Electron Gas Density Research Articles

Electron confinement-induced plasmonic breakdown in metals.

Plasmon resonance represents the collective oscillation of free electron gas density and enables enhanced light-matter interactions in nanoscale dimensions. Traditionally, the classical Drude model describes plasmonic excitation, wherein plasma frequency exhibits no spatial dispersion. Here, we show conclusive experimental evidence of the breakdown of plasmon resonance and a consequent metal-insulator transition in an ultrathin refractory plasmonic material, hafnium nitride (HfN). Epitaxial HfN thick films exhibit a low-loss and high-quality Drude-like plasmon resonance in the visible spectral range. However, as the film thickness is reduced to nanoscale dimensions, Coulomb interaction among electrons increases because of electron confinement, leading to the spatial dispersion of plasma frequency. With a further decrease in thickness, electrons lose their ability to shield the incident electric field, turning the medium into a dielectric. The observed metal-insulator transition might carry some signatures of Wigner crystallization and indicates that such transdimensional, between 2D and 3D, films can serve as a promising playground to study strongly correlated electron systems.

Effect of temperature on the performance of ScAlN/GaN high-electron mobility transistor

We have studied the operation of the ScAlN/GaN high-electron mobility transistor (HEMT) at high temperatures up to 700 K (423 °C). A maximum drain current density of ∼2 A/mm and an on-resistance of ∼1.5 Ω·mm was measured at room temperature (RT). The epi-structure exhibited a very high two-dimensional electron gas (2DEG) density of 6 × 1013 cm−2 at RT using Hall measurement. The Sc0.15Al0.85N barrier, nearly lattice matched to the GaN channel, showed a drain current reduction of ∼50% at 700 K. The decrease in 2DEG mobility, which leads to an increase in sheet resistance, is mostly responsible for this reduction in drain current. However, an excellent electrostatic control was achieved at 700 K with the drain current value exceeding 1 A/mm, which is 2 times higher compared to that of AlGaN/GaN HEMTs reported previously. These results indicate that ScAlN/GaN HEMTs are a promising candidate for high-temperature and high-power electronic applications.

Boosting the two-dimensional electron gas density of Al0.20Ga0.80N/GaN heterostructures by regrowth of an epitaxial Sc0.18Al0.82N layer

Sc-alloyed AlN epilayers were grown on commercial GaN/sapphire templates by molecular beam epitaxy (MBE) to validate the Sc composition of 18% and in-plane lattice matching with GaN. As-grown Sc0.18Al0.82N/GaN heterostructure exhibits a two-dimensional electron gas (2DEG) density of 3.58 × 1013 (2.96 × 1013) cm−2 and a mobility of 241 (295) cm2⋅V−1⋅s−1 at 300 (77) K, demonstrating the feasibility of employing its high spontaneous polarization toward high 2DEG density and highlighting detrimental impurity scattering due to the regrowth interface. Implementation of AlN impurity blocking layers boosts 2DEG mobility to 1290 (8730) cm2 V−1⋅s−1at 300 (77) K. In addition, we have engineered a surface-treatment strategy to selectively decompose the 2.5-nm-thick GaN cap layer of commercial GaN(2.5 nm)/Al0.20Ga0.80N(22 nm)/GaN heterostructure epi-wafers at high temperature prior to MBE regrowth of Sc0.18Al0.82N to eliminate impurity incorporation at the regrowth interface. Regrowth of a Sc0.18Al0.82N layer on the pristine Al0.20Ga0.80N surface increases 2DEG density from 7.89 × 1012 to 9.57 × 1012 cm−2, together with a slight reduction in mobility from 2160 to 1970 cm2⋅V−1⋅s−1 at 300 K, reducing the sheet resistance by 10%. Our calculation implies that it is practical to boost 2DEG density to over 2.0 × 1013 cm−2 by thinning Al0.20Ga0.80N down to 4 nm.

Gate tunable edge magnetoplasmon resonators

AbstractQuantum Hall systems are platforms of choice to study topological properties of condensed matter systems and anyonic exchange statistics. In this work we have developed a tunable radiofrequency edge magnetoplasmonic resonator controlled by both the magnetic field and a set of electrostatic gates, meant to serve as a versatile platform for future interferometric devices designed to evidence non-abelian anyons. In our device, gates allow us to change both the size of the resonant cavity and the electronic density of the two-dimensional electron gas. We show that we can continuously control the frequency response of our resonator, making it possible to develop an edge magnetoplasmon interferometer. As we reach smaller sizes of our resonator, finite size effects caused by the measurement probes manifest. In the future, such device will be a valuable tool to investigate the properties of non-abelian anyons in the fractional quantum Hall regime.

ScAlInN/GaN heterostructures grown by molecular beam epitaxy

Rare-earth (RE) elements doped III-nitride semiconductors have garnered attention for their potential in advanced high-frequency and high-power electronic applications. We report on the molecular beam epitaxy of quaternary alloy ScAlInN, which is an encouraging strategy to improve the heterointerface quality when grown at relatively low temperatures. Monocrystalline wurtzite phase and uniform domain structures are achieved in ScAlInN/GaN heterostructures, featuring atomically sharp interface. ScAlInN (the Sc content in the ScAlN fraction is 14%) films with lower In contents (less than 6%) are nearly lattice matched to GaN, exhibiting negligible in-plane strain, which are excellent barrier layer candidates for GaN high electron mobility transistors (HEMTs). Using a 15-nm-thick Sc0.13Al0.83In0.04N as a barrier layer in GaN HEMT, a two-dimensional electron gas density of 4.00 × 1013 cm−2 and a Hall mobility of 928 cm2/V s, with a corresponding sheet resistance of 169 Ω/□, have been achieved. This work underscores the potential of alloy engineering to adjust lattice parameters, bandgap, polarization, interfaces, and strain in emerging RE-III-nitrides, paving the way for their use in next-generation optoelectronic, electronic, acoustic, and ferroelectric applications.

Wafer-scale N-polar GaN heterogeneous structure fabricated by surface active bonding and laser lift-off

N-polar Gallium nitride (GaN) technology is one of the most important technical routes for millimeter-wave devices. This paper introduces a new approach based on reverse epitaxial layer transfer technology to fabricate N-polar GaN materials. By combining low-damage surface-activated bonding and laser lift-off techniques, a wafer-scale N-polar GaN heterogeneous structure with low O impurities, high two-dimensional electron gas density, and high carrier mobility was obtained. The thin (∼2 nm) crystal bonding interlayer, coupled with the low thermal boundary resistance of only 6.8 m2K/G·W, provides evidence for the low interfacial damage caused by this approach. These results demonstrate its superiority as an attractive method for fabricating high-performance N-polar GaN millimeter-wave devices.

Simulation-based optimization of barrier and spacer layers in InAlN/GaN HEMTs for improved 2DEG density

In this study, we utilize Nextnano device simulation software to systematically investigate the dependence of 2-DEG (two-dimensional electron gas) density on the barrier and spacer Layers in InAlN/GaN high electron mobility transistors (HEMTs). By simulating a range of barrier thicknesses, In mole fractions, and spacer layer thicknesses, we reveal the intricate ways in which these parameters influence device performance. Our simulations demonstrate that precise control of the InAlN barrier thickness and In mole fraction, along with the AlN spacer thickness, is crucial for optimizing 2DEG density and, consequently, the overall electrical properties of the HEMTs. Notably, our results highlight that an InAlN barrier thickness below 12 nm, coupled with an optimized In mole fraction and a finely tuned AlN spacer thickness close to 1 nm, significantly enhances 2DEG density without compromising mobility. These insights provide a detailed understanding of the material and structural dependencies critical for the design and development of high-performance InAlN/GaN HEMTs. Our study includes detailed calculations of the device's I–V characteristics. Notably, the highest peak output current is observed at a 1 nm AlN spacer thickness, reaching 0.91 A/mm. Our findings highlight a noteworthy agreement between the results derived from our computational simulations and experimental measurements.

Analytical modeling of threshold voltage and on-resistance in multi-barrier E-mode MISHEMT with gate-recess and field-plates

This work presents an analytical model for threshold voltage and On-resistance of multi barrier Metal–Insulator–Semiconductor High-Electron-Mobility-Transistor (MISHEMT) with gate-recess and field-plates. The device featuring a high two-dimensional electron-gas (2DEG) density in the channel region. The primary objectives of this device are to achieve a high threshold voltage (Vth) and enhance electron mobility with specific low ON-resistance (Ron_sp) by mitigating the degradation effects arising from scattering and interface-charges. Also, a physics based analytical model for Vth and 2DEG charge density at upper and lower channels is presented. This model is validated by comparing with TCAD numerical simulations and are well matched. The proposed MISHEMT demonstrates improved electron mobility in the lower channel of 1260 cm2/V.s, Vth of ∼2.6 V and Ron_sp is minimized by 33 % in contrast with a conventional MISHEMT. Additionally, the proposed MISHEMT becomes a promising device for achieving both high threshold voltage and mobility which are required for power semiconductor devices.

Diamond/cubic boron nitride (111) heterojunction interface: Rational regulation of high two-dimonsional electron gas

Wide-bandgap diamond exhibits excellent physical and chemical properties, making it an ideal substrate material for developing high-temperature and high-power semiconductor devices and broadening its application prospects in the field of microelectronics and optoelectronic devices. However, because of the Fermi pinning effect, it is difficult to achieve n-type diamond with excellent transport properties. Cubic boron nitride (cBN) has similar structural properties and a smaller lattice mismatch with diamond. Thus, making the two-dimensional electron gas of the diamond/cBN heterojunction provides a new idea to solve the problem of diamond n-incorporation difficulty and small bandgap regulation range. The diamond/cBN heterojunction is applied to study the law of influence factors on the heterojunction band structure, band alignment, and polarization strength. Further, a regulation mechanism for two-dimensional electron gas density is established at heterojunction interfaces, which can help solve the core difficulties of diamond n-type doping, small bandgap regulation range, and high impedance, providing a theoretical basis for realizing diamond power devices with high power density and low power consumption.

Unidirectional Charge Orders Induced by Oxygen Vacancies on SrTiO3(001).

The discovery of high-mobility two-dimensional electron gas and low carrier density superconductivity in multiple SrTiO3-based heterostructures has stimulated intense interest in the surface properties of SrTiO3. The recent discovery of high-Tc superconductivity in the monolayer FeSe/SrTiO3 led to the upsurge and underscored the atomic precision probe of the surface structure. By performing atomically resolved cryogenic scanning tunneling microscopy/spectroscopy characterization on dual-TiO2-δ-terminated SrTiO3(001) surfaces with (√13 × √13), c(4 × 2), mixed (2 × 1), and (2 × 2) reconstructions, we disclosed universally broken rotational symmetry and contrasting bias- and temperature-dependent electronic states for apical and equatorial oxygen sites. With the sequentially evolved surface reconstructions and simultaneously increasing equatorial oxygen vacancies, the surface anisotropy reduces and the work function lowers. Intriguingly, unidirectional stripe orders appear on the c(4 × 2) surface, whereas local (4 × 4) order emerges and eventually forms long-range unidirectional c(4 × 4) charge order on the (2 × 2) surface. This work reveals robust unidirectional charge orders induced by oxygen vacancies due to strong and delicate electronic-lattice interaction under broken rotational symmetry, providing insights into understanding the complex behaviors in perovskite oxide-based heterostructures.

Source of the Fe Kalpha emission in T Tauri stars. Radiation induced by relativistic electrons during flares. An application to RY Tau

T Tauri stars (TTSs) are magnetically active stars that accrete matter from the inner border of the surrounding accretion disk; plasma becomes trapped into the large-scale magnetic structures and falls onto the star, heating the surface through the so-called accretion shocks. The X-ray spectra of the TTSs show prominent Fe Kalpha fluorescence emission at 6.4 keV (hereafter, Fe Kalpha emission) that cannot be explained in a pure accretion scenario because its excitation requires significantly more energy than the maximum available through the well-constrained free-fall velocity. Neither can it be produced by the hot coronal plasma. TTSs display all signs of magnetic activity, and magnetic reconnection events are expected to occur frequently. In these events, electrons may become accelerated to relativistic speeds, and their interaction with the environmental matter may result in Fe Kalpha emission. It is the aim of this work to evaluate the expected Fe Kalpha emission in the context of the TTS research and compare it with the actual Fe Kalpha measurements obtained during the flare detected while monitoring RY Tau with the XMM-Newton satellite. The propagation of high-energy electrons in dense gas generates a cascade of secondary particles that results in an electron shower of random nature, whose evolution and radiative throughput was simulated in this work using the Monte Carlo code PENELOPE. A set of conditions representing the environment of the TTSs where these showers may impinge was taken into account to generate a grid of models that can aid the interpretation of the data. The simulations show that the electron beams produce a hot spot at the point of impact; strong Fe Kalpha emission and X-ray continuum radiation are produced by the spot. This emission is compatible with RY Tau observations. The Fe Kalpha emission observed in TTSs could be produced by beams of relativistic electrons accelerated in magnetic reconnection events during flares.

Investigation of Three‐Channel Heterostructure and High‐Electron‐Mobility Transistor with Quaternary In0.1Al0.5Ga0.4N Barrier

Herein, a high‐quality In0.1Al0.5Ga0.4N/GaN three‐channel (TC) heterostructure and the high‐electron‐mobility transistor (HEMT) based on it are proposed and investigated. The quaternary nitrides offer additional flexibility in adjusting the lattice constant and bandgap, enabling the achievement of a nearly strain‐free high‐Al‐content barrier. By stacking three In0.1Al0.5Ga0.4N/GaN heterostructures, a high 2D electron gas density of 2.59 × 1013 cm−2 and a high electron mobility of 1707 cm2 V−1 s−1 are achieved. As compared with the AlGaN/GaN TC heterostructure, the In0.1Al0.5Ga0.4N/GaN TC heterostructure reduces the sheet resistance by 39%, resulting in a 40 % reduction in the on‐resistance of the TC HEMT. Additionally, the inverse piezoelectric effect of the In0.1Al0.5Ga0.4N/GaN TC‐HEMT is investigated by negative‐gate voltage bias step‐stress experiments. During the stress experiments, no irreversible degradation is observed in the In0.1Al0.5Ga0.4N/GaN TC‐HEMT, while the AlGaN/GaN TC‐HEMT exhibits a significant deterioration beyond the critical voltage. The reliability related to the inverse piezoelectric effect of the devices can be further improved due to the lower stress in the lattice‐matched quaternary barrier.

Adaptive impedance matching in microwave and terahertz metamaterial absorbers using PIN diodes and GaN HEMTs

Metamaterial absorbers allow electromagnetic waves to be converted into heat energy based on impedance matching. However, passive metamaterial absorbers exhibit fixed absorption characteristics, limiting their flexibility. This work demonstrates tunable microwave and terahertz absorbers by integrating adjustable resistors into the metamaterial units. First, a microwave absorber from 1 to 5 GHz was designed by embedding PIN diodes with voltage-controlled resistance. Calculations, simulations, and measurements verified two separate absorption peaks over 90% when optimized to a resistance of 250 Ω. The absorption frequencies shifted based on the resistor tuning. Building on this, a terahertz absorber was modeled by substituting gallium nitride high electron mobility transistors (GaN HEMTs) as the adjustable resistor component. The GaN HEMTs were controlled by an integrated gate electrode to modify the two-dimensional electron gas density, allowing resistance changes without external voltage terminals. Simulations revealed two absorption peaks exceeding 90% absorption at 0.34 THz and 1.06 THz by adjusting the equivalent resistance from 180 Ω to 380 Ω, and the tunable resistance is verified by DC measurement of single GaN HEMT in the unit. This work demonstrates how integrating adjustable resistors enables dynamic control over the absorption frequencies and bandwidths of metamaterial absorbers. The proposed geometries provide blueprints for tunable microwave and terahertz absorbers.

GaN-HEMT Performance Enhancement

In this work, a simulation analysis and calibration are carried out to improve the performance of AlGaN/GaN- MOSHEMTs (Metal-Oxide Semiconductor High Electron Mobility Transistors). The effect of the AlGaN layer thickness, gate length, Al mole fraction, and the interface traps on the electrical performance of the device has been presented. Device simulations have been done using Sentaurus technology computer-aided design (TCAD). The simulations and analysis show better drain current, transconductance, and cut-off frequency performance. The maximum cut-off frequency shown by the proposed HEMT device is 45.7 GHz at 100-nm gate length. Good transcoductance has been obtained by scaling down the gate length of the device, which is ascribed to the present two-dimensional electron gas (2DEG) density that supports upgrading the output current. Higher drain current is achieved without using acceptor-like traps in the Al2O3/AlGaN interface. Results show that the Al2O3/AlGaN/GaN-based MOSHEMT is a promising device for high-frequency and power electronic applications.

Electron mobility enhancement by electric field engineering of AlN/GaN/AlN quantum-well HEMTs on single-crystal AlN substrates

To enhance the electron mobility in quantum-well high-electron-mobility transistors (QW HEMTs), we investigate the transport properties in AlN/GaN/AlN heterostructures on Al-polar single-crystal AlN substrates. Theoretical modeling combined with experiment shows that interface roughness scattering due to high electric field in the quantum well limits mobility. Increasing the width of the quantum well to its relaxed form reduces the internal electric field and scattering, resulting in a binary QW HEMT with a high two-dimensional electron gas (2DEG) density of 3.68×1013 cm–2, a mobility of 823 cm2/Vs, and a record-low room temperature (RT) sheet resistance of 206 Ω/□. Further reduction of the quantum well electric field yields a 2DEG density of 2.53×1013 cm–2 and RT mobility > 1000 cm2/V s. These findings will enable future developments in high-voltage and high-power microwave applications on the ultrawide bandgap AlN substrate platform.

Effect of annealing on the electrical performance of N-polarity GaN Schottky barrier diodes

A nitrogen-polarity (N-polarity) GaN-based high electron mobility transistor (HEMT) shows great potential for high-frequency solid-state power amplifier applications because its two-dimensional electron gas (2DEG) density and mobility are minimally affected by device scaling. However, the Schottky barrier height (SBH) of N-polarity GaN is low. This leads to a large gate leakage in N-polarity GaN-based HEMTs. In this work, we investigate the effect of annealing on the electrical characteristics of N-polarity GaN-based Schottky barrier diodes (SBDs) with Ni/Au electrodes. Our results show that the annealing time and temperature have a large influence on the electrical properties of N-polarity GaN SBDs. Compared to the N-polarity SBD without annealing, the SBH and rectification ratio at ±5 V of the SBD are increased from 0.51 eV and 30 to 0.77 eV and 7700, respectively, and the ideal factor of the SBD is decreased from 1.66 to 1.54 after an optimized annealing process. Our analysis results suggest that the improvement of the electrical properties of SBDs after annealing is mainly due to the reduction of the interface state density between Schottky contact metals and N-polarity GaN and the increase of barrier height for the electron emission from the trap state at low reverse bias.

Theoretical Studies of 2D Electron Gas Distributions and Scattering Characteristics in Double‐Channel n‐Al0.3Ga0.7N/GaN/i‐AlxGa1−xN/GaN High‐Electron‐Mobility Transistors

A detailed analysis of self‐consistent potentials, electric fields, electron distributions, and transport properties of dual‐channel (DC) n‐Al0.3Ga0.7N/GaN/i‐AlxGa1−xN/GaN high‐electron‐mobility transistors (HEMTs) is performed in this article. The 2D electron gas (2DEG) densities and mobility states limited by different scattering mechanisms in channel 1 and channel 2 are obtained, with varying values of doping concentrations, ambient temperatures, Al components, and thicknesses of the back barrier layer. The reduced and increased 2DEG densities are respectively observed in channel 1 and channel 2 with growing Al fractions and thicknesses of the AlxGa1−xN layer. Alloy disorder scattering exhibits a superior effect on carriers in channel 2 due to the lower barrier height and higher permeable electrons, which together with the interface roughness scattering severely depends on the thicknesses and Al fractions of the back barrier layer. Polar optical phonon scattering becomes important at higher temperatures. The trend of individual mobility in channel 1 is exactly opposite to that in channel 2. The parameter variation of the back barrier layer can effectively change the scattering characteristics of the main channel. Low‐temperature mobilities of n‐Al0.3Ga0.7N/GaN/i‐AlxGa1−xN/GaN HEMTs under varied doping concentrations are also obtained. Finally, the results are verified by comparison with the technology computer‐aided design simulations for DC HEMTs.

Design of multi-channel heterostructures for GaN devices

The emerging multi-channel GaN architecture offers great opportunities in high-performance devices, whose performance is fundamentally determined by the density and distribution of electrons among the parallel multi-channels. In this work, we present approaches to design multi-channel GaN heterostructures based on a proposed physical-based model and experimental results. The model presents excellent accuracy based on comparisons with TCAD and experimental results. Impacts of key designing parameters upon the two-dimensional electron gas density and the distribution of electrons were systematically investigated within undoped and doped multi-channels, presenting a criterion to determine the maximum channel thickness and evaluate the multi-channel design, and offering a design guideline to design and optimize a multi-channel-GaN heterostructure for a given targeted application.

Review of the AlGaN/GaN High-Electron-Mobility Transistor-Based Biosensors: Structure, Mechanisms, and Applications.

Due to its excellent material performance, the AlGaN/GaN high-electron-mobility transistor (HEMT) provides a wide platform for biosensing. The high density and mobility of two-dimensional electron gas (2DEG) at the AlGaN/GaN interface induced by the polarization effect and the short distance between the 2DEG channel and the surface can improve the sensitivity of the biosensors. The high thermal and chemical stability can also benefit HEMT-based biosensors' operation under, for example, high temperatures and chemically harsh environments. This makes creating biosensors with excellent sensitivity, selectivity, reliability, and repeatability achievable using commercialized semiconductor materials. To synthesize the recent developments and advantages in this research field, we review the various AlGaN/GaN HEMT-based biosensors' structures, operations mechanisms, and applications. This review will help new researchers to learn the basic information about the topic and aid in the development of next-generation of AlGaN/GaN HEMT-based biosensors.

Study of the breathing mode development in Hall thrusters using hybrid simulations

We use a 2.5D hybrid simulation to study the breathing mode (BM) dynamics in Hall thrusters (HTs). This involves a 1D Euler fluid simulation for neutral dynamics in the axial direction, coupled with a 2D axial–azimuthal Particle-in-Cell (PIC) simulation for charged species. The simulation also includes an out-of-plane virtual dimension for wall losses. This setup allows us to replicate the BM’s macroscopic features observed in experiments. A comprehensive analysis of plasma parameters in BM’s phases divides it into two growth and two decay sub-phases. Examining 1D axial profiles of electron temperature, gas and plasma densities, and particle creation rate shows that an increase in electron temperature alone cannot sustain ionization. Ionization seems to be influenced by the spatial correlation between electron and gas densities and the ionization rate coefficient. Investigating ion back-flow reveals its impact on modulating neutral flux entering the ionization region. The hybrid simulation’s outcomes let us assess the usual 0D predator–prey model’s validity and identify its limitations. The ionization and ion convection term approximations hold, but the gas convective term approximation does not. Introducing an alternative gas convective term approximation involving constant density ejection from the ionization region constructs an unstable BM model consistent with simulation results. In addition, this paper explores how varying the imposed voltage and mass flow rate impacts the BM. The BM frequency increases with imposed voltage, aligning with theoretical predictions. The mass flow rate variation has a limited effect on BM frequency, following the theoretical model’s trend.