This study conducts a comprehensive examination of the microstructural and dislocation dynamics of AlSi10Mg alloys under various thermal conditions, utilizing quasi in-situ Electron Backscatter Diffraction (EBSD) and Transmission Electron Microscopy (TEM) analyses. The research focuses on comparing the microstructural response of as-built and T6 heat-treated samples to mechanical stress at both ambient (298 K) and cryogenic (77 K) temperatures. EBSD analysis underscores the grain stability under applied strain, while TEM investigations expose notable variations in dislocation mobility influenced by temperature, with a particular emphasis on the interaction between dislocations and silicon particles at cryogenic temperatures. An observed increase in Geometrically Necessary Dislocation (GND) density at 77 K points to enhanced resistance to plastic deformation, suggesting mechanisms of cryogenic strengthening. The findings illuminate the impact of heat treatment in augmenting the mechanical properties of the alloy, shedding light on its potential applications in aerospace and cryogenic environments.
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