Abstract
The article deals with wetting balance method comparison of solderability of the following materials combinations: two lead free solder alloys (Sn99Cu1, Sn95.5Ag3.8Cu0.7), one leaded solder alloy (Sn63Pb37), one soldering substrate type — copper wire (0.7 mm diameter) and four type of fluxes. The surface of tested samples was additionally evaluated by subjective optical analysis. The results confirm that the best results were achieved for Sn63Pb37 solder alloy — it has the fastest wetting speed (lowest zero cross time). Out of the lead free solder alloys, better results were achieved with Sn95.5Ag3.8Cu0.7 solder.
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