Fourier Transform Infrared Spectroscopy In Combination Research Articles

Depth-profiling analysis of polyimide films on copper substrates

In understanding the degradation of polyimide films on copper substrates at elevated temperatures, it is important to know where in the film degradation is initiated. This study uses Fourier-transform infra-red spectroscopy in combination with a chemical depth-profiling technique to investigate the interaction of various layers of a polyimide film cast on a copper substrate. The films will be analysed under as-cast, partially cured and severely degraded conditions.