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  • Research Article
  • 10.1109/tcpmt.2026.3666902
MINNs: MNA Informed Neural Networks for Fast Transient Simulation of Nonlinear Transmission Lines Subject to Parametric Uncertainty
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Dyuti Basu + 3 more

  • Research Article
  • 10.1109/tcpmt.2026.3657822
Solenoid-type PCB-Integrated Inductors Based on Embedded Multilayer Magnetic Thin Films
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Chengle Xue + 11 more

  • Research Article
  • 10.1109/tcpmt.2026.3653162
Optimization of a Compact Manifold Heatsink in External Airflow for Power Devices using a Multi-Objective Genetic Algorithm
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Wenguang Zhao + 5 more

  • Research Article
  • 10.1109/tcpmt.2026.3666878
A Domain Decomposition Method for Transient Electro-Thermal Co-Simulation of DC IR-Drop Analysis in Integrated Interconnects
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Qi Qiang Liu + 4 more

  • Research Article
  • 10.1109/tcpmt.2026.3661437
Temperature Balancing for Reliability Enhancement of Power Electronics via Airflow Inversion Cooling
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Joshua Tompkins + 4 more

  • Research Article
  • 10.1109/tcpmt.2026.3658703
Machine Learning-Based Performance Optimization of Copper Graphene Hetero Interconnects
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Suyash Kushwaha + 4 more

  • Research Article
  • 10.1109/tcpmt.2026.3664987
An Active Tangential Electric Field Probe for Switching Noise Diagnosis in Power Modules
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Zhiqiang Yi + 10 more

  • Research Article
  • 10.1109/tcpmt.2026.3666563
Solidification Mechanisms and Microstructure of Bi alloyed Sn-Cu Solder at Low Cooling Rate
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Béla Bődi + 1 more

  • Open Access Icon
  • Research Article
  • 10.1109/tcpmt.2025.3626444
Comparison and Optimization of SLID Bonding for Die Attach on Various Substrate Types in Power Module Packaging Applications
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Shenyi Liu + 4 more

  • Research Article
  • 10.1109/tcpmt.2025.3593194
A Self-Packaged Wideband Balanced Filtering Directional Coupler
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Jin Shi + 3 more