Concentrations Of CuSO4 Research Articles

Using Response Surface Methodology in Synthesis of Ultrafine Copper Nanoparticles by Electrolysis

Electrolysis is a method used for producing copper (Cu) nanoparticles at faster rate and at low cost in ambient conditions. The property of Cu nanoparticles prepared by electrolysis depends on their process parameters. The influence of selected process parameters such as copper sulfate (CuSo4) concentration, electrode gap and electrode potential difference on particle size was investigated. To optimize these parameters response surface methodology (RSM) was used. Cu nanoparticles prepared by electrolysis were characterized by using X-ray diffraction (XRD) and scanning electron microscope (SEM). After reviewing the results of analysis of variance (ANOVA), mathematical equation was created and optimized parameters for producing Cu nanoparticles were determined. The results confirm that the average size of Cu particle at the optimum condition was found to be 17[Formula: see text]nm and they are hexagonal in shape.

Growth Mechanism and Application of Nanostructures Fabricated by a Copper Sulfate Solution Containing Boric Acid

In this research, a nanostructured copper surface was fabricated using a CuSO4·5H2O solution containing boric acid. Cu and Cu2O structures simultaneously formed when the electrodeposition was performed using the CuSO4·5H2O solution. The Cu deposition ratio increased when the concentration of CuSO4·5H2O decreased or the applied current density increased. In contrast, the Cu2O deposition ratio increased when the concentration of CuSO4·5H2O increased or the applied current density decreased. A nanoplate-type Cu structure or octahedral Cu2O structure formed when boric acid was added to the CuSO4·5H2O solution. When the concentration of the added boric acid was 2.0 M and the applied current density was above 70 mA/cm2, high-density nanoplates or dendrite structures were formed. In addition, the fabricated samples showed superhydrophobic properties under these conditions after hydrophobic layer coating. The proposed copper electrodeposition methods can be applied to various industrial fields that require metal nanostructures.

ФИТОПРОТЕКТОРНЫЙ ЭФФЕКТ ГУМАТА АММОНИЯ ПРИ ВЫСОКИХ КОНЦЕНТРАЦИЯХ МЕДИ В СРЕДЕ

The influence of ammonium humate obtained from peat on the wheat plant tolerance to high CuSO4 concentrations (100, 250, 500, and 1000 μM/l) was studied. Seeds were germinated on copper sulphate solution with and without the humate. Then the plants were grown on Hoagland’s solution in an artificial climate chamber. The humate protective action coefficient was estimated in two ways, namely: by dry weight changes and by copper ion content in comparison with the plants grown without humate. A protective role of the humate at 100 and 250 μM was established, due to copper accumulation reduction in the plants. At higher concentrations the humate enhanced the toxic effect of copper.

Continuous production of CuO nanoparticles in a rotating packed bed

Copper oxide (CuO) nanoparticles can be prepared by the precipitation method in a rotating packed bed (RPB). The precursors of CuO nanoparticles were firstly prepared in continuous mode by a liquid–liquid reaction of copper sulfate (CuSO4) and sodium carbonate (Na2CO3). A CuSO4 concentration of 0.4mol/L, an Na2CO3 concentration of 0.4mol/L, a rotational speed of 600rpm, and a flow rate of 0.5L/min were used. Then, the precursors were calcined at 500°C for 1h to yield CuO nanoparticles with a crystallite size of 20.1nm, as determined by XRD, and an average size of 27.5nm, as estimated by TEM. The rate of production of CuO nanoparticles was 19.9kg/day. Accordingly, the precipitation method in an RPB has potential for the mass-production of CuO nanoparticles.

Recovery of Copper from Effluents by Cementation on Aluminum in a Multirotating Cylinder-Agitated Vessel

Recovery of copper from synthetic waste solution using cementation technique in a new agitated vessel employing multirotating aluminum cylinders impeller was investigated. Parameters studied are cylinder diameter, rotation speed, initial copper ion concentrations, and effect of surfactants. Solution analysis and scanning electron microscopy were employed to investigate the kinetic and mechanism of the process. The rate of recovery was found to be at its maximum value at the operating conditions of 350 rpm rotation speed, 5000 ppm initial CuSO4 concentration, and 1.2 cm cylinder diameter. All data were correlated by the dimensionless equation: $$ {\text{Sh}} = 1.16 {\text{Sc}}^{0.33} {\text{Re}}^{0.63} \left( {\frac{{d_{\text{c}} }}{L}} \right)^{0.54}, $$ with an average deviation of ±8.5 pct and a standard deviation of 5.88 pct. Presence of nonylphenol ethoxylate surfactant in the solution decreased the rate of recovery by an amount ranging from 2.94 to 38.57 pct depending on the operating conditions. The present geometry gave higher rates of recovery compared to both the single rotating cylinder and rotating disc reactor.

Response of plasma copper, ceruloplasmin, iron and ions in carp, Cyprinus carpio to waterborne copper ion and nanoparticle exposure

In this study, Cyprinus carpio was exposed to 0.25mgL−1 copper as either copper sulfate (CuSO4) or copper oxide nanoparticles (nano-Cu), and 25mgL−1 copper as nano-Cu for 14days. CuSO4 and high concentration of nano-Cu led to a significant increase in plasma total copper levels. Plasma free copper levels increased significantly in all copper-exposed treatments. Except for low concentration of nano-Cu after 7 and 14days, copper exposure generally led to a significant decrease in plasma ceruloplasmin levels. Plasma iron levels increased significantly in CuSO4 (all times) and nano-Cu (7th and 14th days) treatments. A significant elevation in plasma total iron binding capacity (TIBC) was observed after 3days in the fish exposed to low concentration nano-Cu, and after 14days in all copper-exposed treatments. Transferrin saturation (TSA) ratio showed significant increase in CuSO4 (3rd and 7th days) and the high concentration nano-Cu (7th day) treatments. Decrease in plasma chloride (7th and 14th days) and sodium (14th days) was observed in CuSO4 treatment. In conclusion, the results suggest that ionic copper is mainly absorbed via fish gill, whereas, nano-copper are more likely absorbed via gut. Also, data suggest that ionic copper has more adverse effects on the examined plasma biochemical characteristics compared to the equivalent nano-copper concentration, which may be due to the lower copper absorption by fish in the nano-copper suspension.

Direct-Writing of Cu Nano-Patterns with an Electron Beam

We demonstrate direct electron beam writing of a nano-scale Cu pattern on a surface with a thin aqueous layer of CuSO4 solution. Electron beams are highly maneuverable down to nano-scales. Aqueous solutions facilitate a plentiful metal ion supply for practical industrial applications, which may require continued reliable writing of sophisticated patterns. A thin aqueous layer on a surface helps to confine the writing on the surface. For this demonstration, liquid sample holder (K-kit) for transmission electron microscope (TEM) was employed to form a sealed space in a TEM. The aqueous CuSO4 solution inside the sample holder was allowed to partially dry until a uniform thin layer was left on the surface. The electron beam thus reduced Cu ions in the solution to form the desired patterns. Furthermore, the influence of e-beam exposure time and CuSO4(aq) concentration on the Cu reduction was studied in this work. Two growth stages of Cu were shown in the plot of Cu thickness versus e-beam exposure time. The measured Cu reduction rate was found to be proportional to the CuSO4(aq) concentration.

Effect of copper content on the properties of electroless Ni–Cu–P coatings prepared on magnesium alloys

The Ni–Cu–P coatings were obtained by electroless plating method on ZK61M magnesium alloys. The effect of copper content on the properties of electroless Ni–Cu–P coatings on magnesium alloys was further studied. The coatings surface and cross-section morphologies were observed with scanning electron microscope. The crystal structure and corrosion resistance of Ni–Cu–P coatings were evaluated by X-ray diffractometer and electrochemical tests. The experimental results showed that the Ni–Cu–P coatings were uniform and compact, and the corrosion resistance of these coatings was superior to Ni–P coatings owing to the introduction of copper. The crystallinity and compactness of the Ni–Cu–P coatings gradually enhanced with the increasing of copper content in the coatings. The introduction of copper element in the Ni–Cu–P coatings contributes to the formation of passivation film. The Ni–Cu–P coatings with higher corrosion resistance were obtained from the solution with a higher CuSO4 concentration.

Quantitation of Cu+‐catalyzed Decomposition of S‐Nitrosoglutathione Using Saville and Electrochemical Detection: a Pronounced Effect of Glutathione and Copper Concentrations

AbstractS‐nitrosothiols (RSNOs) are composed of nitric oxide (NO) bound to the sulfhydryl group of amino acids of peptides or proteins. There is a great interest for their quantitation in biological fluids as they have a crucial impact on physiological and pathophysiological events. Most analytical methodologies for quantitation of RSNOs are based on their decomposition followed by the detection of the released NO. In order to obtain the optimal sensitivity for each detection method, the total decomposition of RSNOs is highly desired. The decomposition of RSNOs can be obtained by using catalytically active metal ions, such as Cu+, obtained from CuSO4 in presence of a reducing agent such as glutathione (GSH) that is naturally present in biological environment. In this work, we have re‐investigated the decomposition of S‐nitrosoglutathione (GSNO) which is the most abundant in vivo low molecular weight RSNO, with a special emphasis on the effect of CuSO4, GSH, and GSNO concentrations and of their ratio. To this aim, GSNO decomposition optimization was performed by both indirect (Griess assay) and direct (real time electrochemical detection of NO at NO‐microsensor) quantitation methods. Our results show that the ratio between CuSO4, GSH and GSNO should be adjusted to tune the highest decomposition rate of GSNO and the most efficient electrochemical detection of released NO; also it shows the deleterious effect of very high GSH concentration on the detection of GSNO.

Influence of the indium nominal concentration in the formation of CuInS2 films grown by CBD

Copper indium disulfide (CuInS2) thin films were prepared by chemical bath deposition in an acid medium on glass substrates. CuInS2 films were grown using CuSO4, InCl3 and C2H5NS as copper, indium and sulfur sources, respectively. The CuSO4 and C2H5NS concentrations remained constant, while the InCl3 concentration was varied from 0.002M to 0.025M. The structural analysis show that initially the films have a mixture of CuS and CuInS2 phases, when the indium nominal concentration increases the formation of CuInS2 ternary compound was promoted until the final formation of a CuInS2 film. The morphological study shows that the surface of CuInS2 films is constituted by nanotubes. The structural and compositional analysis show that for 0.025M InCl3 concentration CuInS2 films were obtained.

Biomass reduction of Salvinia molesta exposed to copper sulfate pentahydrate (CuSO4.5H2O)

Copper in the aquatic ecosystem may remain adsorbed or be incorporated into the biomass and undergo biomagnification causing unwanted effects to aquatic macrophyte communities. This study evaluated the biomass reduction of Salvinia molesta (Mitchell) exposed to copper sulphate pentahydrate (CuSO4.5H2O) under laboratory conditions. Approximately 20.5 g of fresh mass (FM) of S. molesta (0.74 g dry matter, DM) were placed in glass tanks with different concentrations (n = 3) of CuSO4.5H2O as follows: 0.0; 2.0; 4.0; 6.0; and 8.0 mg L-1 for 28 days. The dry mass was determined after each seven-day interval over 28 days and submitted to repeated ANOVA measures, followed by a Tukey test (P

Investigation of electroless copper plating on polyurethane foam, as an initial step of open cell foam production process

Coating of polymeric foams is known as a method for production of metallic foams, which produces foams with high volume of porosity and controllable pore size. In this research, this method was employed to produce open cell copper foam by use of polyurethane foam with an average pore size of 0.4 mm as the substrate. Since polyurethane foam as a non-conductive material is not able to be coated directly by electrolytic deposition, the substrate was initially metallised by electroless copper plating. In the electroless plating process, the effects of the main parameters such as bath chemical composition, solution pH and temperature on deposition rate and thickness of the coatings obtained were investigated. The results showed that the optimum condition of the process is obtained when CuSO4 concentration in the deposition bath is 12 g L− 1, pH is 13 and plating temperature range is 55–60°C.

Optimization of copper electroplating process applied for microfabrication on flexible polyethylene terephthalate substrate

Electroplating is an important step in microfabrication in order to increase thickness of undersized parts up to a few micrometers with a low-cost, fast method that is easy to carry out, especially for metals such as copper, nickel, and silver. This important step promotes the development of the fabrication technology of electronic devices on a flexible substrate, also known as flexible electronic devices. Nevertheless, this technology has some disadvantages such as low surface uniformity and high resistivity. In this paper, parameters of copper electroplating were studied, such as the ratio of copper (II) sulfate (CuSO4) concentration to sulfuric acid (H2SO4) concentration and electroplating current density, in order to obtain low resistivity and high surface uniformity of the copper layer. Samples were characterized by scanning electron microscopy (SEM), four-point probe, and surface profiler. The results showed that the sample resistivity could be controlled from about 2.0 to about 3.5 μΩ · cm, and the lowest obtained resistivity was 1.899 μΩ · cm. In addition, surface uniformity of the electroplated copper layer was also acceptable. The thickness of the copper layer was about 10 μm with an error of about 0.5 μm. The most suitable conditions for the electroplating process were CuSO4 concentration of 0.4 mol l−1, H2SO4 concentration of 1.0 mol l−1, and low electroplating current density of 10–20 mA cm−2. All experiments were performed on a flexible polyethylene terephthalate (PET) substrate.

Conduction type of nonstoichiometric alloy semiconductor CuxZnyS deposited by the photochemical deposition method

CuxZnyS films with low Cu content were deposited by photochemical deposition, and the relation between conduction type and Cu content was investigated. The deposition solution for CuxZnyS was similar to that for ZnS (1mM ZnSO4, 600mM Na2S2O3, and 3mM Na2SO3), with the addition of CuSO4. The substrate was held 2–3mm below the solution surface and irradiated with an Hg-arc lamp. The films were transparent in the visible range and had a band gap of about 3.6–3.8eV. The composition was evaluated by Auger electron spectroscopy (AES), and the conduction type was determined by photoelectrochemical (PEC) measurements. Clear p-type signals were observed in the PEC measurements for CuSO4 concentrations higher than 0.3mM, whereas n-type conduction was observed for CuSO4 concentrations lower than 0.05mM. The critical Cu content in the film at the transition of the conduction type was below the detection limit of AES and thus was estimated by extrapolating the results for higher CuSO4 concentrations. We estimated that the conduction type changed around a Cu content of 0.5%–1% in this alloy system.

Chemical reagents with Cyclobalanopsis glauca container seedlings

In order to understand the effects of different chemical reagents on the growth of Cyclobalanopsis glauca container seedlings, the chemical root control concentrations of CuSO4 40, 80, 140, 220 gL－1, ZnSO4 40, 80, 140, 220 gL－1, Al2（SO4）3 40, 80, 140, 220 gL－1, and 2,6-Dinitro-N,N-dipropyl-4-（trifluoromethyl）aniline 0.04, 0.08, 0.14, 0.22 gL－1 were mixed with emulsion varnish and then coated on the inner wall of root control bags. These were compared to a treatment where the inner wall was coated on only with emulsion varnish. Then the effect of the chemical reagents on root configuration indexes, root activity, height, base diameter, biomass accumulation, and quality index of four-year-old Cyclobalanopsis glauca container seedlings were analyzed. Results showed that: （1） reagents of CuSO4, ZnSO4 and Al2（SO4）3 in the range of 0－140 gL－1 as well as 2,6-dinitro-N,N-dipropyl-4-（trifluoromethyl） aniline in the range of 0－0.22 gL－1 regulated root growth and development of C. glauca, but reagent of 220 gL－1 ZnSO4had a negative effect on seedlings. （2） Root tips, volume, surface area, projected area, forks, and activity, as well as plant height, basal diameter, shoot dry weight, root dry weight and quality index treated with 140 gL－1 CuSO4 reagent significantly increased （P＜0.05）, whereas root average diameter and length of taproot significantly decreased （P＜0.05）. Seedlings treated with different chemical reagents showed improved root controling with the best treatment being 140 gL－1 ZnSO4. ［Ch, 4 fig. 2 tab. 15 ref.］

Comparative evaluation of nano-CuO crossing Caco-2 cell monolayers and cellular uptake

Different concentrations of CuSO4, micro-CuO, and nano-CuO were added to Caco-2 cell monolayers to study the absorption and transport characteristics in this epithelial cell model. Nano-CuO nanoparticles had a diameter of 10–20 nm. Inhibitors of endocytosis were used to explore whether nano-CuO could enter the Caco-2 cell in the form of nanoparticles, and to ascertain the endocytotic pathway that is involved in the transport process. The apparent permeability coefficient (Papp) of CuSO4 and nano-CuO increased with the Cu concentration in the culture medium (p 0.05). When the Cu concentration in the culture medium was in the range 31.25–500 μM, the Papp value of Caco-2 cells incubated with nano-CuO was significantly higher than that obtained with CuSO4. The latter was also significantly higher than that when cells were incubated with micro-CuO (p < 0.05). The amount of Cu transport increased with the increase of CuSO4 concentration in the culture medium. After 90 min, the amount of transport began to saturate, and the transport rate of Cu declined with the increase of CuSO4 concentration. For the cells incubated with nano-CuO, the amount of Cu transport increased with the increase of nano-CuO concentration, but did not show an obvious saturation with the extension of transport time. Nano-CuO could enter the Caco-2 cell in the form of nanoparticles, and were found in the cytoplasm, vesicles, lysosomes, and cell nuclei. Several inhibitors of endocytosis effectively prevented the entry of nano-CuO into the Caco-2 cells. It was concluded that nano-CuO particles can enter the Caco-2 cells through several cellular endocytotic pathways.

A novel high-performance electrode: in-situ growth of copper sulfide film on copper foil for the application of supercapacitor

Copper sulfide (CuS) microspheres were directly grown on a copper foil via the redox reaction between CuSO4 and Na2S2O3. The morphology of the CuS film was observed by SEM and TEM, while the crystalline and structure were revealed by XRD pattern and UV spectrum. The electrochemical properties of the CuS electrodes were investigated by the cyclic voltammetry, galvanostatic charge–discharge and cycle stability technologies in 1 mol L−1 KCl electrolyte. The dependence of the concentration of CuSO4 and Na2S2O3 and reaction time on the properties of CuS films was discussed in detail. By means of these above comparisons, the CuS electrode that was obtained in 0.1 mol L−1 reactants concentration and 18 h reaction time possessed the homogeneous morphology, excellent electrochemical properties and good energy storage capacity. The specific capacitance was as high as 1443 F g−1 at a discharge density of 1 A g−1 and remained 1098 F g−1 after 2500 circles in the cycle life test.

CHANGES IN TURKEY SPERMATOZOZA MOTILITY PARAMETERS AFTER ADDITION OF COPPER SULPHATE IN VITRO

Copper as essential trace element is obligatory in many biological processes. Nevertheless higher concentrations of this metal are highly toxic for organisms at different levels and of course for spermatozoa. The aim of present work was to examine impact of copper sulphate on turkey spermatozoa motility parameters (line Big 6) during in vitro incubation at 41°C. Four concentration of CuSO4: M1 – 6.25 μg.ml-1; M2 – 12.5 μg.ml-1; M3 – 25.0 μg.ml-1; M4 – 50.0 μg.ml-1 were investigated. The motility parameters were evaluated using the Computer Assisted Semen Analyzer system (program Sperm Vision®) at four time periods: 0, 30, 60 and 90 minutes. Immediately at the beginning of incubation significantly lower values of progressive motility were detected in samples M3 (p

Distribution and chemical forms of copper in the root cells of castor seedlings and their tolerance to copper phytotoxicity in hydroponic culture

The subcellular localization and chemical forms of copper in castor (Ricinus communis L.) seedlings grown in hydroponic nutrient solution were identified by chemical extraction, transmission electron microscopy, and Fourier transform infrared spectroscopy. The wild castor seeds were harvested from an abandoned copper mine in Tonglu Mountain, Daye City of Hubei Province, China. The results revealed that (1) the seedlings grew naturally in MS liquid medium with 40.00 mg kg(-1) CuSO4, in which the seedling growth rate and biomass index were 0.14 and 1.23, respectively, which were the highest values among all the treatments. The copper content in castor seedlings increased along with elevated CuSO4 concentration in the medium, reaching a maximum value of 16 570.12 mg kg(-1)(DW) when exposed to 60.00 mg L(-1) CuSO4, where 91.31% of the copper was accumulated in roots. (2) The copper existed in various chemical forms in the roots of the castor seedlings. Copper of 67.66% was extracted from the components of cell walls, such as exchangeable acidic polar compounds, cellulose and lignin, protein and pectin, and less concentrated in cell cytoplasm and nuclei. (3) Furthermore, the root cell walls were thickened when the castor seedlings exposed to CuSO4, with a large amount of high-density electron bodies, attached to the thickened cell walls. In the cell walls, most copper was bound to the carboxyl (-COOH) and hydroxyl (-OH) groups of acidic polar compounds, cellulose, hemicellulose, and polysaccharides. The conclusion showed that castor exhibited a strong tolerance to copper, the copper were accumulated mainly in the root cell, the root cell walls of castor were the major location of patience and detoxification in copper stress.

Micro-Structure, Ac Conductivity and Spectroscopic Studies of Cupric Sulphate Doped PVA/PVP Polymer Composites

A series of polyvinyl alcohol/polyvinyl pyrrolidone polymer composite films doped with different amount of cupric sulphate (CuSO4) were prepared by means of solution casting technique. These films were characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), Ultraviolet-Visible absorbance spectroscopy (UV-Vis) and Ac conductivity measurement studies. XRD patterns of these films recorded at room temperature show the increase in amorphousity of the matrix with the increase in the concentration of CuSO4 in polymer composites. Microstructural parameters were computed using an in-house program employing XRD data. Recorded FT-IR spectra give information about the stretching and bending of the characteristic absorption bands in these films. The variation in the transmittance has been studied with the help of recorded UV-Vis spectra and hence the optical band gap present in the samples is also calculated. The measured Ac conductivity shows how the conductivity varies in these films with the presence of different amount of CuSO4 in these films.