Wettability studies of reactive brazing alloys on CVD diamond plates

Abstract

Wettability of both the diamond and the insert surfaces by the filler metal in CVD diamond brazed-on cutting tools is a key condition for good brazing strength. The brazing process of CVD diamond thick plates still has to be improved, namely on the influence of the brazing alloy composition and of the substrate surface finishing quality in wettability. In this study, contact angle measurements were performed in a dedicated high vacuum furnace coupled with a video recording system. Diamond films with different thickness (75<t<300 μm), and thus having distinct grain sizes and roughness, were grown with fixed conditions by the MPCVD technique on Si substrates and chemically detached for wettability experiments. Roughness parameters were evaluated by profilometry and AFM, which was used to observe the grown diamond surfaces of the self-standing films. The reactive Ag–Cu–Ti brazing system was investigated. Results showed a very good wettability in the temperature range 800–850°C, namely for the diamond surface where a minimal contact angle of 10° was reached. A Ti-rich thin reaction layer (0.5–0.8 μm) was detected at the drop side of the substrate/brazing alloy interface in both substrate materials, proving the affinity of Ti to carbon. The influence of the diamond roughness on the contact angle θR is notable, obeying a linear dependence of the type cosθR=cosθ0+k cosθ0·(Ra/G)2, where Ra and G, the grain size, are related to asperity height and width, respectively. This relationship is based on the well-known Wenzel equation that correlates the real contact angle to the surface area increasing with roughness.