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  • Research Article
  • 10.5104/jiep.29.44
Recent Semiconductor Research and Development in Singapore
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.c11
Contents
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.52
Research Trends of Thermal Management
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.140
News
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.130
Micro-Scale Analytical Technologies: Current Techniques and New Approaches
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging
  • Shota Nakanishi

  • Research Article
  • 10.5104/jiep.29.47
Introduction of Activities of the Embedded Passive and Active Devices (EPADs) Committee
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.68
Current Status and Approaches in Healthcare Electronics
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.73
Status of the Generative AI Implementation Technology Study Group’s Initiatives in Fiscal Year 2025
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.63
Recent Progress and Prospect of Jisso Technology for Powerelectronics
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging

  • Research Article
  • 10.5104/jiep.29.7
Recent Trends and Activities in the Circuit and Packaging Design Technical Committee
  • Jan 1, 2026
  • Journal of The Japan Institute of Electronics Packaging