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  • Research Article
  • 10.1109/tcpmt.2026.3661497
A Novel Dimensional Control Method for Coaxial Laser Packaging via Optical Path Compensation
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Cai Zhang + 5 more

  • Research Article
  • 10.1109/tcpmt.2026.3654649
A Compact Avalanche Photodiode Package with Enhanced EMI Immunity
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Yuqua Cao + 2 more

  • Research Article
  • 10.1109/tcpmt.2026.3652068
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology

  • Research Article
  • 10.1109/tcpmt.2026.3654351
Arc Cooling by an External Magnetic Field in Low Voltage dc Switching.
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Mingli Yan + 5 more

  • Research Article
  • 10.1109/tcpmt.2026.3665683
Copper-Copper Thermal Compression Bonding Scheme for Heterogeneous Wafer-scale Integration
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Krutikesh Sahoo + 4 more

  • Research Article
  • 10.1109/tcpmt.2025.3641399
Neural Networks-Based Multivariate Modeling for Coaxial Through-Glass Vias in 3-D Integration
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Suyash Sachdeva + 2 more

  • Research Article
  • 10.1109/tcpmt.2026.3667710
Crosstalk suppression method at the end of multi-conductor transmission lines based on crosstalk factor theory
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Baiqiang Yin + 4 more

  • Front Matter
  • 10.1109/tcpmt.2026.3652062
Table of Contents
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology

  • Research Article
  • 10.1109/tcpmt.2025.3605618
Thermodynamic Analysis of TCV Interconnect Structure With Recast Layers and Rough Interfaces for High-Power Device Packaging
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Xin Zou + 5 more

  • Research Article
  • 10.1109/tcpmt.2025.3574203
Characterization of Electromigration-Induced Degradation in Microbumps via On-Chip Embedded Temperature Sensors Under High Current Density
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Zhenwen Pu + 4 more