Abstract

Digital Image Correlation (DIC) is a well-established, non-contact diagnostic technique used to measure shape, displacement and strain of a solid specimen subjected to loading or deformation. However, measurements using standard DIC can have significant errors or be completely infeasible in challenging experiments, such as explosive, combustion, or fluid-structure interaction applications, where beam-steering due to index of refraction variation biases measurements or where the sample is engulfed in flames or soot. To address these challenges, we propose using X-ray imaging instead of visible light imaging for stereo-DIC, since refraction of X-rays is negligible in many situations, and X-rays can penetrate occluding material. Two methods of creating an appropriate pattern for X-ray DIC are presented, both based on adding a dense material in a random speckle pattern on top of a less-dense specimen. A standard dot-calibration target is adapted for X-ray imaging, allowing the common bundle-adjustment calibration process in commercial stereo-DIC software to be used. High-quality X-ray images with sufficient signal-to-noise ratios for DIC are obtained for aluminum specimens with thickness up to 22.2 mm, with a speckle pattern thickness of only 80 μm of tantalum. The accuracy and precision of X-ray DIC measurements are verified through simultaneous optical and X-ray stereo-DIC measurements during rigid in-plane and out-of-plane translations, where errors in the X-ray DIC displacements were approximately 2–10 μm for applied displacements up to 20 mm. Finally, a vast reduction in measurement error—5–20 times reduction of displacement error and 2–3 times reduction of strain error—is demonstrated, by comparing X-ray and optical DIC when a hot plate induced a heterogeneous index of refraction field in the air between the specimen and the imaging systems. Collectively, these results show the feasibility of using X-ray-based stereo-DIC for non-contact measurements in exacting experimental conditions, where optical DIC cannot be used.

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