Dynamic Annealing Process Research Articles

Analysis of Lattice Damage in 4H-SiC Epiwafers Implanted with High Energy Al Ions at Elevated Temperatures

4H-SiC wafers with 12 µm epilayers were blanket implanted to a depth of 12 µm with 5 x 1016 cm-3 Al ions via Tandem Van de Graaff accelerator located at Brookhaven National Laboratory with energy range of 13.8 to 65.7 MeV at room temperature, 300 °C and 600 °C. High resolution X-ray diffraction measurements reveal the implanted layers are characterized by tensile strains. However, the dynamic annealing process reduces the level of tensile strains as the temperature of implantation is increased. Analysis indicates that the implant temperature of 600 °C is not sufficient to minimize lattice damage due to implantation and a higher implantation temperature will be required. This preliminary experiment will guide the optimization of implantation conditions for fabricating superjunction devices.

Inverse dynamic defect annealing in ZnO

Radiation tolerance of semiconductors depends on the dynamic defect annealing efficiency during irradiation. Consequently, it matters at what temperature one keeps the sample during irradiation, so that elevated temperatures typically result in lower remaining disorder. In the present work, we observed an opposite trend for the nitrogen ion implants into zinc oxide. Combining ion channeling technique, x-ray diffraction, and photoluminescence spectroscopy, we demonstrate that the interaction of nitrogen with radiation defects promotes an inverse dynamic annealing process, so that the increase in irradiation temperature leads to a more efficient defect formation. As a result, the residual radiation disorder is maximized at 650 °C and this state is characterized by the appearance of prominent optical signatures associated with zinc interstitials and strongly reduced strain accumulation as compared to the samples implanted at lower temperatures. However, for higher implantation temperatures, the impact of the inverse annealing decreases correlating with the surface degradation and loss of nitrogen.

Radiation defect dynamics in GaAs studied by pulsed ion beams

Gallium arsenide under ion bombardment at room temperature and above exhibits pronounced dynamic annealing that remains poorly understood. Here, we use a pulsed beam method to study radiation defect dynamics in GaAs in the temperature range of 20–100 °C irradiated with 500 keV Xe ions. Results show that, with increasing temperature, the defect relaxation time constant monotonically decreases from ∼5.2 to ∼0.4 ms. A change in the dominant dynamic annealing process occurs at a critical temperature of ∼60 °C, as evidenced by a change in the activation energy. A comparison with the other semiconductors studied by the pulsed beam method (Si, Ge, and 4H-SiC) reveals that both the high-temperature activation energy and the temperature below which dynamic annealing becomes negligible scale with the melting point.Gallium arsenide under ion bombardment at room temperature and above exhibits pronounced dynamic annealing that remains poorly understood. Here, we use a pulsed beam method to study radiation defect dynamics in GaAs in the temperature range of 20–100 °C irradiated with 500 keV Xe ions. Results show that, with increasing temperature, the defect relaxation time constant monotonically decreases from ∼5.2 to ∼0.4 ms. A change in the dominant dynamic annealing process occurs at a critical temperature of ∼60 °C, as evidenced by a change in the activation energy. A comparison with the other semiconductors studied by the pulsed beam method (Si, Ge, and 4H-SiC) reveals that both the high-temperature activation energy and the temperature below which dynamic annealing becomes negligible scale with the melting point.

Deterministic Role of Collision Cascade Density in Radiation Defect Dynamics in Si.

The formation of stable radiation damage in solids often proceeds via complex dynamic annealing (DA) processes, involving point defect migration and interaction. The dependence of DA on irradiation conditions remains poorly understood even for Si. Here, we use a pulsed ion beam method to study defect interaction dynamics in Si bombarded in the temperature range from ∼-30 °C to 210 °C with ions in a wide range of masses, from Ne to Xe, creating collision cascades with different densities. We demonstrate that the complexity of the influence of irradiation conditions on defect dynamics can be reduced to a deterministic effect of a single parameter, the average cascade density, calculated by taking into account the fractal nature of collision cascades. For each ion species, the DA rate exhibits two well-defined Arrhenius regions where different DA mechanisms dominate. These two regions intersect at a critical temperature, which depends linearly on the cascade density. The low-temperature DA regime is characterized by an activation energy of ∼0.1 eV, independent of the cascade density. The high-temperature regime, however, exhibits a change in the dominant DA process for cascade densities above ∼0.04 at.%, evidenced by an increase in the activation energy. These results clearly demonstrate a crucial role of the collision cascade density and can be used to predict radiation defect dynamics in Si.

P-type single-crystalline ZnO films obtained by (Na,N) dual implantation through dynamic annealing process

Single-crystalline ZnO films were grown by plasma-assisted molecular beam epitaxy technique on c-plane sapphire substrates. The films have been implanted with fixed fluence of 130 keV Na and 90 keV N ions at 460 °C. It is observed that dually-implanted single crystalline ZnO films exhibit p-type characteristics with hole concentration in the range of 1.24 × 1016–1.34 × 1017 cm−3, hole mobilities between 0.65 and 8.37 cm2 V−1 s−1, and resistivities in the range of 53.3–80.7 Ω cm by Hall-effect measurements. There are no other secondary phase appearing, with (0 0 2) (c-plane) orientation after ion implantation as identified by the X-ray diffraction pattern. It is obtained that Na and N ions were successfully implanted and activated as acceptors measured by XPS and SIMS results. Also compared to other similar studies, lower amount of Na and N ions make p-type characteristics excellent as others deposited by traditional techniques. It is concluded that Na and N ion implantation and dynamic annealing are essential in forming p-type single-crystalline ZnO films.

Dynamic annealing in Ge studied by pulsed ion beams

The formation of radiation damage in Ge above room temperature is dominated by complex dynamic annealing processes, involving migration and interaction of ballistically-generated point defects. Here, we study the dynamics of radiation defects in Ge in the temperature range of 100–160 °C under pulsed beam irradiation with 500 keV Ar ions when the total ion fluence is split into a train of equal square pulses. By varying the passive portion of the beam duty cycle, we measure a characteristic time constant of dynamic annealing, which rapidly decreases from ~8 to 0.3 ms with increasing temperature. By varying the active portion of the beam duty cycle, we measure an effective diffusion length of ~38 nm at 110 °C. Results reveal a major change in the dominant dynamic annealing process at a critical transition temperature of ~130 °C. The two dominant dynamic annealing processes have an order of magnitude different activation energies of 0.13 and 1.3 eV.

P-type single-crystalline ZnO films obtained by (Li, N) dual implantation through dynamic annealing process

Single-crystalline ZnO films were grown on c-plane sapphire substrates by plasma-assisted molecular beam epitaxy technique. The films have been implanted with fixed fluence of 30 keV Li and 80 keV N ions at 460 °C. It is shown that dually-implanted single crystalline ZnO films exhibit p-type characteristics with hole concentration in the range of 2.5 × 1015–2.3 × 1016 cm−3, hole mobilities between 0.8 and 1.04 cm2 V−1 s−1, and resistivities in the range of 328.9–2081 Ω cm by Hall-effect measurements. The ZnO film exhibit (0002) (c-plane) orientation with no secondary phase appearing after implantation as identified by the X-ray diffraction pattern. It is confirmed that Li and N ions were effectively implanted and successfully behave as acceptor measured by XPS and SIMS results. Also compared to other similar studies, lower amount of Li and N ions make p-type characteristics excellent. It is concluded that Li and N ion implantation and dynamic annealing play a critical role in forming p-type single-crystalline ZnO films.

P-type single-crystalline ZnO films obtained by (N,O) dual implantation through dynamic annealing process

Single-crystalline ZnO films were grown on a-plane sapphire substrates by plasma-assisted molecular beam epitaxy technique. The films have been implanted with fixed fluence of 120 keV N and 130 keV O ions at 460 °C. Hall measurements show that the dually-implanted single-crystalline ZnO films exhibit p-type characteristics with hole concentration in the range of 2.1 × 1018–1.1 × 1019 cm−3, hole mobilities between 1.6 and 1.9 cm2 V−1 s−1, and resistivities in the range of 0.353–1.555 Ω cm. The ZnO films exhibit (002) (c-plane) orientation as identified by the X-ray diffraction pattern. It is confirmed that N ions were effectively implanted by SIMS results. Raman spectra, polarized Raman spectra, and X-ray photoelectron spectroscopy results reflect that the concentration of oxygen vacancies is reduced, which is attributed to O ion implantation. It is concluded that N and O implantation and dynamic annealing play a critical role in forming p-type single-crystalline ZnO films.

Peculiarities of temperature dependent ion beam sputtering and channeling of crystalline bismuth

In this paper, we report on the surface evolution of focused ion beam treated single crystalline Bi(001) with respect to different beam incidence angles and channeling effects. ‘Erosive’ sputtering appears to be the dominant mechanism at room temperature (RT) and diffusion processes during sputtering seem to play only a minor role for the surface evolution of Bi. The sputtering yield of Bi(001) shows anomalous behavior when increasing the beam incidence angle along particular azimuthal angles of the specimen. The behavior of the sputtering yield could be related to channeling effects and the relevant channeling directions are identified. Dynamic annealing processes during ion irradiation retain the crystalline quality of the Bi specimen allowing ion channeling at RT. Lowering the specimen temperature to T = −188 °C reduces dynamic annealing processes and thereby disables channeling effects. Furthermore unexpected features are observed at normal beam incidence angle. Spike-like features appear during the ion beam induced erosion, whose growth directions are not determined by the ion beam but by the channeling directions of the Bi specimen.

Comprehensive study of the effect of the irradiation temperature on the behavior of cubic zirconia

Cubic zirconia single-crystals (yttria-stabilized zirconia (YSZ)) have been irradiated with 4 MeV Au2+ ions in a broad fluence range (namely from 5 × 1012 to 2 × 1016 cm−2) and at five temperatures: 80, 300, 573, 773, and 1073 K. Irradiated samples have been characterized by Rutherford backscattering spectroscopy in channeling mode, X-ray diffraction and transmission electron microscopy techniques in order to determine the disordering kinetics. All experimental results show that, whatever is the irradiation temperature, the damage build-up follows a multi-step process. In addition, the disorder level at high fluence is very similar for all temperatures. Thus, no enhanced dynamic annealing process is observed. On the other hand, transitions in the damage accumulation process occur earlier in fluence with increasing temperature. It is shown that temperature as low as 573 K is sufficient to accelerate the disordering process in ion-irradiated YSZ.

P-type ZnO thin films achieved by N+ ion implantation through dynamic annealing process

ZnO thin films were grown on sapphire (0001) substrates by pulsed-laser deposition at 700 °C. 70 keV N+ ion implantation was performed under various temperatures and fluences in the range of 300−460 °C and 3.0×1014−1.2×1015 cm−2, respectively. Hall measurements indicate that the ZnO films implanted at 460 °C are p-type for all fluences used herein. Hole-carrier concentrations lie in the range of 2.4×1016−5.2×1017 cm−3, hole mobilities in the range of 0.7−3.7 cm2 V−1 s−1, and resistivities between 18−71 Ωcm. Transmission-electron microscopy reveals major microstructural differences between the n-type and p-type films. Ion implantation at elevated temperatures is shown to be an effective method to introduce increased concentrations of p-type N dopants while reducing the amount of stable post-implantation disorder.

Investigation of irradiation effects induced by self-ion in 6H-SiC combining RBS/C, Raman and XRD

Single crystals of 6H-SiC were irradiated at room temperature and 670K with 4MeV C ions at two fluences: 1015 and 1016cm−2 (0.16 and 1.6dpa at the damage peak). Damage accumulation was studied by a combination of X-ray diffraction (XRD), Raman spectroscopy and Rutherford backscattering spectrometry in channelling geometry (RBS/C) along the [0001] direction. The irradiated layer is found to be composed of a low damage region up to ∼1.5μm followed by a region where the disorder level is higher, consistent with SRIM predictions. At room temperature and low fluence, typically 1015cm−2, the strain depth profile follows the dpa depth distribution (with a maximum value of ∼2%). The disorder is most likely due to small defect clusters. When increasing the fluence up to 1016cm−2, a buried amorphous layer forms, as indicated by e.g. Raman results where the Si–C bands become broader or even disappear. At a higher irradiation temperature of 670K, amorphization is not observed at the same fluence, revealing a dynamic annealing process. However, results tend to suggest that the irradiated layer is highly heterogeneous and composed of different types of defects.

Temperature dependence of lattice disorder in Ar-irradiated (1 0 0), (1 1 0) and (1 1 1) MgO single crystals

To better appreciate dynamic annealing processes in ion irradiated MgO single crystals of three low-index crystallographic orientations, lattice damage variation with irradiation temperature was investigated. Irradiations were performed with 100 keV Ar ions to a fluence of 1 × 10 15 Ar/cm 2 in a temperature interval from −150 to 1100 °C. Rutherford backscattering spectroscopy combined with ion channeling was used to analyze lattice damage. Damage recovery with increasing irradiation temperature proceeded via two characteristic stages separated by 200 °C. Strong radiation damage anisotropy was observed at temperatures below 200 °C, with (1 1 0) MgO being the most radiation damage tolerant. Above 200 °C damage recovery was isotropic and almost complete recovery was reached at 1100 °C. We attributed this orientation dependence to a variation of dynamic annealing mechanisms with irradiation temperature.

Effects of swift heavy ion irradiation on band gap of strained AlGaN/GaN Multi Quantum Wells

III-Nitrides have attracted much attention due to their versatile and wide range of applications, such as blue/UV light emitting diodes. Strained layer super lattices offer extra degree of freedom to alter the band gap of lattice-mismatched hetero-structures. Swift Heavy Ion (SHI) irradiation is a post growth technique to alter the band gap of semiconductors, spatially. In the present study, strained AlGaN/GaN Multi Quantum wells (MQWs) were grown on sapphire with insertion of AlN and GaN as buffer layers between substrate and epi-layers by MOCVD. These buffer layers are known to improve the structural and optical properties. Such grown AlGaN/GaN MQWs were irradiated with 200 MeV Au ions at a fluence of 5 × 10 11 ions/cm 2. As grown and irradiated samples have been characterized by HRXRD and PL. The analysis of symmetrical and asymmetrical reciprocal space mapping gives information on perpendicular and in-plane strain. Measured values show that lattice mismatch increases upon irradiation. However, increase in the mismatch upon irradiation has affected the band gap of MQWs, which has been confirmed by PL measurements. PL shows that there is an increase of intensity of luminescence of GaN and MQWs by one order of magnitude upon irradiation, which is attributed to SHI induced dynamic annealing processes.

Effects of the density of collision cascades: Separating contributions from dynamic annealing and energy spikes

We present a quantitative model for the efficiency of the molecular effect in damage buildup in semiconductors. Our model takes into account only one mechanism of the dependence of damage buildup efficiency on the density of collision cascades: nonlinear energy spikes. In our three-dimensional analysis, the volume of each individual collision cascade is divided into small cubic cells, and the number of cells that have an average density of displacements above some threshold value is calculated. We assume that such cells experience a catastrophic crystalline-to-amorphous phase transition, while defects in the cells with lower displacement densities have perfect annihilation. For the two limiting cases of heavy (500 keV/atom 209Bi) and light (40 keV/atom 14N) ion bombardment of Si, theory predictions are in good agreement with experimental data for a threshold displacement density of 4.5 at.%. For intermediate density cascades produced by small 2.1 keV/amu PF n clusters, we show that dynamic annealing processes entirely dominate cascade density effects for PF 2 ions, while energy spikes begin contributing in the case of PF 4 cluster bombardment.

Diffusion mechanism and the thermal stability of fluorine ions in GaN after ion implantation

The diffusion mechanisms of fluorine ions in GaN are investigated by means of time-of-flight secondary ion mass spectrometry. Instead of incorporating fluorine ions close to the sample surface by fluorine plasma treatment, fluorine ion implantation with an energy of 180 keV is utilized to implant fluorine ions deep into the GaN bulk, preventing the surface effects from affecting the data analysis. It is found that the diffusion of fluorine ions in GaN is a dynamic process featuring an initial out-diffusion followed by in- diffusion and the final stabilization. A vacancy-assisted diffusion model is proposed to account for the experimental observations, which is also consistent with results on molecular dynamic simulation. Fluorine ions tend to occupy Ga vacancies induced by ion implantation and diffuse to vacancy rich regions. The number of continuous vacancy chains can be significantly reduced by a dynamic thermal annealing process. As a result, strong local confinement and stabilization of fluorine ions can be obtained in GaN crystal, suggesting excellent thermal stability of fluorine ions for device applications.

Defect accumulation during channeled erbium implantation into GaN

Gallium nitride films epitaxially grown on sapphire, were irradiated at room temperature with 80keVEr+166 or 170keVEr2+166 ions to fluences ranging from 1×1013cm−2 to 1×1015cm−2. The defects induced by ion implantation (as a result of the nuclear energy transfer) generate a perpendicular elastic strain in the hexagonal GaN lattice. The accumulation of lattice damage and lattice deformation were investigated for Er ions impinging along the GaN⟨0001⟩ axis, i.e., channeled implantation, and compared to random implantation, i.e., the conventional geometry in which the ion beam is tilted 10° off the GaN c axis. For this purpose, Rutherford backscattering and channeling spectrometry and high-resolution x-ray diffraction were used. The defect concentration and the maximum perpendicular strain exhibit the same increasing trend with the ion fluence. Three regimes can be distinguished for both implantation geometries, for low fluences (corresponding to a value below 1 displacement per atom in case of random implantation), the defect concentration remains low due to an effective dynamic annealing process. In the second fluence regime, the defect concentration rises sharply, which is characteristic for nucleation-limited amorphization and finally, a third regime is found where layer-by-layer amorphization of the implanted area starts from the surface. The onset of the steep increase in the case of implantations along the GaN c axis is found at a significantly higher erbium fluence compared to random implantation.

Damage profiles of ultrashallow B implants in Si and the Kinchin-Pease relationship

Damage distributions resulting from 0.1–2keV B+ implantation at room temperature into Si(100) to doses ranging from 1×1014 to 2×1016cm−2 have been determined using high-depth-resolution medium-energy-ion scattering in the double alignment mode. For all B+ doses and energies investigated a 3–4nm deep, near-surface damage peak was observed while for energies at and above 1keV, a second damage peak developed beyond the mean projected B+ ion range of 5.3nm. This dual damage peak structure is due to dynamic annealing processes. For the near-surface peak it is observed that, at the lowest implant energies and doses used, for which recombination processes are suppressed due to the proximity of the surface capturing interstitials, the value of the damage production yield for low-mass B+ ions is equal or greater than the modified Kinchin-Pease model predictions [G. H. Kinchin and R. S. Pease, Rep. Prog. Phys. 18, 1 (1955); G. H. Kinchin and R. S. Pease, J. Nucl. Energy 1, 200 (1955); P. Sigmund, Appl. Phys. Lett. 14, 114 (1969)].

Ion damage buildup and amorphization processes in GaAs–AlxGa1−xAs multilayers

The nature of ion damage buildup and amorphization in GaAs–AlxGa1−xAs multilayers at liquid-nitrogen temperature is investigated for a variety of compositions and structures using Rutherford backscattering-channeling and cross-sectional transmission electron microscopy techniques. In this multilayer system, damage accumulates preferentially in the GaAs layers; however, the presence of AlGaAs enhances the dynamic annealing process in adjacent GaAs regions and thus amorphization is retarded close to the GaAs–AlGaAs interfaces even when such regions suffer maximum collisional displacements. This dynamic annealing in AlGaAs and at GaAs–AlGaAs interfaces is more efficient with increasing Al content; however, the dynamic annealing process is not perfect and an amorphous phase may be formed at the interface above a critical defect level or ion dose. Once an amorphous phase is nucleated, amorphization proceeds rapidly into the adjacent AlGaAs. This is explained in terms of the interplay between defect migration and defect trapping at an amorphous–crystalline or GaAs–AlGaAs interface. In addition, enhanced recrystallization of the amorphous GaAs at the interface may occur during heating if an amorphous phase is not formed in the adjacent AlGaAs layer. This is most likely the result of mobile defects injected from the AlGaAs layer during heating.

Ion damage buildup and amorphization processes in AlxGa1−xAs

The nature of keV ion damage buildup and amorphization in AlxGa1−xAs at liquid-nitrogen temperature is investigated for various Al compositions using Rutherford backscattering channeling, transmission electron microscopy, and in situ time-resolved-reflectivity techniques. Two distinct damage buildup processes are observed in AlxGa1−xAs depending on Al content. At low Al content, the behavior is similar to GaAs whereby collisional disorder is ‘‘frozen in’’ and amorphization proceeds with increasing dose via the overlap of damage cascades and small amorphous zones created by individual ion tracks. However, some dynamic annealing occurs during implantation in AlGaAs and this effect is accentuated with increasing Al content. For high Al content, crystallinity is retained at moderate ion damage with disorder building up in the form of stacking faults, planar, and other extended defects. In the latter case, amorphization is nucleation limited and proceeds abruptly when the level of crystalline disorder exceeds a critical level. The amorphization threshold dose increases with increasing Al composition by over two orders of magnitude from GaAs to AlAs. Dynamic annealing and damage creation processes during implantation compete very strongly in AlxGa1−xAs even at liquid-nitrogen temperatures. This behavior is discussed in terms of both the availability of very fast mobile defects and bonding configurational changes related to the Al sublattice in AlxGa1−xAs of high Al content.