Copper-nickel Alloys Research Articles

Nickel–Copper Alloy Nanoparticles Embedded in N-Doped Porous Carbon Nanosheets for Supercapacitors and Hydrogen Evolution Reaction

Nickel–Copper Alloy Nanoparticles Embedded in N-Doped Porous Carbon Nanosheets for Supercapacitors and Hydrogen Evolution Reaction

Crystallographic texture of tape substrates for HTSC from Cu-40%Ni alloy with additives of refractory elements

The texture of deformation and primary recrystallization in copper-nickel alloys with the addition of a small amount of refractory elements such as Nb, Mo, Ta and W was studied. Based on the X-ray analysis of the deformation texture using the orientation distribution function, it was shown that the volume fraction of the C and S components in alloys is greater than the double volume fraction of the unfavorable component B. In accordance with this criterion, after primary recrystallization in all the studied alloys, a sharp cubic texture {100}< 001 > was obtained with a volume fraction in the± 10° region of more than 95%. Alloying with refractory elements significantly increases the strength of the base copper-nickel alloy by the mechanism of solid-solution hardening. The evaluation of the mechanical characteristics showed that the increase in the yield stress in the studied alloys is from 25% to 45% with relative to Cu-40% Ni alloy.

Effect of Dispersions of Al2O3 on the Physical and Mechanical Properties of Pur ties of Pure Copper and Copper-Nick e Copper and Copper-Nickel Allo el Alloy

This paper illustrates the mechanical and physical properties of pure Cu and Cu-Ni (50-50 wt. %) alloy mixed with Al2O3 (1-4 wt. %) as micro-particles reinforcement materials. The attained composite alloy specimens' characteristics were estimated such as microstructure, relative density, electrical and thermal conductivity, hardness, and compression yield stress properties to adjust the suitable optimum percentage of reinforcing material which has the best physical and mechanical properties with different main matrix materials whether pure Cu powder or Cu-Ni mechanical alloy. The micron-sized Al2O3 was added to enhance the mechanical and physical properties of the pure Cu and Cu-Ni alloy composites. The electrical and thermal conductivity for pure Cu alloy composites were improved compared to the copper-nickel alloy matrix composites material. The hardness and compression yield stress of pure copper has enhancement values and for Cu-Ni alloy composites have enhancement values and for Cu-Ni base composites, hardness and compression yield stress have improved with the most positive enhancement values.

This paper illustrates the mechanical and physical properties of pure Cu and Cu-Ni (50-50 wt. %) alloy mixed with Al2O3 (1-4 wt. %) as micro-particles reinforcement materials. The attained composite alloy specimens' characteristics were estimated such as microstructure, relative density, electrical and thermal conductivity, hardness, and compression yield stress properties to adjust the suitable optimum percentage of reinforcing material which

The recent booming in the power network industry inspired a lot of researchers to develop models to estimate the optimum cost of transmission towers. Unlike previous researches which depended on design the tower from scratch, this research depends on collecting actual database from several projects around the globe and applying the well-known (GP) technique to develop a model to predict the tower weight. The accuracy of the developed formula was about 84%. The developed model could be used in early tender stage or to check design economy.

Electrochemical Surface Treatment of Ni–Cu Alloy in a Deep Eutectic Solvent to form High Performance Electrocatalysts for Hydrogen Production

Anodic electrochemical treatment of nickel-copper alloy (45 wt.% Ni) was conducted in a deep eutectic solvent, ethaline (a eutectic mixture of choline chloride and ethylene glycol). The electrochemical behavior of the Ni–Cu alloy was investigated by means of linear voltammetry technique. Anodic treatment of nickel-copper alloy in ethaline was stated to enhance the electrocatalytic activity towards hydrogen evolution reaction in alkaline water electrolysis. The results obtained can be used to develop new electrocatalysts for hydrogen synthesis in hydrogen energy.

Ar-plasma enhanced copper-nickel alloy catalysis for ammonia synthesis

Ar-plasma enhanced copper-nickel alloy catalysis for ammonia synthesis

Influence of Manufacturging Parameters on Microstructure, Chemical Composition, Microhardness, Corrosion and Wear Resistance of ZrC Coatings Produced on Monel®400 Using Laser Processing Technology

This paper presents the influence of production parameters and analysis of ZrC coatings production on Monel®400 substrate. The effects of laser beam power on the microstructure, chemical composition, corrosion resistance and on selected mechanical properties such as microhardness and wear resistance were investigated. The investigation consisted of the production of composite coatings using laser processing of pre-coatings made in paste form on a nickel based alloy (Monel®400). In the studies, a diode laser with a rated power of 3 kW was used. The laser processing was carried out using a constant laser beam scanning speed of 3 m/min and three different laser beam powers: 350, 450, 550 W. It was found that it is possible to form composite coatings on a nickel-copper alloy substrate, where the matrix is made of nickel-copper based alloy from substrate and the reinforcing phase is ZrC. Investigation was carried out for single and multiple laser tracks. Based on the studies it was found that reinforcing phase content decreased as laser beam power increased. A similar relationship was found for all the other investigated properties such as microhardness, corrosion resistance, and wear resistance. As laser beam power increases, the microhardness of the Ni-Cu-based matrix decreases. However, is still greater than for the Monel®400 substrate. It was found that the amount of hard carbide phases in the Ni-Cu-based matrix affects the corrosion and wear resistance of the coatings.

Friction and wear of cobalt–chromium–nickel–copper alloy in contact with tungsten-carbide-sintered balls

ABSTRACT This paper describes a study of the influence of elemental nickel (Ni) and copper (Cu) elements on the tribological behaviour of a CoCr-based alloy. The tribology of CoCr-based alloys was examined by using a Bruker UMT-TriboLab machine with normal loads of 200 N, a frequency of 3 Hz, and a duration of 10 min. The Co70Cr20Ni5Cu5 alloy with 5wt-% Ni and 5wt-% Cu content showed the best wear property compared with other alloys, with a minimum friction coefficient of 0.147. The large improvement in wear resistance is related to the strongly inhibiting effect of crack initiation and growth in the worn surface, which reduces delamination wear. Because of the Co0.52Cu0.48 plastic deformation layer, hard phases like NiCoCr and CrCo can slip easily on the sliding interface and embed into the matrix, which may decrease delamination wear and reduce the crack growth rate.

High-Temperature Oxidation of the Copper–Nickel Alloys Synthesized by Spark Plasma Sintering

High-Temperature Oxidation of the Copper–Nickel Alloys Synthesized by Spark Plasma Sintering

Electrochemical treatment of nickel-copper alloy in ionic liquid based on eutectic mixture of choline chloride and ethylene glycol as a way to increase electrocatalytic activity towards hydrogen evolution reaction

Electrochemical treatment of nickel-copper alloy in ionic liquid based on eutectic mixture of choline chloride and ethylene glycol as a way to increase electrocatalytic activity towards hydrogen evolution reaction

Contribution to the corrosion inhibition of Cu–30Ni copper–nickel alloy by 3-amino-1,2,4-triazole-5-thiol (ATT) in 3% NaCl solution. Experimental and theoretical study (DFT, MC and MD)

Contribution to the corrosion inhibition of Cu–30Ni copper–nickel alloy by 3-amino-1,2,4-triazole-5-thiol (ATT) in 3% NaCl solution. Experimental and theoretical study (DFT, MC and MD)

Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper.

This paper is focused on a new copper-nickel thick film resistive paste which was designed and experimentally developed for the realization of low-ohmic power resistors. This copper-nickel paste has been designed for use in combination with thick printed copper conductors and in comparison with conventional ruthenium-based thick film resistor pastes allows firing in a nitrogen protective atmosphere. The copper-nickel paste was prepared from copper and nickel microparticles, glass binder particles and a combination of organic solvents optimized for its firing in a nitrogen atmosphere. This paper covers a detailed description of copper-nickel paste composition and its thermal properties verified by simultaneous thermal analysis, a description of the morphology of dried and fired copper-nickel films, as well as the electrical parameters of the final printed resistors. It has been proven by electron microscopy with element distribution analysis that copper and nickel microparticles diffused together during firing and created homogenous copper-nickel alloy film. This film shows a low temperature coefficient of resistance ±45 × 0−6 K−1 and low sheet resistance value 45 mΩ/square. It was verified that formulated copper-nickel paste is nitrogen-fireable and well-compatible with thick printed copper pastes. This combination allows the realization of power substrates with directly integrated low-ohmic resistors.

Effect of Fe/Mn content on mechanical and corrosion properties of 90/10 copper–nickel alloy

AbstractThe effect of Fe/Mn content on the metallographic structure, mechanical properties, and corrosion resistance of 90/10 copper–nickel alloy using electrochemical methods, scanning electron microscope, energy dispersive spectroscopy, X‐ray photoelectron spectroscopy, Tafel experiments, and electrochemical impedance spectroscopy measurements were investigated in this paper. The experimental results indicated that the tensile strength of the alloys increases from 326 to 347 MPa with the change of Fe/Mn content, the yield strength of 90/10 copper–nickel alloys is approximately 150 MPa, and the elongation of the alloys was reduced from 51% to 37%. Moreover, as corrosion proceeds, the corrosion product film was mainly composed of Cu2O, Cu2(OH)3Cl. In addition, the Cu–10Ni alloy with Fe/Mn content of 1.69/0.69 has good corrosion resistance properties.

Preparation of three dimensional bimetallic Cu–Ni/NiF electrodes for efficient electrochemical removal of nitrate nitrogen

It still remains a hotspot and great challenge to efficiently remove the nitrate nitrogen from high salt wastewater. Herein, a novel three dimensional porous bimetallic copper-nickel alloy electrode was fabricated with Ni foam (NiF) as substrate. The physicochemical and electrochemical characterization results showed Cu–Ni/NiF electrode possessed the smaller particle size (0.3–1.0 μm) and electrode film resistance comparing with Ni/NiF and Cu/NiF electrodes. Besides, higher double layer capacitance (Cdl) for Cu–Ni/NiF electrode indicated more electrochemical active sites could be used in the electrochemical nitrate nitrogen (NO3−-N) removal. The electrochemical experiments showed the Cu–Ni/NiF electrode had the optimal NO3−-N reduction ability and almost 100% NO3−-N removal could be achieved with 30 min. All NO3−-N removal processes were in accord with the pseudo-first-order reaction kinetics completely. The gaseous nitrogen selectivity for Cu–Ni/NiF electrode could reach 80.9% within 300 min. Stability assessment experiments indicated the Cu–Ni/NiF electrode all kept an excellent stability with Na2SO4 or NaCl electrolyte and the Cl− addition could significantly improve the gaseous nitrogen selectivity. Finally, a possible removal mechanism of NO3−-N was proposed. This work offered a direction for designing non-noble bimetallic electrodes for nitrate removal.

Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics

Cost-effective copper conductive inks are considered as the most promising alternative to expensive silver conductive inks for use in printed electronics. However, the low stability and high sintering temperature of copper inks hinder their practical application. Herein, we develop rapidly customizable and stable copper-nickel complex inks that can be transformed in situ into uniform copper@nickel core-shell nanostructures by a self-organized process during low-temperature annealing and immediately sintered under photon irradiation to form copper-nickel alloy patterns on flexible substrates. The complex inks are synthesized within 15 min via a simple mixing process and are particle-free, air-stable, and compatible with large-area screen printing. The manufactured patterns exhibit a high conductivity of 19-67 μΩ·cm, with the value depending on the nickel content, and can maintain high oxidation resistance at 180 °C even when the nickel content is as low as 6 wt %. In addition, the printed copper-nickel alloy patterns exhibit high flexibility as a consequence of the local softening and mechanical anchoring effect between the metal pattern and the flexible substrate, showing strong potential in the additive manufacturing of highly reliable flexible electronics, such as flexible radio-frequency identification (RFID) tags and various wearable sensors.

Metal-organic framework derived carbon-supported bimetallic copper-nickel alloy electrocatalysts for highly selective nitrate reduction to ammonia

Developing electrocatalysts for efficient reduction of nitrate contaminant to value-added ammonia as energy carrier is a pivotal part for restoring the nitrogen cycle. However, the selectivity of ammonia is far from satisfaction, often suffering from accumulation of toxic nitrite byproduct. Herein, a series of CuNi alloy nanoparticles embedded in nitrogen-doped carbon matrix (CuNi/NC) with hierarchical pores were fabricated by pyrolysis of bimetallic metal–organic frameworks (MOFs). The catalysts exhibited excellent selectivity (94.4%) and faradaic efficiency (79.6%) for nitrate reduction to ammonia, greatly outperforming the performance of monometallic Cu/NC (selectivity of 60.8% and faradaic efficiency of 60.6%). Impressively, the introduction of nickel distinctly suppressed the production of toxic byproduct of nitrite. Online differential electrochemical mass spectrometry (DEMS) and in situ surface-enhanced infrared absorption spectroscopy (SEIRAS) tests were utilized to reveal the key intermediates and the reaction pathway. Density functional theory (DFT) calculations demonstrated that the introducing of nickel into copper lattice modified both the electronic and geometric structures of the catalysts. The copper and nickel sites in the CuNi alloy catalysts operate synergistically to facilitate the hydrogenation of NO2* to HNO2* and suppress the hydrogen evolution reaction, boosting the selective formation of ammonia. This work could provide a new synthetic route for bimetallic catalysts and mechanistic understanding for nitrate to ammonia reaction.

Electrochemical Reduction of CO2 with Exsolved Metal–Oxide Interfaces in a Proton-Conducting Solid Oxide Electrolyzer

A large amount of carbon dioxide emissions have caused a greenhouse effect and even disrupted the global ecological balance. Therefore, it is urgent and significant to achieve emission reduction of CO2. The use of electrochemistry to reduce carbon dioxide into valuable chemicals and fuels is a sustainable strategy. Here, we present the electrochemical reduction of CO2 into CO in a proton-conducting solid oxide electrolyzer at a low temperature. We exsolve the active metal–oxide interfaces NixCu1–x–NbTi0.4Mn0.1O4−δ (NTMO) in a composite cathode by a synergistic doping strategy to increase the length and tailor the composition of the active interfaces and, hence, to promote CO2 reduction. By adjustment of the ratio of the nickel–copper alloy at the metal–oxide interface, it is found that the best performance can appear with an applied voltage of 0.8 V under the composition of Ni0.5Cu0.5–NTMO. A remarkable current efficiency of 99.8% is achieved with CO production at 0.71 mL min–1 cm–2 at a temperature as low as 600 °C. This illustrates the application prospects of electrochemical reduction of CO2 in a solid oxide electrolyzer through interface engineering.

Особенности окисления медно-никелевых сплавов, синтезированных искровым плазменным спеканием

Data on high-temperature tests for heat resistance of copper-nickel-based powder materials synthesized by spark plasma sintering (SPS) are presents. The features of oxidation of copper-nickel alloys with various alloying elements at temperatures above 1000 °C have been studied. Based on the research results, the dependence of the growth rate of the oxide film on the high-temperature oxidation temperature was established, and the influence of alloying elements in the composition of sintered copper-nickel alloys on their heat resistance was considered. It is shown that the highest heat resistance is provided by alloying copper-nickel alloys with aluminum and chromium. For all considered compositions of copper-nickel alloys synthesized by spark plasma sintering, the temperature point of 1100 °C during a 20-hour heat resistance test is the limiting one, since most of the samples are completely destroyed. The scale growth rate for composition Cu – Ni – Cr – Al 1.49·10–3 g/cm3 is lower than the oxidation rate of pure nickel 3.78·10–3 g/cm3 at 1000 °C and these two samples demonstrate the lowest weight gain after testing at 1000 °С. For compositions Cu – Ni, Cu – Ni – Cr – C(graphite) and Cu – Ni – Al the oxidation rate increases by two orders of magnitude, for compositions Cu – Ni – Cr and Cu – Ni – Cr – Si — by three orders of magnitude. Despite increase of test temperature up to 1100 °C, the rate of scale growth on the surface of Cu – Ni – Cr and Cu – Ni – Al specimens remain practically unchanged: 124.01·10–3 and 210.43·10–3 g/cm3 at 1000 °C; 153.44·10–3 and 203.87·10–3 g/cm3 at 1100 °C. Deceleration of the oxidation kinetics of these samples with temperature increase is ensured by formation of oxide film on the surface, which has a dense structure with good adhesion to the basic material.

Synergistic Effect of Biogenic H2s and Extracellular Electron Transfer in Microbial Biocorrosion Behavior of the 90/10 Copper-Nickel Alloy by Desulfovibrio Vulgaris: Experimental and Theoretical Research

Synergistic Effect of Biogenic H2s and Extracellular Electron Transfer in Microbial Biocorrosion Behavior of the 90/10 Copper-Nickel Alloy by Desulfovibrio Vulgaris: Experimental and Theoretical Research

Die steel for hot deformation of copper and copper alloys

The possibility of using die steels (4Kh3N5М3F and 4Kh4N5М4F2) with adjustable austenitic transformation during operation for a wide range of operating temperatures (below the critical point A1 and above the critical point A3) is shown for hot deformation of M1 copper (up to 630 °С) and МNZh5-1 copper-nickel alloy (900-950 °C) with increased service life. During hot deformation of copper-nickel alloy МNZh5-1, the service life of matrices made of steel with adjustable austenitic transformation 4Kh3N5М3F was increased, compared to steel 3Kh3М3F. The studied forged steel 4Kh4N5М4F2 is characterized by an increase in hardness and strength threshold compared to H13 steel, after the use of extruder wheels (production of more than 60 tons of copper products). In order to facilitate mechanical processing by cutting the work piece during the manufacture of matrices from experimental steels, it was proposed to carry out partial recrystallization, namely, incomplete annealing at a temperature of 750±20 ºС, which made it possible to improve mechanical processing (cutting) for the manufacture of dies and large-sized parts such as wheels extruders.