. For instance, samples subjected to 100 A and 110 A currents exhibited MTTF values of 0.2 minutes and 0.004 minutes, respectively.

Electromigration effect of nano-Fe3O4 in concrete under chloride erosion environment

In order to improve the effectiveness of electro-migration repair technology, researchers have introduced new materials to address the adverse effects of electrochemical repair on concrete, such as interface softening in reinforced concrete. In this study, a dispersed solution of nano-Fe3O4 was selected as the anode electrolyte. Concrete specimens were subjected to electric treatment for repair, and the entry of nano particles into the concrete under the action of an external electric field was investigated. The microstructure and mechanical properties of the repaired concrete material were analyzed using techniques such as potentiodynamic polarization curve, chemical titration, scanning electron microscopy, energy spectrum analysis, mercury intrusion porosimetry, and pull-out test. The results showed that after 15 days of electrochemical nano-repair, the passivation film on the steel reinforcement was repaired, resulting in a 57 % reduction in corrosion rate and prevention of further chloride ingress, thus improving the corrosion resistance of the reinforcement. Furthermore, the electrochemical nano-repair did not affect the outward migration of chloride ions from the concrete, with a chloride removal efficiency as high as 72.6 %. When the treatment duration was 15 days and the current density was 3 A/m2, the bond strength exhibited the greatest improvement, with an increase of 99.15 %. Compared to electrochemical chloride removal, the electrochemical nano-repair reduced the porosity in the middle and inner layers by 17.8 % and 14.8 %, respectively. Microstructural analysis revealed that the electromigrated nano-Fe3O4 particles were uniformly dispersed within the concrete, replacing harmful byproducts and filling the pores.

Hall current effect on molecules motion in viscous non-Newtonian power law fluid with Joule heating and fluxing model of Cattaneo-Christov

This study examines the molecules motion influences and thermal attributes in power-law non-Newtonian dissipative fluids' magnetohydrodynamic behavior, Joule heating, electromigration, and Cattaneo-Christov effects. Effects of Hall on both flow velocity and temperature, as well as the heat transport are considered. The investigation looks at heat transference that occurs when there is a slippage consequence, how the temperature influences the viscosity of the fluid, and how the potential parameters influence the exponential non-Newtonian flow of fluid via an extensible sheet. Runge-Kutta-Fehlberg's approach, which is based on the shooting procedure, was used to develop computational solutions for nonlinear ordinary differential equations. When exposed to a deformation that is generated by expansion, pressure, or agitation, a dilatant fluid is characterized by a phenomenon in which its viscosity rises and may harden. This phenomenon is referred to as the dilatation phenomenon. High shearing rates provide the impression that it is stable. When expanded, subjected to pressure, or agitated, dilatant fluids become more viscous and transform into solids. Both the non-equilibrium that occurs within the fluid and the reduction of the irreversibility processes that occur within it are caused by the acquired charges that are a result of Hall effect of fluid molecules.

Support-Based Transfer and Contacting of Individual Nanomaterials for In Situ Nanoscale Investigations.

Although in situ transmission electron microscopy (TEM) of nanomaterials has been gaining importance in recent years, difficulties in sample preparation have limited the number of studies on electrical properties. Here, a support-based preparation method of individual 1D and 2D materials is presented, which yields a reproducible sample transfer for electrical investigation by in situ TEM. A mechanically rigid support grid facilitates the transfer and contacting to in situ chips by focused ion beam with minimum damage and contamination. The transfer quality is assessed by exemplary specimens of different nanomaterials, including a monolayer of WS2 . Possible studies concern the interplay between structural properties and electrical characteristics on the individual nanomaterial level as well as failure analysis under electrical current or studies of electromigration, Joule heating, and related effects. The TEM measurements can be enriched by additional correlative microscopy and spectroscopy carried out on the identical object with techniques that allow a characterization with a spatial resolution in the range of a few microns. Although developed for in situ TEM, the present transfer method is also applicable to transferring nanomaterials to similar chips for performing further studies or even for using them in potential electrical/optoelectronic/sensingdevices.

Three-dimensional concentration-polarization modeling of trace-ions in reverse osmosis

Concentration polarization (CP) is mostly evaluated through one-dimensional (1D) film models considering convective and diffusive transport of solutes. However, in multicomponent ionic solutions, electromigration and chemical speciation may also play a role in the solute transport within the CP layer, thus affecting the process performance. We developed a three-dimensional (3D) numerical model for evaluating the CP in spacer-filled feed reverse osmosis (RO) channels by coupling hydrodynamics with the transport of solutes by convection, diffusion and electromigration, and chemical speciation by several ion-pairing equilibria. A realistic spacer geometry was obtained by CT-scans of commercial RO spacers. The model revealed highly non-uniform distributions of CP, mass transfer coefficients and precipitation potential on the membrane. While electromigration tends to equalize the fluxes of dominant ions, increases locally the CP of anions and decreases that of cations, it was found not to significantly affect the boundary layer thickness. However, the chemical speciation strongly affected the CP of trace ions binding with dominant ions. Finally, the 3D results were compared with those obtained from simpler 1D models. While 1D approaches help explaining qualitatively the effects of electromigration and speciation, and serve as a reasonable first approximation, they do not capture the non-uniform distribution of concentrations, mass transfer rates or saturation indices. The model will be used to study the full length of an RO membrane module and thus provide better indicators of the overall performance of the separation process.

A Review of Silver Wire Bonding Techniques.

The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface

The growth kinetic behaviors of the Cu/Al system under current were investigated. The current was shown to significantly promote the growth of the intermetallic (IMC) layer. The growth rate constant of the Al4Cu9 layer under current was approximately 3.26 times higher than that processed without current. Moreover, the current direction leads to a significant difference in the growth rate of the IMC layer, which was attributed to the electromigration effect. Based on the traditional thermal-activated theory and electromigration theory, an electromigration and thermal dual-activated growth kinetic model incorporating the contributions of Joule heat and the nonthermal effect was constructed. The growth kinetic behaviors of the Al4Cu9 layer were investigated by applying this model. The calculated growth activation energies under different current densities were almost constant and close to 130 kJ/mol. The experimental data were applied to verify the model, and the results showed that the model was in good agreement with the experimental results.

The rapid densification behavior of powder metallurgy Ti alloys by induction heating sintering

Micropores are decisive to mechanical properties and thermal deformation capabilities of powder metallurgy (P/M) Ti alloys sintered compacts. As a result, achieving express densification is of prime importance and has attracted increasing attention recently. Induction heating owns the merits of high efficiency, short process, and low cost, and thus has huge potential to be used as a sintering approach for the fabrication of P/M Ti alloys. Nevertheless, the facilitated densification behavior associated with induction heating sintering remains unclear so far. To address it, powder metallurgy Ti6Al4V is manufactured via induction heating sintering with which the underlying sintering mechanism is investigated in-depth. It is found that induction heating could generate a fully densified compact in a remarkably shortened time, demonstrating its superior sintering efficiency as compared with conventional resistance furnace heating. COMSOL finite element analysis reveals that the maximum current density during induction heating can reach 106 A m–2 though the magnetic field strength is solely 0.02 T, leading to a slight temperature difference of approximately 30 °C between the interior and exterior of the billet. Furthermore, the rapid heating essentially starts at sharp corners of particles due to the potent current concentration effect, which facilitates the cracking of the particle surface oxide film and thus enhances the direct contact between them. Moreover, the electromigration effect caused by induction current promotes the diffusion capability of elements, giving rise to expedited densification, alloying, and chemical homogenization. This work provides not only critical insight into the sintering mechanism of induction heating sintering but also significant guidance for low-cost powder metallurgy materials preparation.

Effect of electromagnetic field on element segregation and texture via laser cladding of Inconel 718

Element segregation and texture control are two prominent challenges for Inconel 718 repairing via laser cladding. Hence, the electromagnetic field was introduced in the laser cladding of Inconel 718 in this paper. The effect of thermal-electromagnetic convection, magnetic torque, and electromigration induced by electromagnetic field on element segregation and texture of Inconel 718 was studied. Results show element segregation is suppressed due to thermal-electromagnetic convection and electromigration. More Nb and Ti are solid-dissolved into the γ matrix. The average fraction of the Laves phase reduces from 6.44 % to 4.04 %, while the morphology of the Laves phase is modified from long-chain-like to discrete wormlike and exhibits smaller size, owing to modified element segregation. Moreover, magnetic torque drives the rod crystal to rotate with the applied electromagnetic field and thereby the long axis of the rod crystal deviates from <001> direction. The maximum multiple of uniform density decreases from 7.54 to 2.97. This study provides a promising method to weaken texture and element segregation in laser additive manufacturing.

Flash joining of Y2O3 transparent ceramic to titanium alloy

Rapid connection at low temperatures is an urgent and continuous need for transparent ceramic applications, allowing for high-quality joints without compromising the strength of the base material. This study investigated the flash joining of yttrium oxide and Ti-6Al-4V in seconds with the assistance of a threshold electric field. The maximum shear strength reached 36 ± 2 MPa at 900 ℃ under a current density of 4 mA/mm2 for 180 s. During the flash joining, the applied electric field contributes to generating oxygen vacancies which combine with electrons from the cathode, and accumulate near the grain boundary to become micropores, reacting with atom/ionic rapidly due to the effect of Joule heating and electromigration. This work summarizes flash joining as a process in which electric field and current act together, and applies it to transparent ceramic and metal connections. This research provides important insights for ceramic-alloy flash joining, such as transparent ceramic to titanium alloy interconnects.

PH Gradients in Spatially Non-Uniform AC Electric Fields around the Charging Frequency; A Study of Two Different Geometries and Electrode Passivation.

Dielectrophoresis (DEP), a precision nonlinear electrokinetic tool utilized within microfluidic devices, can induce bioparticle polarization that manifests as motion in the electric field; this phenomenon has been leveraged for phenotypic cellular and biomolecular detection, making DEP invaluable for diagnostic applications. As device operation times lengthen, reproducibility and precision decrease, which has been postulated to be caused by ion gradients within the supporting electrolyte medium. This research focuses on characterizing pH gradients above, at, and below the electrode charging frequency (0.2-1.4 times charging frequency) in an aqueous electrolyte solution in order to extend the parameter space for which microdevice-imposed artifacts on cells in clinical diagnostic devices have been characterized. The nonlinear alternating current (AC) electric fields (0.07 Vpp/μm) required for DEP were generated via planar T-shaped and star-shaped microelectrodes overlaid by a 70 μm high microfluidic chamber. The experiments were designed to quantify pH changes temporally and spatially in the two microelectrode geometries. In parallel, a 50 nm hafnium oxide (HfO2) thin film on the microelectrodes was tested to provide insights into the role of Faradaic surface reactions on the pH. Electric field simulations were conducted to provide insights into the gradient shape within the microelectrode geometries. Frequency dependence was also examined to ascertain ion electromigration effects above, at, and below the electrode charging frequency. The results revealed Faradaic reactions above, at, and below the electrode charging frequency. Comparison experiments further demonstrated that pH changes caused by Faradaic reactions increased inversely with frequency and were more pronounced in the star-shaped geometry. Finally, HfO2 films demonstrated frequency-dependent properties, impeding Faradaic reactions.

Repair of embrittlement induced by different hydride configurations by dissolving partial hydrides using pulsed electric current

The sudden brittle fracture of Ti, Zr and other metals caused by brittle hydride phase usually depends on the hydride network that provides the crack initiation and propagation path. Common hydride networks include continuous hydride configuration and grain boundary hydride configuration. In this study, pulsed electric current is used to effectively repair the embrittlement caused by continuous hydride configuration and grain boundary hydride configuration in pure titanium. The elongation of pure titanium with hydride configuration increased from 10% to about 20% after pulsed electric current treatment, with a certain degree of recovery of ultimate tensile strength. This is due to the dissolution of partial hydride after pulsed electric current treatment, and the hydride configuration is destroyed. Considering the introduction of pulsed electric current, hydride configuration in pure titanium is thermodynamically unstable, and the electromigration effect in kinetics also accelerates desorption of hydrogen atoms. The evolution of hydride configuration and desorption of hydrogen atoms are beneficial to the recovery of mechanical properties of hydrogenated pure titanium. In this study, the problem of hydride embrittlement caused by different hydride configurations in pure titanium was effectively repaired by pulsed electric current, which provided a new pathway and solution for dealing with the hydride induced embrittlement.

Adsorption-electrochemical mediated precipitation for phosphorus recovery from sludge filter wastewater with a lanthanum-modified cellulose sponge filter

In this study, the sludge filter wastewater is confirmed to investigate the effects of adsorption-electrochemical mediated precipitation (EMP) driven phosphorus recovery on the basis of lanthanum-modified cellulose sponge filter (LCLM) material. The adsorption-EMP method relies on in situ recovery phosphate (P) from the used desorption agent (NaOH-NaCl binary solution) via the formation of Ca5(PO4)3OH all while preserving the alkalinity of the desorption agents which benefited long-term application. The lanthanum content of LCLM was 9.0 mg/g, and the adsorption capacity reached 226.1 ± 15.2 mg P/g La at an equilibrium concentration of 3.9 mg P/L. After adsorption, 55.7 % of P was recovered, and the corresponding alkalinity increased from 1.9 mmol/L to 2.2 mmol/L. Adsorption mechanism analysis revealed that the high lanthanum usage of LCLM was attributed to the synergistic effect of the lattice oxygen of LaO and LaPO4·0.5H2O crystallite formation. Additionally, the Ca5(PO4)3OH was found precipitated in the precipitation in the cathode chamber (P-CC) rather than on the surface/section of cation exchange membrane (CEM) and cathode indicating that the P recovery process was controlled by the saturation of CaP species in the EMP system and the electromigration effect. These findings present a new strategy to promote the effective utilization of rare earth elements for P adsorption and demonstrate the potential application of adsorption-EMP systems in dephosphorization for wastewater treatment.

Comparative study of the densification kinetics of the FCC phase Al0.3CoCrFeNi and BCC phase AlCoCrFeNi high-entropy alloys during spark plasma sintering

The densification kinetics of the FCC-matrix Al0.3CoCrFeNi and BCC-matrix AlCoCrFeNi HEAs at sintering temperatures ranging from 950 ℃ to 1050 ℃ are comparatively studied utilizing the steady-state creep model. The densification activation energy of the Al0.3CoCrFeNi and AlCoCrFeNi powder in their low-stress exponent stage is linearly fitted to be 264.91 and 220.99 kJ/mol, respectively. The densification mechanism of both the two HEAs in the low-stress exponent stage is proved to be atomic diffusion. However, the densification activation of the Al0.3CoCrFeNi in the high-stress exponent stage increases to 554.77 kJ/mol and the densification mechanism changes to creep. The densification activation energy of the AlCoCrFeNi in its high-stress exponent stage cannot be obtained by linear fitting because of the abnormal increase of the stress exponent at the sintering temperature of 1050 ℃. The BCC-FCC transformation in the AlCoCrFeNi reduces its creep resistance because of different deformation behavior in BCC (dislocation cell) and FCC phase (cross-glide and twinning). As a result, dislocation density is higher in the FCC phase (4.3 ×1013/m2) compared with the BCC phase (3.8 ×1013/m2), which benefits the densification in the creep-controlled high-stress exponent stage. Furthermore, the stronger electromigration effect induced by a higher heating rate is demonstrated to further reduce the densification activation energy from 124.20 to 72.53 kJ/mol and accelerate densification in the diffusion-controlled heating period.