Abstract
Organic semiconducting polymers have opened a new paradigm for soft electronics due to their intrinsic flexibility and solution processibility. However, the contradiction between the mechanical stretchability and electronic performances restricts the implementation of high-mobility polymers with rigid molecular backbone in deformable devices. Here, we report the realization of high mobility and stretchability on curvilinear polymer microstructures fabricated by capillary-gradient assembly method. Curvilinear polymer microstructure arrays are fabricated with highly ordered molecular packing, controllable pattern, and wafer-scale homogeneity, leading to hole mobilities of 4.3 and 2.6 cm2 V−1 s−1 under zero and 100% strain, respectively. Fully stretchable field-effect transistors and logic circuits can be integrated in solution process. Long-range homogeneity is demonstrated with the narrow distribution of height, width, mobility, on-off ratio and threshold voltage across a four-inch wafer. This solution-assembly method provides a platform for wafer-scale and reproducible integration of high-performance soft electronic devices and circuits based on organic semiconductors.
Highlights
Organic semiconducting polymers have opened a new paradigm for soft electronics due to their intrinsic flexibility and solution processibility
Given that efficient trapping of liquid into microreservoirs is significant for the long-range uniformity of polymer microstructures, we carefully studied the liquid dewetting in curvilinear micropillars with different geometrical parameters by experimental observations and computational fluidic dynamics (CFD) simulations
In conclusion, high-quality stretchable curvilinear microstructures of semiconducting polymers have been realized at wafer scale by steering capillary gradient
Summary
Organic semiconducting polymers have opened a new paradigm for soft electronics due to their intrinsic flexibility and solution processibility. Curvilinear polymer microstructure arrays are fabricated with highly ordered molecular packing, controllable pattern, and wafer-scale homogeneity, leading to hole mobilities of 4.3 and 2.6 cm[2] V−1 s−1 under zero and 100% strain, respectively. Long-range homogeneity is demonstrated with the narrow distribution of height, width, mobility, on-off ratio and threshold voltage across a four-inch wafer This solution-assembly method provides a platform for wafer-scale and reproducible integration of high-performance soft electronic devices and circuits based on organic semiconductors. Semiconducting polymers with inherently low modulus and solution processability afford a competitive approach to realize scalable fabrication of flexible devices with enhanced stretchability and high integration density. Stretchability, scalability, and solution processibility simultaneously will open up access to high-performance and low-cost soft electronic devices. Waferscale uniformity is further demonstrated by a narrow distribution of height, width, mobility, on-off-ratio, and threshold voltage by careful statistics over 4000 sites on a 4-in. wafer
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