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  • Research Article
  • 10.1109/tcpmt.2026.3670420
Improving Atomic Layer Deposition Process of Silicon Oxide (SiOâ‚‚) with single and double pulse processes
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Long Lei + 2 more

  • Research Article
  • 10.1109/tcpmt.2026.3661614
Physics-Informed Machine Learning for Lifetime Prediction of Multi-layer Ceramic Capacitors
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Tianyu Jiang + 4 more

  • Research Article
  • 10.1109/tcpmt.2025.3627170
Al/Ni Post-Heating Technique for Improving Mechanical Reliability of Sintered Ag Die-Attach Assembly
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Hiroya Saegusa + 2 more

  • Research Article
  • Cite Count Icon 2
  • 10.1109/tcpmt.2025.3569692
A Compact Dual-Band Dual-Polarized Microwave and Millimeter-Wave Highly Integrated Antenna
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Xin Geng + 5 more

  • Research Article
  • 10.1109/tcpmt.2026.3658036
A Broadband Bonding-Wire Compensation Technique Using Lowpass Filter Topology and Elliptical Slot Structure for High-Speed Differential Interconnections
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Shang Gao + 4 more

  • Research Article
  • 10.1109/tcpmt.2026.3667483
A New Asymmetric Calibration Method for Characterizing Four-component Electromagnetic Probe
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Rui-Qi Wang + 3 more

  • Research Article
  • 10.1109/tcpmt.2026.3654515
Predictive Modeling Of TCV-Cu Protrusion Under Thermal Cycling
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Heran Zhao + 5 more

  • Research Article
  • 10.1109/tcpmt.2026.3663717
Transient Modeling of Nonlinear Components using Global Gated Deep Recurrent Neural Network Masked With Dropout
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Zohreh Naghibi + 3 more

  • Research Article
  • 10.1109/tcpmt.2026.3653793
A Multiphysics Domain Decomposition Method for Transient Electro-Thermo-Mechanical Analysis
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Qi Qiang Liu + 4 more

  • Research Article
  • 10.1109/tcpmt.2025.3631836
Two-Phase Liquid Cooling of Vertically Stacked High-Power Chips With Backside-Embedded Micro-Pin Fins
  • Jan 1, 2026
  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Huicheng Feng + 4 more