Electronic Applications Research Articles

Characterization of photophysical and electrochemical properties of a PNDT-T-DPP dye-based polymer with highly planar features and development of organic electronic applications

Characterization of photophysical and electrochemical properties of a PNDT-T-DPP dye-based polymer with highly planar features and development of organic electronic applications

A DFT-based computational study on a highly and lead-free inorganic new fluoroperovskite of Mg3PF3

Inorganic fluoroperovskite materials are increasingly important in solar technology due to their exceptional structural, optical, electronic, and mechanical properties. This study uses DFT calculations to investigate the properties of Mg3PF3 fluoroperovskite. Our results show a crystal structure and lattice parameter of (a = 4.64 Å) which align with previous theoretical and experimental findings, confirming the accuracy of our calculations. Mechanical analysis reveals that Mg3PF3 is naturally ductile, elastically anisotropic, and stable according to established criteria. The band structure and PDOS indicate that it is a semiconductor with direct bandgap of 3.88 eV at the Γ point, making it suitable for electronic applications. Electron charge density mapping suggests a predominantly ionic bonding nature. Optical property analysis shows significant dielectric constant peaks in the photon energy range favorable for solar cells. Overall, these findings position Mg3PF3 as a promising candidate for solar cell technology, highlighting its potential for enhancing renewable energy solutions.

Effects of Sn addition in W-doped Ag paste against electrochemical corrosion and sulfurization

Purpose This study aims to address these challenges by enhancing the resistance of Ag-based pastes to corrosion and sulfurization, thereby improving their performance and weatherability in high-power and high-frequency electronic applications. Design/methodology/approach This study investigates the influence of Sn doping in W-doped Ag paste to enhance resistance against electrochemical corrosion and sulfurization. A systematic examination was conducted using transient liquid phase sintering and solid–liquid inter-diffusion techniques to understand the microstructural and electrochemical properties. Findings This study found that Sn addition in W-doped Ag paste significantly improves its resistance to electrochemical corrosion and sulfurization. The sintering process at 600°C led to the formation of an Ag2WO4 phase at the grain boundaries, which, along with the presence of Sn, effectively inhibited the growth of Ag2WO4 grains. The 0.5% Sn-doped samples exhibited optimal anti-corrosion properties, demonstrating a longer grain boundary length and a passivation effect that significantly reduced the corrosion rate. No Ag2S phase was detected in the weatherability tests, confirming the enhanced durability of the doped samples. Originality/value The findings of this study highlight the potential of Sn-doped Ag-W composites as a promising material for electronic components, particularly in environments prone to sulfurization and corrosion. By improving the anti-corrosion properties and reducing the grain size, this study offers a new approach to extending the lifespan and reliability of electronic devices, making a significant contribution to the development of advanced materials for high-power and high-frequency applications.

Enhancing SrBi₂Nb₂O₉ ceramics: The role of neodymium substitution in structural, dielectric, and ferroelectric properties

This study investigates the impact of neodymium substitution for bismuth in SrBi2Nb2O9 (SBN) ceramics, a potential lead-free alternative for ferroelectric applications. X-ray diffraction analysis reveals a decrease in lattice parameters and volume with increasing Nd content. Scanning electron microscopy examines the influence of neodymium on grain morphology, showing a transition from characteristic SBN plate-like grains to a mix of plates and micro-spheres. Dielectric properties are evaluated, showing an increase in room-temperature permittivity for Nd-doped samples compared to the undoped counterparts. Additionally, the influence of Nd doping on relaxor ferroelectric behavior is studied. The Curie temperature (Tc) increases with Nd concentration, while the temperature dependence of relaxation time weakens. Ferroelectric properties exhibit significant changes due to Nd doping. Inverse permittivity versus temperature (ϵr−1 vs. T) measurements suggest an unconventional response, potentially due to lattice strain induced by the larger ionic radius of Nd. The potential influence of doping concentration on the order of the ferroelectric transition is also explored. Overall, neodymium substitution in SBN ceramics enhances their ferroelectric properties, making them promising for advanced electronic applications.

Highly conductive candle-soot-based polymer composite as a conductive ink for electronic applications

Highly conductive candle-soot-based polymer composite as a conductive ink for electronic applications

Innovative Hybrid Nanocomposites in 3D Printing for Functional Applications: A Review.

3D printing has garnered significant attention across academia and industry due to its capability to design and fabricate complex architectures. Applications such as those requiring intricate geometries or custom designs, including footwear, healthcare, energy storage, and electronics applications, greatly benefit from exploiting 3D printing processes. Despite the recent advancement of structural 3D printing, its use in functional devices remains limited, requiring the need for the development of functional materials suitable for 3D printing in device fabrication. In this review, we briefly introduce various 3D printing techniques, including material extrusion and vat polymerization, and highlight the recent advances in 3D printing for energy and biomedical devices. A summary of future perspectives in this area is also presented. By highlighting recent developments and addressing key challenges, this review aims to inspire future directions in the development of functional devices.

A Strongly Reducing sp2 Carbon‐Conjugated Covalent Organic Framework Formed by N‐Heterocyclic Carbene Dimerization

AbstractCovalent organic frameworks linked by carbon‐carbon double bonds (C=C COFs) are an emerging class of crystalline, porous, and conjugated polymeric materials with potential applications in organic electronics, photocatalysis, and energy storage. Despite the rapidly growing interest in sp2 carbon‐conjugated COFs, only a small number of closely related condensation reactions have been successfully employed for their synthesis to date. Herein, we report the first example of a C=C COF, CORN‐COF‐1 (CORN=Cornell University), prepared by N‐heterocyclic carbene (NHC) dimerization. In‐depth characterization reveals that CORN‐COF‐1 possesses a two‐dimensional layered structure and hexagonal guest‐accessible pores decorated with a high density of strongly reducing tetraazafulvalene linkages. Exposure of CORN‐COF‐1 to tetracyanoethylene (TCNE, E1/2=0.13 V and −0.87 V vs. SCE) oxidizes the COF and encapsulates the radical anion TCNE⋅− and the dianion TCNE2− as guest molecules, as confirmed by spectroscopic and magnetic analysis. Notably, the reactive TCNE⋅− radical anion, which generally dimerizes in the solid state, is uniquely stabilized within the pores of CORN‐COF‐1. Overall, our findings broaden the toolbox of reactions available for the synthesis of redox‐active C=C COFs, paving the way for the design of novel materials.

Experimental Realization of Fluoroborophene.

Borophene, an anisotropic metallic Dirac material exhibits superlative physical and chemical properties. While the lack of bandgap restricts its electronic chip applications, insufficient charge carrier density and electrochemical/catalytically active sites, restricts its energy storage and catalysis applications. Fluorination of borophene can induce bandgap and yield local electron injection within its crystallographic lattice. Herein, a facile synthesis of fluoroborophene with tunable fluorine content through potassium fluoride-assisted solvothermal-sonochemical combinatorial approach is reported. Fluoroborophene monolayers with lateral dimension 50 nm-5 µm are synthesized having controlled fluorine content (12-35%). Fluoroborophene exhibits inter-twinned crystallographic structure, with fluorination-tunable visible-range bandgap ≈1.5-2.5 eV, and density functional theory calculations also corroborate it. Fluoroborophene is explored for electrocatalytic oxygen evolution reaction in an alkaline medium and bestow a good stability. Tunable bandgap, electrophilicity and molecular anchoring capability of fluoroborophene will open opportunities for novel electronic/optoelectronic/spintronic chips, energy storage devices, and in numerous catalytic applications.

Novel insights into PLMN-13PT ceramics: impact of spark plasma sintering on compositional and dielectric properties

AbstractThis study investigates the effects of Spark Plasma Sintering (SPS) on the physical, structural, microstructural, dielectric, and optical properties of on 87[Pb(1−y)Laₓ(Mg1/3Nb2/3)O3]-13PbTiO3, (PLMN-13PT) ceramics. The primary objective was to evaluate how SPS influences the densification, grain growth, and compositional variations of these ceramics, which are critical for electronic device applications. The results demonstrate that SPS effectively achieves high relative density while suppressing grain growth, leading to a more homogeneous microstructure. However, the rapid densification process also induces compositional variations that significantly impact the dielectric properties, including the reduction of undesirable phases like pyrochlore, which are detrimental to performance. These findings highlight the potential of SPS for optimizing PLMN-13PT ceramics, enhancing their suitability for the miniaturization of multifunctional electronic devices.

MORPHOLOGICAL AND OPTICAL PROPERTIES OF ZNO NANORODS GROWN ONTO SILICON SUBSTRATES: THE IMPACT OF GROWTH TEMPERATURE

ZnO nanorods (NRs) have been successfully grown onto Silicon (Si) substrates. The properties of ZnO NRs have been characterized using field emission scanning microscopy, Photoluminescence, and X-ray diffraction. Results showed that the growth temperature (85, 90, 95, and 100oC) significantly affected the properties of ZnO NRs. At a temperature of 95oC, the structural and optical properties have been significantly enhanced, besides, well-aligned ZnO NRs have been obtained. With the rise of growth temperature from 85 to 95oC, the crystallite size increases (52 to 94 nm), and the near band edge emission to deep level emission ratio is enhanced. Besides, the aspect ratio for the prepared ZnO NRs has increased significantly reaching 19.42. This study emphasizes the significance of growth temperature in tunning the structural and microstructural and subsequently the physicochemical properties of ZnO NRs by fine control of the growth temperature. Moreover, a facile and cost-efficient method for fabricating ZnO nanorods for electronic applications based on silicon is presented in this study.

Facile Formation of Metallic Surface with Microroughness via Spray-Coating of Copper Nanoparticles for Enhanced Liquid Metal Wetting.

This paper presents a simple, fast, and cost-effective method for creating metallic microstructured surfaces by spray-coating a dispersion of copper nanoparticles (CuNPs) onto polymethyl methacrylate (PMMA) substrates, enabling the imbibition-induced wetting of liquid metal. The formation of these microstructured patterns is crucial for the spontaneous wetting of gallium-based liquid metals. Traditional techniques for producing such microstructures often involve complex and costly lithography and vacuum deposition methods. In contrast, this study demonstrates that liquid metal wetting can occur with metal microstructures formed through a straightforward spray-coating process. To immobilize the CuNPs on the polymer substrate, an organic solvent that dissolves the polymer surface was employed as the dispersion medium. The effects of various spray-coating parameters, including distance and time, on the uniformity and immobilization of CuNP films were systematically investigated. Under optimal conditions (120 s of spray time and 10 cm spray distance), CuNPs dispersed in dichloromethane (DCM) yielded uniform and stable microstructured surfaces. The spontaneous wetting of gallium-based liquid metal was observed on the fabricated CuNP film. Additionally, liquid metal selectively wet the CuNP patterns formed by stencil techniques, establishing electrical connections between electrodes. These findings underscore the potential of spray-coating for fabricating metallic surfaces to drive the formation of liquid metal patterns in flexible electronics applications.

Structural and Optical Properties of SrTiO3-Based Ceramics for Energy and Electronics Applications

A series of Sr1−xDyxTi1−yNbyO3−δ (0.05 ≤ x, y ≤ 0.10) samples were fabricated using cold compaction, followed by sintering in a (95% N2 + 5% H2) reducing atmosphere. We studied the crystal structure and optical properties of Sr1−xDyxTi1−yNbyO3−δ using X-ray diffraction (XRD) with Rietveld refinement, scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and ultraviolet−visible−near-infrared (UV−VIS−NIR) spectroscopy. The sintered Sr1−xDyxTi1−yNbyO3−δ had a tetragonal structure (I4/mcm space group). In the sintered samples, Ti ions existed as a mixture of Ti3+ and Ti4+, and Nb ions existed as a mixture of Nb4+ and Nb5+. The band-gap energies decreased with increasing Dy/Nb concentrations. The incorporation of Ti and Nb ions, the formation of both Ti3+ and Nb4+ ions, and the reduction in band-gap energies are likely highly effective for increasing the electron concentration and the corresponding electrical conductivity. Sr1−xDyxTi1−yNbyO3−δ with high electrical conductivity is suitable for energy and electronics applications.

Formula Design of Hyperbranched Polyarylether‐Based Low Dielectric Photosensitive Resin and Study of UV‐Cured Films Properties

ABSTRACTFor large‐area electronic and high shape complexity structure applications, various solution‐processable materials are chosen as dielectric layer due to their simple molding process via spin‐coating, casting, or 3D printing at room temperature. Herein, the acrylic‐ended fluorinated hyperbranched polyaryletherketone (hb‐P6FAEK‐Ace) was used as the prepolymer and then, the composition of photosensitive resin formula was regulated by adjusting the addition ratio of hb‐P6FAEK‐Ace and diluents (acrylimorpholine [ACMO] 1,6‐Hexanediol diacrylate [HDDA]). These photosensitive resin solutions showed the relative low viscosities ranged ranging from 18 to 253 mPa S at 100°C which was in favor of the future 3D printing method and printing accuracy. Then, the obtained UV‐cured films show the maximum tensile strength up to 71.9 MPa and superior thermal properties with the Tg of 157°C–177°C and T5% of 314°C–351°C. Moreover, they also exhibited the good dielectric performance with dielectric constants of 2.43–2.20 and dielectric loss of 0.013–0.014 at 1 MHz–1 GHz. These abovementioned satisfactory performance could be ascribed to the aromatic skeleton of hb‐P6FAEK‐Ace, introduced polarizability‐CF3 groups and the inner cavities for the hyperbranched structures, also the precise control of formula composition. Additionally, the curing degree, shrinkage of solid, and moisture properties were also researched thoroughly. This work provides a simple formula design though to construct the high performance and low dielectric photosensitive resin for the requirements of microelectronic applications.

Deriving 2D in-plane heterostructures in TMDC nanosheets via electron beam irradiation

2D in-plane heterostructures can enhance the electronic performance of hybrid systems, allowing for a variety of electronic device applications. However, precisely achieving uniform in-plane heterostructures with seamless interfaces at the same atomic planes remains a challenge. In this work, 2D in-plane heterostructures were successfully fabricated through electron beam irradiation-induced phase transformation in transition metal dichalcogenides (TMDCs). The transformed phases were seamlessly connected to the pristine TMDCs, forming ultraclean and atomically sharp interfaces of heterostructures. The phases were stable and determined to be novel tetragonal-like atomic structures by experimental and theoretical analyses. In situ transmission electron microscopy revealed that the phase transition involved atomic loss, lattice contraction, and then significant structural reconstruction in the pristine TMDCs. These results demonstrate that electron irradiation can efficiently achieve precise manufacturing of 2D in-plane heterostructures, offering new opportunities for the development of high-quality 2D in-plane heterostructures and novel 2D devices with high performance.

Research of Silicon and Zinc Oxide

As electronics develops, zinc becomes more and more useful and electronics producers consume more and more silicon because of it is abundant, it has a mature processing technology and it has a high carrier mobility. Those advantages made silicon perfect for integrated circuits. However, in some cases, silicon is no longer the best choice. Despite silicon’s advantages, there are problems for silicon. For example low breakdown voltage, low thermal conductivity and indirect band gap. Although silicon is still the most commonly used semiconductor, another type of semiconductor, zinc oxide starts to become more and more important in electronics. However, the two materials are used differently. This paper aims to provide the various properties of silicon and zinc oxide, and explain the reasons for their applications in electronics. The two materials are indispensable although they have a lot of disadvantages. Engineers must carefully consider the advantages and limitations of each material for specific applications to make optimal material selections.

3D printed conductive hydrogel based on silk fibroin and tetramer-grafted-polyethylenimine micelle for body-motion monitoring

Conductive hydrogels hold significant promise for applications in flexible wearable, soft robotics, implantable devices, and other fields, which offer distinct advantages due to their biomimetic structures, intrinsic properties, and biocompatibility. This study builds upon our previous research by fabricating a conductive hydrogel through the combination of 30 % Pluronic F127 and aniline tetramer-grafted-polyethyleneimine (AT-PEI) copolymers. To enhance the properties of hydrogels, we successfully engineered silk fibroin-based conductive hydrogels (SF-AD) by inducing the transition of silk fibroin from a random coil to a β-sheet structure using the F127 and AT-PEI/DNA complex (AD), endowing the hydrogels with dual ionic and electronic conductivity. The conductivity of all hydrogel exceeds 10−4 S/cm. Additionally, SEM was employed to characterize the pore size of the hydrogels, revealing a decrease with higher AD content. The swelling ratio ranged between 4.89 and 6.50, indicating the tunable nature of the hydrogels' structure. Utilizing 3D printing, we produced a 2 × 2 cm2 mesh active conductive layer that ensures a more uniform stress distribution—maximum sensitivity with a grid width of 4 mm. Our assembled hydrogel sensor demonstrated long-term stability in cycling tests over 1000 cycles and proved capable of recognizing various human movements. The SF-AD hydrogel, characterized by its unique combination of properties and potential for customization, presents broad prospects for future applications in flexible electronics.

Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface Materials.

In recent years, adhesive thermal interface materials have attracted much attention because of their reliable adhesion properties on most substrates, preventing moisture, vibration impact, or chemical corrosion damage to components and equipment, as well as solving the heat dissipation problem. However, thermal interface materials have a huge contradiction between strong adhesion and high thermal conductivity. Here, we report a polymer-based thermal interface material consisting of polydimethylsiloxane/spherical aluminum fillers, which possesses both adhesion properties (adhesion strength of 3.59 MPa and adhesion toughness of 1673 J m-2 and enhanced thermal conductivity of 3.90 W m-1 K-1). These excellent properties are attributed to the modified chain structure by introducing acrylate accelerators into the polydimethylsiloxane network, thereby striking a balance between interfacial toughness and intrinsic dissipation. The addition of thermally conductive aluminum fillers not only increases the thermal conductivity but also improves the bulk energy dissipation of the thermal interface material. This work provides a novel strategy for designing a novel thermal interface material, leading to new ideas in long-term applications in high-power electronics.

Role of sulphur in resistive switching behavior of natural rubber-based memory

The rising environmental awareness has spurred the extensive use of green materials in electronic applications, with bio-organic materials emerging as attractive alternatives to inorganic and organic materials due to their natural biocompatibility, biodegradability, and eco-friendliness. This study showcases the natural rubber based resistive switching memory devices and how varying sulphur concentrations (0 - 0.8 wt.%) in natural rubber thin films impact the resistive switching characteristics. The natural rubber was formulated and processed into a thin film deposited on an ITO substrate as the bottom electrode and with an Ag film as the top electrode. The addition of sulphur modifies the degree of crosslinking in the natural rubber thin film, from which the concentration of -C=C- group and density of defect site (S+) are affected, and hence the resistive switching behavior of the memory device. The devices exhibit bipolar resistance with symmetric switching characteristics which are attributed to the formation of conductive paths facilitate by electron transport along -C=C- and S+ defect sites between the two electrodes. Notably, a sample with 0.2 wt.% sulphur exhibits a high ON/OFF ratio (104), a large memory window (5.5 V), prolonged data retention (10 years), and reliable endurance (120 cycles). These findings highlight the potential of natural rubber as a promising material for eco-friendly resistive-switching random access memory applications.&#xD.

Programmable and flexible wood-based origami electronics

Natural polymer substrates are gaining attention as substitutes for plastic substrates in electronics, aiming to combine high performance, intricate shape deformation, and environmental sustainability. Herein, natural wood veneer is converted into a transparent wood film (TWF) substrate. The combination of 3D printing and origami technique is established to create programmable wood-based origami electronics, which exhibit superior flexibility with high tensile strength (393 MPa) due to the highly aligned cellulose fibers and the formation of numerous intermolecular hydrogen bonds between them. Moreover, the flexible TWF electronics exhibit editable multiplexed configurations and maintain stable conductivity. This is attributed to the strong adhesion between the cellulose-based ink and TWF substrate by non-covalent bonds. Benefiting from its anisotropic structure, the programmability of TWF electronics is achieved through sequentially folding into predesigned shapes. This design not only promotes environmental sustainability but also introduces its customizable shapes with potential applications in sensors, microfluidics, and wearable electronics.

Co-designing ab initio electronic structure methods on a RISC-V vector architecture

Ab initio electronic structure applications are among the most widely used in High-Performance Computing (HPC), and the eigenvalue problem is often their main computational bottleneck. This article presents our initial efforts in porting these codes to a RISC-V prototype platform leveraging a wide Vector Processing Unit (VPU). Our software tester is based on a mini-app extracted from the ELPA eigensolver library. The user-space emulator Vehave and a RISC-V vector architecture implemented on an FPGA were tested. Metrics from both systems and different vectorisation strategies were extracted, ranging from the simplest and most portable one (using autovectorisation and assisting this by fusing loops in the code) to the more complex one (using intrinsics). We observed a progressive reduction in the number of vectorised instructions, executed instructions and computing cycles with the different methodologies, which will lead to a substantial speed-up in the calculations. The obtained outcomes are crucial in advancing the porting of computational materials and molecular science codes to (post)-exascale architectures using RISC-V-based technologies fully developed within the EU. Our evaluation also provides valuable feedback for hardware designers, engineers and compiler developers, making this use case pivotal for co-design efforts.