Abstract
Journal of Electronics ManufacturingVol. 04, No. 04, pp. 217-222 (1994) PAPERSNo AccessWire bond parameter optimization studyEDGAR VILORIAEDGAR VILORIAMotorola Electronics Pte Ltd, 10 Ang Mo Kio St. 64, Ang Mo Kio Industrial Park ,Singapore 2056, Singapore Search for more papers by this author https://doi.org/10.1142/S0960313194000237Cited by:1 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThis paper relates an improvement in the ball shear strength performance through ball bond parameter optimization technique using a combination of full factorial and response surface analysis. The 24 full factorial serves as a screening experiment to determine the most significant parameters and their best setting; the 22 response surface analysis is to study further these significant parameters in order to determine the best parameter window based on a defined target value. Bond power and bond force at +level are the significant parameters that can affect the response based on the full factorial experiment. In the second experiment, the other factors remained constant at their best setting and study was concentrated on the two significant factors. Response plots were determined and based on a target ball shear strength CpK, the optimization plot can be established. The optimization plot will guide us in the selection of the optimized parameter window; minimum and maximum parameter range can be determined. FiguresReferencesRelatedDetailsCited By 1Bondability analysis of bond pads by thermoelectric temperature measurementsA. Schneuwly, P. Gröning, L. Schlapbach and G. Müller1 Nov 1998 | Journal of Electronic Materials, Vol. 27, No. 11 Recommended Vol. 04, No. 04 Metrics History PDF download
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