Abstract
We evaluated the triangular voltage sweep (TVS) method as a new technique to address the degradation mechanisms that occur in Cu/low-k interconnects. TVS measurements were performed on dedicated samples in order to systematically investigate the effects of water and Cu. We were able to resolve distinctive features characteristic of water and Cu. We demonstrate for the first time that the TVS methodology can successfully be applied to detect both water and Cu in sub-100 nm advanced Cu interconnects
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
