Interface design and reinforcement mechanisms in carbon nanotube reinforced copper matrix composites for mechanical, electrical and thermal conductivity properties: A review

The ceramic-phase dispersion of La2O3 mediates friction interface architecture in copper matrix composites, enabling tribofilm stabilization under braking conditions

Synergistic influence of processing temperature and TiB2 content on the thermo-mechanical behavior of copper matrix composites

Microstructure and properties of copper matrix composites reinforced by equal amounts of GNPs and CNTs

Overcoming particles refinement and dispersion trade-off dilemmas in casting copper-matrix composites through high-entropy diborides ceramic design

Optimization of the properties of Cu-coated HfCxNy-reinforced copper matrix composites

The continuous demand for advanced composite materials with superior mechanical and electrical properties has driven the exploration of copper matrix composites for high-performance applications. The Cu-2Zr-0.6B (wt.%) powder mixtures were mechanically alloyed (MA) using two different ball-to-powder weight ratios (BPR: 10:1 and 15:1) to investigate the influence of milling conditions on the final composite material's properties. MA powders milled with BPR 15:1 exhibited the highest values of dislocation densities, which induce higher hardness of Cu-ZrB2 bulk materials. The MA powders were consolidated using three different methods: conventional cold pressing followed by sintering (CPS), hot pressing (HP), and spark plasma sintering (SPS). The in situ forming of ZrB2 (3.5 vol.%) reinforcements during consolidation processes in Cu matrix proved to have a major impact on enhancing the hardness and structural stability, while the use of SPS and HP offered superior control over grain growth and porosity reduction compared to CPS. Main findings related to electrical and mechanical properties showed similar values for SPS (~38% IACS, ~173 HV1) and HP compacts (~39% IACS, ~155 HV1) but proved to be much higher compared to values of CPS compacts (~21% IACS, ~80 HV1).

Solid carbon source enables ultrahigh-conductive graphene in copper matrix composite

Enhanced tribological performance of Cu matrix composites reinforced with high-V wear-resistant steel particles by laser cladding-based additive manufacturing

Novel copper–diatomaceous earth (DE) composites containing 5–20 vol.% DE were fabricated by plasma pulse sintering (PPS). Scanning electron microscopy revealed a homogeneous dispersion of DE particles and good interfacial bonding with the copper matrix. Increasing DE content effectively suppressed grain growth in copper, reducing the average grain size from 5.28 μm in pure Cu to 3.68 μm in the composite with 20 vol.% DE. The incorporation of DE led to a pronounced improvement in mechanical performance. Vickers hardness increased from 60.6 HV for pure Cu to 103.4 HV for the 20 vol.% DE composite, representing an enhancement of approximately 70%. Tensile tests showed a significant increase in yield strength, while the ultimate tensile strength remained comparable to that of sintered copper. Owing to the lower density of DE and the composite density following the rule of mixtures, these improvements translate into a substantial increase in specific mechanical properties. Thermophysical properties were also affected by DE addition. The coefficient of thermal expansion decreased slightly with increasing DE content, while thermal conductivity was markedly reduced from 390 to 222 W × m -1 × K -1 , approaching values typical of aluminum. These results demonstrate that diatomaceous earth is a promising, low-cost reinforcement for copper matrix composites, offering reduced weight and tailored mechanical and thermal properties.

Effect of nickel-coated diamond on the thermal conductivity of copper matrix composites

ABSTRACT Melting production plays a pivotal role in the modern copper industry. However, applying this process to fabricate nanocarbon (e.g., graphene, carbon nanotubes)‐reinforced copper matrix composites has remained a long‐standing challenge for nearly 2 decades. In this study, a melting preparation strategy for Graphene–Cu (Gr/Cu) composites was developed by introducing tungsten‐doped graphene (W–Gr) into molten Cu, effectively improving the wettability and density compatibility between graphene (Gr) and molten Cu. The contact angle between W–Gr and molten Cu decreases to 80.4°, while the density of W–Gr increases to 9.5 g cm −3 . W–Gr sheets containing 13 at% and 18 at% tungsten (designated as 13W–Gr and 18W–Gr) disperse uniformly within the Cu matrix. Thermodynamic analysis indicates that W–Gr can spontaneously disperse in molten Cu when the surface area fraction of WC on W–Gr exceeds 45.8%. The ultimate tensile strength (UTS) of 13W–Gr/Cu reaches 152 MPa in the as‐cast state and 449 MPa after cold rolling. The electrical conductivity of 13W–Gr/Cu reaches 100.4% international annealed copper standard (IACS) at 20°C, and is 1.5% higher than that of pure Cu at 180°C. This work overcomes the challenges of fabricating Gr/Cu composites via the melting process, provides a viable approach for their large‐scale industrial production.

MoAlB, a MAB phase, exhibits significant potential as a reinforcement material for copper matrix composites due to its exceptional overall properties. However, its application is limited by the tendency to decompose at elevated temperatures during processing, leading to fragmentation and a reduction in the copper matrix's electrical conductivity. Addressing this challenge, this study successfully prepared two-dimensional (2D) MoAlB nanosheets (NSs) via viscous-solvent-assisted ball milling. Subsequently, these nanosheets were employed as reinforcement to fabricate MoAlB NSs/Cu composites through an impregnation-reduction-sintering route. Characterization of the resulting composite revealed a limited interfacial reaction between the 2D MoAlB NSs and the copper matrix, leading to the formation of a distinctive gradient interface structure. The gradient interface consists of a Cu/MoB atomic-scale composite transition zone and a Mo2AlB2/Cu semicoherent interface. This reaction-limited and robust interface synergistically activates multiple strengthening mechanisms, including significant grain refinement, efficient load transfer, and dislocation strengthening. Moreover, this structure effectively mitigates solute atom electron scattering in the copper matrix by constraining Al atom diffusion to the interfacial regions. Consequently, the 0.5 wt % MoAlB NSs/Cu composite achieved a notable balance of mechanical and electrical properties: a tensile strength of 333.3 MPa, which represents a significant improvement over pure Cu (255.1 MPa) and the 0.5 wt % MoAlB/Cu composite (268 MPa), combined with an elongation of 15.5% and an electrical conductivity of 92.6% IACS. Additionally, the composites demonstrated superior resistance to high-temperature softening, retaining high hardness even after annealing at 900 °C. These findings present a new design strategy for creating next-generation high-performance metal matrix composites.

Abstract This study examines the effects of fiber content, distribution, and interfacial bonding on the thermal, mechanical, and tribological properties of copper matrix composites reinforced with short carbon fibers (C f ), produced via rapid sintering. Uniform composite feedstocks were prepared by mixing gas-atomized pure copper powder with 40 and 60 vol.% copper-coated short carbon fibers using a 3D mixer. The resulting blends were consolidated through the field-assisted sintering technique at temperatures between 900 and 940 °C. Microscopic analysis confirmed a random distribution of the fibers within the matrix and compatible interfacial bonding with the copper. Thermal tests with a dilatometer showed that increasing C f content significantly reduced thermal conductivity and the coefficient of thermal expansion. Tribological tests under low (6 N) and high (20 N) loads demonstrated significantly lower friction coefficients, the lowest 0.2, for the composites compared to pure copper. However, wear rates increased at 20 N under ball-on-disk conditions. This was in contrast to pure copper. The reduced tensile strength of the composites relative to pure copper was attributed to the diminished load-bearing capacity of the short fibers. Pure copper showed shallow localized corrosion pits. In contrast, composites—especially with 60 vol.% C f exhibited— corrosion initiating at the fiber–matrix interface. The lowest corrosion rate was observed at 25 °C.

Nucleation and growth mechanisms of TiB2 particles in copper matrix composites prepared by melt dispersion-turbulent mixing in-situ reaction method

Mechanical and tribological properties of copper matrix composites reinforced with electroless silver-plated coated HfC N particles

Abstract This study investigates Cu/CNTs@Cu composites synthesized by chemical plating and Laser Powder Bed Fusion to improve copper’s mechanical properties. Carbon nanotubes were copper-coated to enhance dispersion and interfacial bonding. Results demonstrated that hardness and density increased with CNT content, peaking at 212.6 HV and 7.64 g/cm 3 , respectively. Tensile strength reached a maximum of 173.23 MPa at 0.3% CNTs. However, excessive CNTs caused agglomeration and porosity, reducing properties. Heat treatment at 950°C resulted in a tensile strength of 160.08 MPa for the optimal composite, indicating partial property recovery. This work highlights the potential of these copper matrix composites for advanced aerospace applications.

Experimental and machine learning-based analysis of wear behaviour in CNT and titanium reinforced copper matrix composites

Bioinspired multi-scale heterogeneous layered structure enhances strength and ductility of copper matrix composites

Achieving deformation coordination and comprehensive performance regulation in copper matrix composites via multiscale modified parallel-connected soft/hard region heterostructure design