Charge Summing Mode Research Articles

Anomalous edge response of cadmium telluride-based photon counting detectors jointly caused by high-flux radiation and inter-pixel communication

This work reports an edge enhancing effect experimentally observed in cadmium telluride (CdTe)-based photon counting detector (PCD) systems operated under the charge summing (CS) mode and irradiated by high-flux x-rays. Experimental measurements of the edge spread functions (ESFs) of a PCD system (100 μm pixel size, 88 ns deadtime) were performed at different input flux levels from 4.5 × 105 count per second (cps) mm−2 to 1.5 × 109 cps mm−2 for the single pixel mode (SP) and the CS mode. A theoretical model that incorporates the impacts of inter-pixel communications and the arbitration process involved in the CS mode was developed to help explain the physical origin of the observed edge enhancing effect. Compared with the monotonically increasing ESF of the SP mode, the ESF of the CS mode measured at high-flux levels shows a peak at an intermediate location (50 μm from the edge). The peak became more pronounced with increasing flux levels. The theoretically calculated ESFs agreed well with experimental results with relative errors less than 5% at all flux levels and tested. These results indicate that the anomalous edge enhancing effect is jointly caused by the pileup effect and the CS circuit that introduces negative correlations between adjacent pixels. When the input flux is high enough to deliver photons to multiple adjacent pixels within the same deadtime period, the CS mode may treat the coincident x-rays as shared charges and thus introduce count losses in addition to the well-known pileup count loss. When a high contrast object partially blocks certain pixels from x-rays, the adjacent unblocked pixels have an increased probability of registering counts as a result of the negative correlation. This leads to a peak on the ESF at a pixel-to-edge distance half of the pixel pitch.

Sub-100 nanosecond temporally resolved imaging with the Medipix3 direct electron detector

Detector developments are currently enabling new capabilities in the field of transmission electron microscopy (TEM). We have investigated the limits of a hybrid pixel detector, Medipix3, to record dynamic, time varying, electron signals. Operating with an energy of 60 keV, we have utilised electrostatic deflection to oscillate electron beam position on the detector. Adopting a pump-probe imaging strategy, we have demonstrated that temporal resolutions three orders of magnitude smaller than are available for typically used TEM imaging detectors are possible. Our experiments have shown that energy deposition of the primary electrons in the hybrid pixel detector limits the overall temporal resolution. Through adjustment of user specifiable thresholds or the use of charge summing mode, we have obtained images composed from summing 10,000s frames containing single electron events to achieve temporal resolution less than 100 ns. We propose that this capability can be directly applied to studying repeatable material dynamic processes but also to implement low-dose imaging schemes in scanning transmission electron microscopy.

Spatio-energetic cross-talk in photon counting detectors: Numerical detector model (PcTK) and workflow for CT image quality assessment.

The interpixel cross-talk of energy-sensitive photon counting x-ray detectors (PCDs) has been studied and an analytical model (version 2.1) has been developed for double-counting between neighboring pixels due to charge sharing and K-shell fluorescence x-ray emission followed by its reabsorption (Taguchi K, etal., Medical Physics 2016;43(12):6386-6404). While the model version 2.1 simulated the spectral degradation well, it had the following problems that has been found to be significant recently: (1) The spectrum is inaccurate with smaller pixel sizes; (2) the charge cloud sizemust be smaller than the pixel size; (3) the model underestimates the spectrum/counts for 10-40keV; and (4) the model version 2.1 cannot handlen-tuple-counting withn>2 (i.e., triple-counting or higher). These problems are inherent to the design of the model version 2.1; therefore, we developed a new model and addressed these problems in this study. We propose a new PCD cross-talk model (version 3.2; Pc TK for "photon counting toolkit") that is based on a completely different design concept from the previous version. It uses a numerical approach and starts with a 2-D model of charge sharing (as opposed to an analytical approach and a 1-D model with version 2.1) and addresses all of the four problems. The model takes the following factors into account: (1) shift-variant electron density of the charge cloud (Gaussian-distributed), (2) detection efficiency, (3) interactions between photons and PCDs via photoelectric effect, and (4) electronic noise. Correlated noisy PCD data can be generated using either a multivariate normal random number generator or a Poisson random number generator. The effect of the two parameters, the effective charge cloud diameter (d0 ) and pixel size (dpix ), was studied and results were compared with Monte Carlo simulations and the previous model version 2.1. Finally, a script for the workflow for CT image quality assessment has been developed, which started with a few material density images, generated material-specific sinogram (line integrals) data, noisy PCD data with spectral distortion using the model version 3.2, and reconstructed PCD- CT images for four energy windows. The model version 3.2 addressed all of the four problems listed above. The spectra withdpix =56-113μm agreed with that of Medipix3 detector withdpix =55-110μm without charge summing mode qualitatively. The counts for 10-40keV were larger than the previous model (version 2.1) and agreed with MC simulations very well (root-mean-square difference values with model version 3.2 were decreased to 16%-67% of the values with version 2.1). There were many non-zero off-diagonal elements withn-tuple-counting withn>2 in the normalized covariance matrix of 3×3 neighboring pixels. Reconstructed images showed biases and artifacts attributed to the spectral distortion due to the charge sharing and fluorescence x rays. We have developed a new PCD model for spatio-energetic cross-talk and correlation between PCD pixels. The workflow demonstrated the utility of the model for general or task-specific image quality assessments for the PCD- CT.Note: The program (Pc TK) and the workflow scripts have been made available to academic researchers. Interested readers should visit the website (pctk.jhu.edu) or contact the corresponding author.

Characterisation of the Medipix3 detector for 60 and 80 keV electrons

In this paper we report quantitative measurements of the imaging performance for the current generation of hybrid pixel detector, Medipix3, used as a direct electron detector. We have measured the modulation transfer function and detective quantum efficiency at beam energies of 60 and 80keV. In single pixel mode, energy threshold values can be chosen to maximize either the modulation transfer function or the detective quantum efficiency, obtaining values near to, or exceeding those for a theoretical detector with square pixels. The Medipix3 charge summing mode delivers simultaneous, high values of both modulation transfer function and detective quantum efficiency. We have also characterized the detector response to single electron events and describe an empirical model that predicts the detector modulation transfer function and detective quantum efficiency based on energy threshold. Exemplifying our findings we demonstrate the Medipix3 imaging performance recording a fully exposed electron diffraction pattern at 24-bit depth together with images in single pixel and charge summing modes. Our findings highlight that for transmission electron microscopy performed at low energies (energies <100keV) thick hybrid pixel detectors provide an advantageous architecture for direct electron imaging.

Validation of Geant4 Pixel Detector Simulation Framework by Measurements With the Medipix Family Detectors

Monte Carlo simulations are an extensively used tool for developing and understanding radiation detector systems. In this work, we used results of several chips and readout modes of the Medipix detector family to validate a Geant4 based pixel detector framework, developed in our group, that is capable of simulating particle tracking, charge transport in the sensor material and different readout schemes. We experimentally verified the simulation with different detector geometries in terms of pixel pitch and size as well as sensor material and sensor thickness. The single pixel mode (SPM) and charge summing mode (CSM) in Medipix3 were evaluated with fluorescence and synchrotron radiation. The integration of the charge sensitive amplifier functionality in the simulation framework allowed to simulate the time-over-threshold mode of the Timepix chip. Simulation and measurement have been compared in terms of spectral resolution using threshold scans in photon counting mode (Medipix3) and time over threshold mode (Timepix). Further comparisons were done using X-ray tube spectra and beta decay to cover a broad energy range. Additionally, TCAD simulations are performed as a comparison to a well-established simulation method. The results show good agreement between simulation and measurement.

Medipix3RX: Characterizing the Medipix3 Redesign With Synchrotron Radiation

The Medipix3RX is the latest version of the Medipix3 photon counting ASICs, which implements two new operational modes, with respect to the Medipix2 ASIC, aimed at eliminating charge shared events (referred to as Charge Summing Mode (CSM)) and at providing spectroscopic information (referred to as Colour Mode (CM)). The Medipix3RX is a redesign of the Medipix3v0 ASIC and corrects for the underperformance of CSM features observed in the previous version. This paper presents the results from synchrotron X-rays tests to evaluate the Medipix3RX ASIC performance. The newly implemented CSM algorithm eliminates the charge sharing effect at the same time as allocating the event to the readout pixel corresponding to the sensor pixel where the X-ray photon impinged. The new pixel trimming circuit led to a reduced dispersion between pixels. Further results of the linearity for all the gain modes, energy resolution and pixel uniformity are also presented.

How spectroscopic x-ray imaging benefits from inter-pixel communication

Spectroscopic x-ray imaging based on pixellated semiconductor detectors can be sensitive to charge sharing and K-fluorescence, depending on the sensor material used, its thickness and the pixel pitch employed. As a consequence, spectroscopic resolution is partially lost. In this paper, we study a new detector ASIC, the Medipix3RX, that offers a novel feature called charge summing, which is established by making adjacent pixels communicate with each other. Consequently, single photon interactions resulting in multiple hits are almost completely avoided. We investigate this charge summing mode with respect to those of its imaging properties that are of interest in medical physics and benchmark them against the case without charge summing. In particular, we review its influence on spectroscopic resolution and find that the low energy bias normally present when recording energy spectra is dramatically reduced. Furthermore, we show that charge summing provides a modulation transfer function which is almost independent of the energy threshold setting, which is in contrast to approaches common so far. We demonstrate that this property is directly linked to the detective quantum efficiency, which is found to increase by a factor of three or more when the energy threshold approaches the photon energy and when using charge summing. As a consequence, the contrast-to-noise ratio is found to double at elevated threshold levels and the dynamic range increases for a given counter depth. All these effects are shown to lead to an improved ability to perform material discrimination in spectroscopic CT, using iodine and gadolinium contrast agents. Hence, when compared to conventional photon counting detectors, these benefits carry the potential of substantially reducing the imaging dose a patient is exposed to during diagnostic CT examinations.

Performance of a Medipix3RX spectroscopic pixel detector with a high resistivity gallium arsenide sensor.

High resistivity gallium arsenide is considered a suitable sensor material for spectroscopic X-ray imaging detectors. These sensors typically have thicknesses between a few hundred μm and 1 mm to ensure a high photon detection efficiency. However, for small pixel sizes down to several tens of μm, an effect called charge sharing reduces a detector's spectroscopic performance. The recently developed Medipix3RX readout chip overcomes this limitation by implementing a charge summing circuit, which allows the reconstruction of the full energy information of a photon interaction in a single pixel. In this work, we present the characterization of the first Medipix3RX detector assembly with a 500 μm thick high resistivity, chromium compensated gallium arsenide sensor. We analyze its properties and demonstrate the functionality of the charge summing mode by means of energy response functions recorded at a synchrotron. Furthermore, the imaging properties of the detector, in terms of its modulation transfer functions and signal-to-noise ratios, are investigated. After more than one decade of attempts to establish gallium arsenide as a sensor material for photon counting detectors, our results represent a breakthrough in obtaining detector-grade material. The sensor we introduce is therefore suitable for high resolution X-ray imaging applications.

Reducing beam hardening effects and metal artefacts in spectral CT using Medipix3RX

This paper discusses methods for reducing beam hardening effects and metal artefacts using spectral x-ray information in biomaterial samples. A small-animal spectral scanner was operated in the 15 to 80 keV x-ray energy range for this study. We use the photon-processing features of a CdTe-Medipix3RX ASIC in charge summing mode to reduce beam hardening and associated artefacts. We present spectral data collected for metal alloy samples, its analysis using algebraic 3D reconstruction software and volume visualisation using a custom volume rendering software. The cupping effect and streak artefacts are quantified in the spectral datasets. The results show reduction in beam hardening effects and metal artefacts in the narrow high energy range acquired using the spectroscopic detector. A post-reconstruction comparison between CdTe-Medipix3RX and Si-Medipix3.1 is discussed. The raw data and processed data are made available (http://hdl.handle.net/10092/8851) for testing with other software routines.

Charge Summing in Spectroscopic X-Ray Detectors With High-Z Sensors

The spectroscopic performance of photon counting detectors is limited by the effects of charge sharing between neighboring pixels and the emission of characteristic X-rays. For these reasons, an event can be either missed or counted more than once. These effects become more and more of a concern when pixel pitches are reduced, and for the technology available so far, this meant that there would always be a trade-off between a high spatial and a high spectral resolution. In this work, we present first measurements obtained with the new Medipix3RX ASIC, which features a network of charge summing circuits establishing a communication between pixels which helps to mitigate these effects. Combined with cadmium telluride sensors, we show that this new technology is successful at improving a detector's spectroscopic capabilities even at pixel pitches as small as 55 μm. At this pitch, we measure an energy response function similar to that observed for a pixel pitch of 165 μm in the absence of a charge summing circuitry. This amounts to an effective reduction of the pixel area by at least one order of magnitude at a comparable energy response. Additionally, we present synchrotron measurements at high X-ray fluxes, where significant pulse pile-up occurs, and provide first experimental evidence for a net benefit when balancing spectroscopic performance and high flux tolerance in charge summing mode.

The Medipix3RX: a high resolution, zero dead-time pixel detectorreadout chip allowing spectroscopic imaging

The Medipix3 chips have been designed to permit spectroscopic imaging in highly segmented hybrid pixel detectors. Spectral degradation due to charge sharing in the sensor has been addressed by means of an architecture in which adjacent pixels communicate in the analog and digital domains on an event-by-event basis to reconstruct the deposited charge in a neighbourhood prior to the assignation of the hit to a single pixel. The Medipix3RX chip architecture is presented. The first results for the characterization of the chip with 300 μm thick Si sensors are given. ∼ 72e− r.m.s. noise and ∼ 40e− r.m.s. of threshold dispersion after chip equalization have been measured in Single Pixel Mode of operation. The homogeneity of the image in Charge Summing mode is comparable to the Single Pixel Mode image. This demonstrates both modes are suitable for X-ray imaging applications.

Spectrum measurement using Medipix3 in Charge Summing Mode

We have obtained first spectrum measurements on a Medipix3 detector with a cadmium telluride (CdTe) sensor using Charge Summing Mode (CSM). It will be shown that CSM in Medipix3 is capable of reducing theadverse effects of charge sharing and fluorescent x-rays of CdTe onthe spectra recorded. The development of the Medipix All ResolutionSystem (MARS) x-ray camera has allowed us to explore this novel pixelcommunication feature in Medipix3. Spectrum measurements in this workwere carried out using a MARS camera consisting of a Medipix3 chipbump-bonded to a 1mm thick CdTe sensor layer. The characteristicpeaks of the Am-241 source as well as the spectroscopic properties ofthe CdTe sensor material were depicted at a spatial resolution of 55μm. Furthermore, a "connected component" algorithm shows a siliconbased Medipix3 is effective in reallocating spread charge into asingle pixel.

The detector simulation toolkit HORUS

In recent years, X-ray detectors used and developed at synchrotron sources and Free Electron Lasers (FELs) have become increasing powerful and versatile. However, as the capabilities of modern X-ray cameras grew so did their complexity and therefore their response functions are far from trivial. Since understanding the detecting system and its behavior is vital for any physical experiment, the need for dedicated powerful simulation tools arose.The HPAD Output Response fUnction Simulator (HORUS) was originally developed to analyze the performance implications of certain design choices for the Adaptive Gain Integrating Pixel Detector (AGIPD) and over the years grew to a more universal detector simulation toolkit covering the relevant physics in the energy range from below 1 keV to a few hundred keV. HORUS has already been used to study possible improvements of the AGIPD for X-ray Photon Correlation Spectroscopy (XPCS) at the European XFEL and its performance at low beam energies. It is currently being used to study the optimum detector layout for Coherent Diffration Imaging (CDI) at the European XFEL. Simulations of the charge summing mode of the Medipix3 chip have been essential for the improvements of the charge summing mode in the Medipix3 RX chip. HORUS is universal enough to support arbitrary hybrid pixel detector systems (within limitations). To date, the following detector systems are predefined within HORUS: The AGIPD, the Large Pixel Detector (LPD), the Cornell-Stanford Pixel Array Detector (CSPAD), the Mixed-Mode (MMPAD) and KEKPAD, and the Medipix2, Medipix3 and Medipix3 RX chips.

Characterization of Medipix3 With Synchrotron Radiation

Medipix3 is the latest generation of photon counting readout chips of the Medipix family. With the same dimensions as Medipix2 (256 × 256 pixels of 55 μm × 55 μm pitch each), Medipix3 is however implemented in an 8-layer metallization 0.13 μm CMOS technology which leads to an increase in the functionality associated with each pixel over Medipix2. One of the new operational modes implemented in the front-end architecture is the Charge Summing Mode (CSM). This mode consists of a charge reconstruction and hit allocation algorithm which eliminates event-by-event the low energy counts produced by charge-shared events between adjacent pixels. The present work focuses on the study of the CSM mode and compares it to the Single Pixel Mode (SPM) which is the conventional readout method for these kind of detectors and it is also implemented in Medipix3. Tests of a Medipix3 chip bump-bonded to a 300 μm thick silicon photodiode sensor were performed at the Diamond Light Source synchrotron to evaluate the performance of the new Medipix chip. Studies showed that when Medipix3 is operated in CSM mode, it generates a single count per detected event and consequently the charge sharing effect between adjacent pixels is eliminated. However in CSM mode, it was also observed that an incorrect allocation of X-rays counts in the pixels occurred due to an unexpectedly high pixel-to-pixel threshold variation. The present experiment helped to better understand the CSM operating mode and to redesign the Medipix3 to overcome this pixel-to-pixel mismatch.

Study of charge-sharing in MEDIPIX3 using a micro-focused synchrotron beam

X-ray photon-counting detectors consisting of a silicon pixel array sensor bump-bonded to a CMOS electronic readout chip offer several advantages over traditional X-ray detection technologies used for synchrotron applications. They offer high frame rate, dynamic range, count rate capability and signal-to-noise ratio. A survey of the requirements for future synchrotron detectors carried out at the Diamond Light Source synchrotron highlighted the needs for detectors with a pixel size of the order of 50μm. Reducing the pixel size leads to an increase of charge-sharing events between adjacent pixels and, therefore, to a degradation of the energy resolution and image quality of the detector. This effect was observed with MEDIPIX2, a photon-counting readout chip with a pixel size of 55μm. The lastest generation of the MEDIPIX family, MEDIPIX3, is designed to overcome this charge-sharing effect in an implemented readout operating mode referred to as Charge Summing Mode. MEDIPIX3 has the same pixel size as MEDIPIX2, but it is implemented in an 8-metal 0.13μm CMOS technology which enables increased functionality per pixel. The present work focuses on the study of the charge-sharing effect when the MEDIPIX3 is operated in Charge Summing Mode compared to the conventional readout mode, referred to as Single Pixel Mode. Tests of a standard silicon photodiode array bump-bonded to MEDIPIX3 were performed in beamline B16 at the Diamond Light Source synchrotron. A monochromatic micro-focused beam of 2.9μm x 2.2μm size at 15keV was used to scan a cluster of nine pixels in order to study the charge collection and X-ray count allocation process for each readout mode, Single Pixel Mode and Charge Summing Mode. The study showed that charge-shared events were eliminated when Medipix3 was operated in Charge Summing Mode.

First CT using Medipix3 and the MARS-CT-3 spectral scanner

The MARS research group has created a new version of their scanner for taking improved spectral CT datasets. This version of the scanner (MARS-CT-3) has taken the first Medipix3 CT images of a phantom. MARS-CT-3 incorporates a new gantry, new x-ray sources and the new MARS readout board, as well as the ability to connect gas lines to the specimen. The new gantry has improved mechanical rigidity and can perform scans faster. Magnification can be controlled by moving the detector and the x-ray source independently. The brighter x-ray source means images can be taken six times faster. Gas lines allow the user to control various environmental factors inside the scanner, such as temperature, or deliver oxygen and anaesthetics, providing the ability to do a full spectroscopic CT scan of a live sedated biological specimen, such as a mouse. The new MARS readout is able to read from all current chips from the Medipix family, has faster image downloading, and the use of up to six Medipix detectors in parallel on the same chip carrier. The use of Medipix3 chips allows for compensation of charge sharing via Charge Summing Mode.

Characterization of the Medipix3 pixel readout chip

The Medipix3 chip is a hybrid pixel detector readout chip working in Single Photon Counting Mode. It has been developed with a new front-end architecture aimed at eliminating the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. In the new architecture charge deposited in overlapping clusters of four pixels is summed event-by-event and the incoming quantum is assigned as a single hit to the summing circuit with the biggest charge deposit (this mode of operation is called Charge Summing Mode (CSM)). In Single Pixel Mode (SPM) the charge reconstruction and the communication between neighbouring pixels is disabled. This is the operating mode in traditional detector systems.This paper presents the results of the characterization of the chip with electrical stimuli and radioactive sources.

A modified spectrum reconstruction method for the Charge Summing Mode of Medipix3

Because of its spectral capabilities, the MEDIPIX2 [2] detector has been used to determine the spectrum of an X-ray tube [1]. The measured spectrum is smeared out in the detector due to charge sharing among pixels. Therefore, a deconvolution method has been applied to reconstruct the real spectrum. The Medipix3 [3], as successor of the Medipix2, will be able reduce the influence of charge sharing in real time. Based on simulations, the aim of this paper is to investigate how good one will be able to determine an incoming X-ray spectrum with the Medipix3.

Medipix3: A 64 k pixel detector readout chip working in single photon counting mode with improved spectrometric performance

Medipix3 is a 256×256 channel hybrid pixel detector readout chip working in a single photon counting mode with a new inter-pixel architecture, which aims to improve the energy resolution in pixelated detectors by mitigating the effects of charge sharing between channels. Charges are summed in all 2×2 pixel clusters on the chip and a given hit is allocated locally to the pixel summing circuit with the biggest total charge on an event-by-event basis. Each pixel contains also two 12-bit binary counters with programmable depth and overflow control. The chip is configurable such that either the dimensions of each detector pixel match those of one readout pixel or detector pixels are four times greater in area than the readout pixels. In the latter case, event-by-event summing is still possible between the larger pixels. Each pixel has around 1600 transistors and the analog static power consumption is below 15 μW in the charge summing mode and 9 μW in the single pixel mode. The chip has been built in an 8-metal 0.13 μm CMOS technology. This paper describes the chip from the pixel to the periphery and first electrical results are summarized.

The Medipix3 Prototype, a Pixel Readout Chip Working in Single Photon Counting Mode With Improved Spectrometric Performance

A prototype pixel detector readout chip has been developed with a new front-end architecture aimed at eliminating the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. In the new architecture neighbouring pixels communicate with one another. At the corner of each pixel summing circuits add the total charge deposited in each sub-group of 4 pixels. Arbitration logic assigns a hit to the summing circuit with the highest charge. In the case where incoming X-ray photons produce fluorescence-a particular issue in high-Z materials-the charge deposited by those fluorescent photons will be included in the charge sum provided that the deposition takes place within the volume of the pixels neighbouring the initial impact point. The chip is configurable such that either the dimensions of each detector pixel match those of one readout pixel or detector pixels are 4 times greater in area than the readout pixels. In the latter case event-by-event summing is still possible between the larger pixels. As well as this innovative analog front-end circuit, each pixel contains comparators, logic circuits and two 15-bit counters. When the larger detector pixels are used these counters can be configured to permit multiple thresholds in a pixel providing spectroscopic information. The prototype chip has been designed and manufactured in an 8-metal 0.13 mum CMOS technology. First measurements show an electronic pixel noise of ~ 72 e-rms (Single Pixel Mode) and ~ 140 e-rms (Charge Summing Mode).