Grinding Depth Research Articles

Improving the efficiency of gear grinding technology for mine conveyor drives

The aim of this work is to develop a mathematical model of the gear grinding process using the method of high-performance profile copying and determine the optimal parameters of grinding modes according to the temperature criterion. It is shown that in order to ensure defect-free machining of gears under deep grinding conditions, it is necessary to significantly reduce the rate of the feed speed of the grinding wheel along the tooth of the gear wheel. For a grinding depth of 0.4 mm, it should be equal to 2.27 m/min. In this case, the machining productivity can be increased up to 5 times with the simultaneous elimination of the formation of sticking, microcracks and other temperature defects on the machined gear surfaces. This processing effect is achieved by using a modern HOFLER RAPID 1250 gear grinding machine and highly porous abrasive wheels, which are characterized by high cutting capacity. Thanks to the improved quality of gear processing, the quality and performance of manufactured mine conveyor drives (planetary gearboxes with a power of more than 200 kW) have been improved, and the number of repairs required in harsh mine conditions has been significantly reduced.

Surface Integrity of Binderless WC Using Dry Electrical Discharge Assisted Grinding

AbstractBinderless tungsten carbide (WC) is preferred for manufacturing tools, mould, and wear-resistant components. However, due to its high brittleness and hardness, the machined binderless WC surface is prone to generate microcracks and the machining efficiency is extremely low. Aiming at this difficulty, a clean and eco-friendly dry electrical discharge assisted grinding (DEDAG) method without any liquid medium was proposed for the processing of binderless WC. DEDAG principle was revealed and the DEDAG platform was first developed. A series of DEDAG, conventional dry grinding (CDG), and conventional wet grinding (CWG) experiments were conducted on binderless WC under different processing parameters. The current and voltage waveforms during the DEDAG process were observed, and the discharge properties were analyzed. The chip morphologies, surface hardness, residual stress, as well as surface and subsurface morphologies were analyzed. The results show that the surface hardness and roughness obtained by DEDAG are smaller than that by CDG or CWG. The measured residual tensile stress after CDG is larger against DEDAG. The ground surface by DEDAG has better crystal integrity than that by CDG. DEDAG can soften/melt workpiece material and diminish grinding chips, thereby promoting plastic removal and increasing processing efficiency. The influences of DEDAG parameters on the ground surface quality are also investigated, and the optimal DEDAG parameters are determined. With the increase of open-circuit voltage or grinding depth, the surface quality improves first and then worsens. The optimal open-circuit voltage is 40 V and the grinding depth ranges from 10 µm to 15 µm. This research provides a new idea for promoting the efficient and low-damage processing of binderless WC.

High-performance grinding of ceramic matrix composites

Ceramic matrix composites (CMCs) are highly promising materials for the next generation of aero-engines. However, machining of CMCs suffers from low efficiency and poor surface finish, which presents an obstacle to their wider application. To overcome these problems, this study investigates high-efficiency deep grinding of CMCs, focusing on the effects of grinding depth. The results show that both the surface roughness and the depth of subsurface damage (SSD) are insensitive to grinding depth. The material removal rate can be increased sixfold by increasing the grinding depth, while the surface roughness and SSD depth increase by only about 10%. Moreover, it is found that the behavior of material removal is strongly dependent on grinding depth. As the grinding depth is increased, fibers are removed in smaller sizes, with the fiber length in chips being reduced by about 34%. However, too large a grinding depth will result in blockage by chip powder, which leads to a dramatic increase in the ratio of tangential to normal grinding forces. This study demonstrates that increasing the depth of cut is an effective approach to improve the machining efficiency of CMCs, while maintaining a good surface finish. It provides the basis for the further development of high-performance grinding methods for CMCs, which should facilitate their wider application.

Surface topography prediction of slider races using formed grinding wheel shape and material removal mechanism

Compared with the roughness, the three-dimensional (3D) topography parameters, surface microstructure geometric characteristics and other information can more fully evaluate the grinding quality of the slider raceway surface. In this paper, based on the 3D topography model of the abrasive particle distribution on the surface of the formed grinding wheel, the material removal mechanism between the abrasive particle and the raceway surface is analyzed. With the undeformed chip thickness distribution model as the intermediate variable, the 3D topography model of the slider raceway surface is established, and the model verification is carried out from the roughness and the geometric characteristics of the surface microstructure, respectively. At the same time, the surface microstructure is extracted from the topography model, and the effects of different grinding process parameters on the geometric characteristics such as the height to width ratio, depth to width ratio and distribution density of groove, convex peak and peak valley structures are studied. Results are shown that AS,TH increase from [0.05 0.6 μm] to [0.25 0.8 μm] and FGH grows from [0.11 1.05 μm] to [0.5 1.61 μm] when the grinding depth rises from 1 μm to 4 μm. AS, TH are firstly decreased from [0.17 0.61 μm] to [0.08 0.52 μm] and then increased to [0.26 0.78 μm], and the FGH declines from [0.34 1.01 μm] to [0.16 0.86 μm] and then increases to [0.51 1.38 μm] with the feeding speed is in [25, 28 m/min]. In addition, in the range of grinding wheel linear velocity [28, 34 m/s], the AS,TH decreases from [0.19 0.81 μm] to [0.1 0.55 μm] and the FGH decreases from [0.55 1.6 μm] to [0.2 1.1 μm]. This can prepare for the subsequent research on the impact of the topography characteristics on the friction coefficient and wear amount of the slider raceway surface.

Reducing Cf/SiC composite damages through collaborative control of laser ablating depth and grinding modes

Cf/SiC composites are regarded as difficult-to-machine aerospace materials. A low-damage surface machining of Cf/SiC composite by laser-ablating assisted grinding (LAAG) was conducted, and investigated the effects of laser-ablating depth and grinding modes on surface/subsurface damages. The results showed that ablated material depth reached 420 μm after 1200 times scanning, while the effective ablating rate was inhibited by the depth. Compared with down grinding, the grinding forces and temperatures were substantially higher in up grinding, with a maximum increase of 123.5 % and 140 % in normal and tangential grinding forces, respectively; however, micro brittle fracture and ductile removal were remarkably enhanced in normal and transverse fibers, and surface macroscopic damage has been suppressed; subsurface damage remained insignificant, mainly exhibited in internal micro cracks and minor interfacial debonding. It was attributed to cutting characteristics of up grinding. Furthermore, as grinding depth increased, the material removal behavior underwent a brittle-ductile transition and the surface roughness grew accordingly. Moreover, a laser scanning angle of 0° and up grinding facilitated the occurrence of longitudinal fiber debonding, producing larger sized fiber bundle chips. Combining up grinding with 90° scanning angle at low grinding depth was an effective method to improve the surface quality of Cf/SiC composite.

Investigation of the Machined Surface Integrity of WC-High-Entropy Alloy Cemented Carbide

A fine-grained WC-15wt%Al0.5CoCrFeNi cemented carbide was prepared through a vacuum and gas pressure sintering. For achieving high surface integrity, diamond wheel grinding serves as the primary molding process for the machining of WC cemented carbide. To reveal the influence of grinding on the surface integrity of fine-grained WC-HEA cemented carbide, studies were conducted on grinding force, surface microstructure, surface roughness, residual stress, microhardness, and bending strength. The morphological analysis of the ground surface indicated a transition in the material removal mechanism of WC-HEA cemented carbide from ductile removal to brittle removal, with brittle removal becoming predominant as the depth of grinding increases. With the increasing depth of grinding, the grinding force increases, and the grinding force increases while the surface roughness decreases. Correspondingly, there is an improvement in both hardness and bending strength. Additionally, grinding induces high residual compressive stress on the surface, with a maximum compressive stress of 1795 MPa. The bending strength of the material is found to be dependent on the residual stress.

Grinding performance investigation of multidirectional CF/PEEK composites—A comparative with unidirectional CF/PEEK

AbstractTo distinguish the grinding performance of the multidirectional (MD) and unidirectional (UD) carbon fiber‐reinforced thermoplastic (CFRTP) composites, MD and UD carbon fiber‐reinforced poly‐etherether‐ketone (CF/PEEK) composites were employed in this study. Different ply stacking sequences and process parameters were set for grinding experiments. Subsequently, the surface morphologies and roughness were observed and measured. Experimental results indicated that the variations of grinding forces with grinding parameters of MD‐CF/PEEK and UD‐CF/PEEK were consistent. However, the heat transfer mechanism and the effects of grinding parameters on the maximum grinding temperatures were different between the two composites. The grinding forces and temperatures of MD‐CF/PEEK were slightly lower than UD‐CF/PEEK, and MD‐CF/PEEK reached better surface quality under the same parameters, indicating that the grinding performance of MD‐CF/PEEK was not the simple superposition of UD‐CF/PEEK. In addition, the chip formation and material removal mechanism of CF/PEEK were investigated. The grinding performance of MD‐CF/PEEK was primarily dependent on the θ elements of laminate while the grinding performance of UD‐CF/PEEK was closely related to the fiber orientation angles during grinding. This study established a more in‐depth understanding into the grinding performance of MD‐CF/PEEK and provided technical guidance for high‐quality grinding of CFRTP.Highlights The grinding performance of the multidirectional (MD) and unidirectional (UD) carbon fiber‐reinforced poly‐etherether‐ketone (CF/PEEK) is compared. The grinding forces and temperatures of MD‐CF/PEEK are slightly lower than that of UD‐CF/PEEK, and the MD‐CF/PEEK reach a better surface quality under the same grinding parameters. The grinding performance of MD‐CF/PEEK is primarily dependent on the θ elements of laminate, and the change of layering order is not a critical factor. The grinding performance of UD‐CF/PEEK is closely related to the fiber orientation angles during the grinding process. The surface quality of MD‐CFRTP can be effectively improved by reducing the grinding depth and feed speed, and increasing the grinding wheel speed.

Study on nickel-based single crystal superalloy DD6 subsurface damage of belt grinding with a large cutting depth of one pass

Single crystal superalloy has been widely utilized as a crucial manufacturing material for aeroengine turbine blades due to its excellent properties. However, machining this alloy is easy to cause subsurface damage, resulting in the engineering failure of blades. To explore a large cutting depth and low damage processing method, this paper established a grinding depth analytical model for the abrasive belt. The model provides insights into the material removal behavior mechanism during belt grinding and predicts the impact of process parameters on the grinding depth. Subsequently, the grinding experiments of this alloy with different abrasive belts were conducted. The experimental results showed that grinding depth increased as normal force amplified and exhibited a nonlinear growth pattern with the reduction of feed velocity. This preliminary verified the prediction model of grinding depth. The material removal properties of the pyramid, diamond, and hollow-sphere belts were analyzed, and the ratio of material removal capacity for the three was found to be 12:8:5. Based on the analysis of the topography and roughness of the grinding surface, the study examined the influence mechanism of grinding force, feed velocity and abrasive grain morphology on grinding depth and surface quality. The subsurface damage behavior mechanism and recrystallization depth change law of belt grinding were revealed. The grinding depth of the pyramid and diamond belts could exceed 160 μm and the recrystallization depth was less than 5 μm. To achieve efficient and low-damage machining, it is recommended to reduce the feed velocity rather than increase the grinding normal force. It is important to note that the feed velocity should not exceed 10 mm/s. This study is to furnish a theoretical groundwork and offer engineering technical recommendations for achieving large grinding depth and low damage machining of single crystal superalloy.

Grinding mechanism and surface quality evaluation strategy of single crystal 4H-SiC

This paper investigated the removal mechanism and surface quality of single crystal 4 H-SiC during the grinding process, as well as the impact of the measurement area on surface roughness (Sa) during surface morphology detection. This problem is relatively unexplored. Experimental findings suggest that when the measurement area is below 400 µm², there is a greater error in Sa. Conversely, when the measurement area exceeds 400 µm², the error in Sa values is relatively small and stable. The surface quality increases with the increase of wheel speed (vs) and decreases with the increase of workpiece feed rate (vw) and grinding depth (ap). This study finds that the material removal of monocrystalline single crystal 4 H-SiC during the grinding process occurs primarily through plastic deformation, accompanied by brittle fracture.

Research on Grinding Force Prediction of Flexible Abrasive Disc Grinding Process of TC17 Titanium Alloy

Abrasive disc grinding is currently a key manufacturing process to achieve better accuracy and high-quality surfaces of TC17 components. Grinding force, which results from the friction and elastic–plastic deformation during the contact and interaction between the abrasive grains and the workpiece, is a critical parameter that represents the grinding accuracy and efficiency. In order to understand the influence factors of grinding force, the characteristics of the flexible abrasive disc grinding process were studied. Considering the contact state between the abrasive tool and the workpiece, the theoretical model of normal grinding force was established in detail, from macro- and micro-perspectives. By conducting single-factor and orthogonal grinding experiments of TC17 components, the influence of different process parameters on the normal grinding force was revealed. The normal grinding force prediction models of the abrasive disc grinding process were developed based on the Box–Behnken design (BBD) and particle swarm optimization–back propagation (PSO-BP) neural networks, respectively. The results showed that the normal grinding force was negatively correlated with the disc rotational speed, and positively correlated with the contact angle, grinding depth, and feed rate, and the interaction of the factor feed rate and grinding depth was the more influential factor. Both the BBD and PSO-BP force models had good reliability and accuracy, and the mean absolute error (MAE) and mean relative error (MRE) of the above two prediction models were 0.22 N and 0.16 N, and 13.3% and 10.9%, respectively.

A hybrid process technology of SiC die separation

ABSTRACT Silicon carbide (SiC) is ideal for making powerful, high-frequency chips for 5 G and electric vehicles due to its wide band gap and resistance to high voltage. However, its powerful chemical bond strength and extreme hardness make it difficult for die separation in the post-wafer process. A hybrid process technology is proposed, where die scribing is performed on SiC wafer using a femtosecond pulsed laser-assisted ablation. The extremely short energy pulses forced the ablation of traces of SiC at extreme speed, breaking chemical bonds and thereby reducing strength and hardness for easy high-speed cutting along the scribed lanes with a polycrystalline diamond wheel. The experiment showed that the average stage current dropped from 0.90 A to 0.45 A and kerf chipping ratio from 11.7 to 4.1 during die separation, proving that the process removed materials along the separation lanes using a wheel tool at low grinding force, creating separation lanes of outstanding straightness and minimal kerf chippings and SiC dies of high integrity. Furthermore, thanks to the on-line rotational machining and dressing of the wheel tool, the blunt diamond abrasive cutting edge could be redressed to expose chip pockets of appropriate depth and protruding grinding edges with a favorable negative rake angle. The established grinding regime utilizing a pressure-grinding force in cutting and material removal reduced cracking at the SiC surface. In this paper, the laser energy density, scanning speed, number of ablations, focus position, as well as the speed, feed-rate and grinding depth of the wheel tool are also discussed in detail.

Study on Plastic Deformation Removal Mechanism and Dislocation Change in Nanogrinding of Single Crystal Silicon Carbide with Random Rough Surface

This investigation centers on exploring the plastic deformation removal mechanism and dislocation dynamics in the nanogrinding of single‐crystal silicon carbide featuring a randomly rough surface. To simulate this, an approach combining the Weierstrass–Mandelbrot fractal surface function with molecular dynamics is employed. Randomly rough surface contours are generated using the Weierstrass–Mandelbrot fractal surface function. By adjusting the fractal dimension, an ideal representation of single‐crystal silicon carbide with randomly rough surfaces is obtained. By combining plastic deformation detection methods, the process of workpiece sliding, plowing, and chip removal is studied, and the plastic deformation removal mechanism of random rough surface grinding is explored. Combining postprocessing methods such as sheer strain and dislocation trajectory, the morphological changes and transformation mechanisms of dislocations are analyzed. Notably, at grinding depth of 33.18 nm, the activation of slip systems induces dislocation formation, enabling plastic deformation. Furthermore, at depths exceeding 144.00‐nm, the emergence of stacking faults on the random rough surface is observed. Throughout the grinding procedure, plastic deformation of debris occurs, leading to the formation of plastic bulges on both sides of the tool, and the debris generated during processing does not impact the defects encountered during secondary grinding of the rough surface.

Optimization of grinding process for hard and brittle materials based on damage evolution mechanism

Grinding damage of hard and brittle materials has a direct impact on part strength and subsequent polishing efficiency. Damage suppression is one of the key research issues in hard and brittle material processing. Due to the uncertain damage evolution law, there is still a lack of optimization methods for the multi-step grinding process under given damage constraints. In this paper, the extended finite element method is used to establish a model between the prefabricated crack depth and final crack depth, which reveals the influence of various existing subsurface damages on crack propagation. It is found that only when the prefabricated crack depth is close to the indentation crack depth on the perfect surface, the final crack depth will be affected to some extent. To optimize the grinding process to achieve low damage, a semi-empirical model for predicting grinding damage is proposed which is suitable for process optimization and does not rely on some difficult-to-obtain parameters. Finally, based on the damage evolution law and prediction model, the core content of this paper is proposed, that is, a multi-step grinding process optimization method with variable grinding depth. This method can minimize the damage while ensuring the same processing efficiency, the damage depth is reduced by 25 %. The effectiveness of the optimization method and the correctness of the damage evolution law are proved by experiments. This method is suitable for engineering applications and has practical significance for understanding the damage evolution mechanism, which is helpful for the suppression of grinding damage and the optimization of the grinding process.

Chloride ion diffusion performance of concrete and its influence on scour resistance

Hydraulic structures are affected by many factors, and chloride ions can significantly reduce the service life of concrete. In this paper, the erosion test of chloride ion erosion is studied, the damage characterization is carried out by two-dimensional and three-dimensional characterization methods, and the numerical simulation analysis is carried out. The results show that when the water cement ratio (w/c) is 0.3, 0.4 and 0.5, the grinding depth of concrete surface reaches 21 mm, and the chloride ion concentration is stable. With the increase of w/c, the porosity increases, especially the harmful pores have the greatest influence on ion erosion. Chloride ion erosion reduces the scour resistance of concrete. When the w/c decreases from 0.5 to 0.4, the influence of ions on the scour resistance of concrete is weakened by 5.3%. Under 0.5 w/c, the exposed area of aggregate on the surface of concrete increases by 15.6%, and the average erosion rate of concrete decreases by 3.3%, 5.0% and 16.0%. With the increase of chloride ion diffusion depth, the chloride ion concentration is in good agreement with the simulated value. The interfacial transition zone around the coarse aggregate promotes ion diffusion, so that the ion concentration of the concrete surface reaches the peak. Concrete with a w/c of 0.3 has a longer life under the same conditions.

Tactile Perception-Based Depth and Angle Control During Robot-Assisted Bent Bone Grinding

During bent bone grinding, the robot often needs to adjust its grinding depth and angle in real-time to ensure surgical quality. Optical- or vision-based navigation methods are no longer applicable due to the interference caused by splashing cooling water in the operating field. Inspired by orthopedic surgeons, this manuscript presents a tactile perception-based method to solve this problem. The effect of grinding parameters on the cutter's current and vibration is analyzed, and current and vibration signals are further processed to predict depth and angle. Depth and angle estimation models were calibrated on homogeneous artificial bone. Grinding control experiments were carried out on femur models, and the statistical mean and standard deviation results of the measured depth show that the accuracy of depth control can be further improved by adding angle estimation and proper adjustment when depth is indirectly estimated based on sensing signals. The proposed approach relies solely on the estimation of the relative position and posture between the tool and the bone surface and is expected to improve the safety of automatic grinding with orthopedic robots.

Study on subsurface damage behavior in ductile ultra-precision grinding of sapphire based on acoustic emission signal processing

Chemical corrosion, photothermal absorption and acoustic emission were used to multidimensionally evaluate and monitor subsurface damage behavior in ductile ultra-precision grinding of sapphire. The optimum ductile grinding surface can be obtained at different grinding depths when grinding with constant-depth. The density of corrosion dislocation craters and the value of photothermal absorption increased with grinding depth, and the subsurface damage scales under the ductile grinding surface were distinct. Subsurface damage was dominated by cracks and spalling. Severe brittle fractures occurred at greater grinding depths in varied-depth grinding. The corroded grinding surface consisted of the original polishing surface, the ductile grinding surface, and the brittle fracture characteristic. The amplitude and fluctuation of grinding force increased with grinding depth. The original signal and Fourier transform cannot monitor the damage behavior. A signal processing model based on wavelet transform, signal reconstruction and fast Fourier transform was developed. The processed signal characteristics can correspond to the damage behavior under the ductile grinding surface.

Effect of diamond grain shape on gallium nitride nano-grinding process

In the grinding process, the quality of the product in the process is affected by many factors. In order to improve the processing quality and take into account the processing efficiency, the selection of a reasonable abrasive grain shape can be considered. This is a low-cost and highly feasible approach. In this article, the molecular dynamics method was employed to simulate the process of grinding GaN with four common synthetic diamond of abrasive grains (spherical, octahedron, cubic and cub-octahedron), and the surface morphology, material removal rate, temperature, potential energy, grinding force, substrate structure deformation, subsurface damage and dislocation were investigated. The results show that the cubic abrasive grain has the highest material removal rate with the number of chip atoms per unit area about 1.68 times that of the cub-octahedron abrasive grain. The lowest subsurface temperature of the octahedron abrasive grain during processing is 498 K. In contrast, the other three grits have similar subsurface temperatures of 540 K, 535 K and 545 K, respectively. The tangential force per unit area of octahedron abrasive grain is about 0.68761 (spherical: 0.23987, cubic: 0.4476, cubo-octahedral: 0.4314), but its potential energy is the most stable during processing. The shape of the abrasive grain has no significant effect on the coefficient of friction, while it has a significant effect on the subsurface damage. The depth of subsurface damage is the smallest for both cubic and cub-octahedron abrasive grain (2.4 nm), while cub-octahedron abrasive grain is more capable of promoting the generation of dislocations within the substrate. In addition, the performance of cubic and cub-octahedron abrasive grain at different grinding depths was further explored. Number of chip atoms, temperature, grinding force and subsurface damage all increase with the grinding depth. Nevertheless, the machining performance of cubic abrasive grain is still superior to that of cub-octahedron abrasive grain when the grinding depth is more than 1 nm. The outcome of this study may provide a micro-scale insight into the selection of abrasive grain shapes for processing GaN substrates.

Study of subsurface damage during nano-grinding of B3-GaN using molecular dynamics simulations

The mechanism of subsurface damage formation during zinc blende gallium nitride (B3-GaN) nano-grinding was investigated using molecular dynamics (MD). The effects of grinding depth and abrasive radius on the grinding force, temperature, potential energy, phase transition, dislocations, the average coefficient of friction (COF), material removal rate (MRR) and subsurface damage were systematically investigated. The results show that dislocations, amorphization and wurtzite (B4) phase transitions are the primary defects present in the subsurface damage layer. Dislocation nucleation and proliferation are the main mechanisms aggravating the subsurface damage, and the 1/2<110> perfect dislocation along the <110> slip direction predominates in the dislocation. Grinding forces, temperature, potential energy, amorphous atoms, B4 phase atoms and dislocations increase with increasing grinding depth, exacerbating the subsurface damage of B3-GaN. As the abrasive radius increases, the amorphous atoms increase and then decrease, with the B4 phase atoms gradually reducing. The rest of the above parameters increase gradually, exacerbating the subsurface damage of B3-GaN. Furthermore, a smaller grinding depth and abrasive radius result in better machining accuracy, but decrease MRR. A technical reference for the ultra-precise and low-damage processing of B3-GaN can be provided by this study.

Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Owing to excellent physical and optical characteristics, Sapphire has wide applications in detection, military, photoelectric and other industries. Nevertheless, it's difficult to use the conventional processing methods to process sapphire with high precision and efficiency due to its hardness and brittleness. This study adopted longitudinal-torsional compound ultrasonic vibration end grinding (LTUEG) method to grind sapphire. Firstly, the grinding trajectory equation of single grain under LTUEG was established. Then, combining with the motion state of single grain, the removal mechanism of sapphire under LTUEG was clarified. Finally, a comparative experiment between LTUEG and conventional end grinding (CEG) of sapphire was conducted, and the effects of processing parameters on surface topography and surface roughness were investigated. Results showed that surface roughness declined with grinding speed, enhanced with feed rate and grinding depth, declined first and then went up with amplitude, and the minimum value was 0.522 μm. Compared with CEG, LTUEG could significantly reduce the surface roughness, with a maximum reduction of 20.98 %. LTUEG could reduce the pits size. Meanwhile, when the longitudinal amplitude AL was 0.8 μm, the average pits length and pits depth reached the minimum, which were 33.13 μm and 5.296 μm, respectively. The research found that LTUEG could reduce block spalling, increase the ratio of plastic domain removal as well as improve the surface flatness of workpiece.

Study on Grinding-Affected Layer of Outer-Ring Inner Raceway of Tapered Roller Bearing.

In the grinding of bearing raceways, the coupling effect between grinding force and heat in the contact area between the grinding wheel and the workpiece causes changes in the material structure and mechanical properties of the raceway surface layer, which can lead to the formation of a grinding-affected layer. The grinding-affected layer has a significant impact on the service performance and fatigue life of bearings. In order to improve the ground surface quality of the outer-ring inner raceway of tapered roller bearings and optimize the processing parameters, this paper presents a study on the grinding-affected layer. A finite element simulation model for grinding the outer-ring inner raceway of the tapered roller bearing was established. The grinding temperature field was simulated to predict the affected-layer thickness during raceway grinding. The correctness of the model was verified through grinding experiments using the current industrial process parameters of bearing raceway grinding. The research results indicate that the highest grinding temperature of the outer-ring inner raceway of the tapered roller bearing is located near the center of the grinding arc area on the thin end edge. As the workpiece speed and grinding depth decrease, the highest grinding temperature decreases, and the dark layer thickness of the grinding-affected layer decreases or even does not occur. The research results can provide theoretical guidance and experimental reference for grinding the raceway of tapered roller bearings.