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  • Research Article
  • 10.5104/jiep.28.614
2025 JIEP Award
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.28.i61
Instruction for Authors
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.28.511
Disaggregation and Re-Integration: Emerging Trends in Semiconductor Integration with Chiplets
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging
  • Fumihiro Inoue

  • Research Article
  • 10.5104/jiep.28.549
Green and Sustainable Semiconductor Manufacturing from the Point of View of Greenhouse Gas Emissions
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging
  • Kotaro Makino + 2 more

  • Research Article
  • 10.5104/jiep.28.612
Kurita Laboratory, Laboratory for Future Interdisciplinary Research of Science and Technology (FIRST), Institute of Science Tokyo
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging
  • Yoichiro Kurita

  • Research Article
  • 10.5104/jiep.28.p6
Embrace Change, Enjoy Evolution
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging
  • Eiji Mori

  • Research Article
  • 10.5104/jiep.28.627
学会新役員のご紹介
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.28.475
Introduction to the Special Edition
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging
  • Takahiro Matsubara

  • Research Article
  • 10.5104/jiep.28.613
JIEP Mission Fellow
  • Sep 1, 2025
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.28.c51
Contents
  • Aug 1, 2025
  • Journal of The Japan Institute of Electronics Packaging